MC9S08DN32CLC - 8-Bit 40MHz 32KB Flash MCU | NXP LQFP-32
Référence : MC9S08DN32CLC ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.85 | $7,85 |
| 10 | $6.95 | $69,50 |
| 100 | $5.5 | $550,00 |
| 500 | $4.85 | $2 425,00 |
| 1 000 | $4.25 | $4 250,00 |
MC9S08DN32CLC Présentation
This device sits within the Freescale/NXP S08 microcontroller family, an 8-bit successor to the HC08 architecture. The S08 core executes the HCS08 instruction set with improved performance per MHz, embedded debugging (Background Debug Mode, BDM), and on-chip FLASH with in-application reprogramming. Microcontrollers in this category (8-bit MCU -> S08 -> HCS08 core -> Freescale/NXP embedded line) typically replace discrete logic in appliance controls, sensor interfaces, and human-machine interface modules where 32 KB of code space and moderate analog/digital peripherals are sufficient.
Key features include 40 MHz CPU speed, 32 KB (32K x 8) FLASH program memory, 1 KB (1K x 8) EEPROM for data storage, 1 KB (1K x 8) RAM, and 25 general-purpose I/O pins. Connectivity is handled by I2C, LINbus, SCI and SPI serial interfaces. On-chip peripherals include Low-Voltage Detect (LVD), Power-On Reset (POR), Pulse-Width Modulation (PWM), and a Watchdog Timer (WDT). The MCU is specified for the INDUSTRIAL temperature grade and ships in a 32-LQFP surface-mount package, with an internal bus speed adequate for sensor sampling, simple digital control loops, and LIN-slave node firmware.
From an architectural standpoint, the HCS08 core pairs a 16-bit index/Stack Pointer register set with 8-bit data paths, allowing efficient C compilation while keeping the silicon area low. The integrated FLASH controller supports byte-erase and block-erase operations, enabling in-field firmware upgrades over production LIN or SCI links. The combination of LVD, POR, and an independent WDT delivers three layers of supply/instruction-flow supervision, which is critical for safety-conscious appliances.
Typical applications include LIN nodes in automotive body and chassis subsystems, white-goods motor control boards, HVAC control panels, industrial sensor hubs, low-cost HMI displays, and battery-powered metering peripherals. Designers choose this part when the firmware footprint fits within 32 KB and the peripheral set (one SCI, one SPI, one I2C, PWM, ADC) is sufficient.
When designing with the MC9S08DN32CLC, place the decoupling capacitors within 5 mm of the VDD/VSS pairs and route the RESET pin with a short, guarded trace to avoid spurious resets. Because the part is in NXP's mature S08 line, verify current lifecycle status before committing to a new design, as some members of this family have entered NRND/EOL.
This page synthesizes distributor stock levels, current pricing, drop-in replacement candidates, and design notes drawn from the manufacturer datasheet - information not aggregated on any single distributor page.
Alternatives de remplacement direct pour MC9S08DN32CLC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08DN32CLC (même facteur de forme et même empreinte) — différant par Package, Supply Voltage, ADC, Program Memory Size, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08DN32AMLC
✅ Remplacement direct✓ En stock
$3.98 / unité
Voir la fiche technique →MC9S08DN32CLCR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08QE32CLCR
✅ Remplacement direct✓ En stock
$2.2 / unité
Voir la fiche technique →S9S08DZ32F2MLC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08DZ32AMLH
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S08DV32CLC
✅ Remplacement direct✓ En stock
$4.65 / unité
Voir la fiche technique →MC9S08DN32CLC Valeurs maximales et caractéristiques électriques
| Core Processor | S08 (HCS08) |
| Core Size | 8-Bit |
| CPU Speed | 40 MHz |
| Program Memory Size | 32 KB (32K x 8) FLASH |
| RAM Size | 1 KB |
| EEPROM Size | 1 KB (1K x 8) |
| Number of I/O | 25 |
| Connectivity | I2C, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Boîtier | 32-LQFP (7x7 mm) |
| Terminal Form | GULL WING |
| No. of Terminals | 32 |
| Package Shape | SQUARE |
| Type de montage | Surface Mount |
| Temperature Grade | INDUSTRIAL |
| Part Status | Obsolete |
Configuration des broches de MC9S08DN32CLC
| Broche 1 | PTC2 — General-purpose I/O / peripheral function |
| Broche 2 | PTC1 — General-purpose I/O / peripheral function |
| Broche 3 | PTC0 — General-purpose I/O / peripheral function |
| Broche 4 | PTB7 — General-purpose I/O |
| Broche 5 | PTB6 — General-purpose I/O |
| Broche 6 | PTB5 — General-purpose I/O |
| Broche 7 | PTB4 — General-purpose I/O |
| Broche 8 | VDD — Power supply |
| Broche 9 | VSS — Ground |
| Broche 10 | PTA7 — General-purpose I/O |
| Broche 11 | PTA6 — General-purpose I/O |
| Broche 12 | PTA5 — General-purpose I/O / BKGD / MS |
| Broche 13 | PTA4 — General-purpose I/O / RESET |
| Broche 14 | PTA3 — General-purpose I/O / EXTAL |
| Broche 15 | PTA2 — General-purpose I/O / XTAL |
| Broche 16 | PTA1 — General-purpose I/O / peripheral function |
| Broche 17 | PTA0 — General-purpose I/O / peripheral function |
| Broche 18 | PTF7 — General-purpose I/O |
| Broche 19 | PTF6 — General-purpose I/O |
| Broche 20 | PTF5 — General-purpose I/O |
| Broche 21 | PTF4 — General-purpose I/O |
| Broche 22 | PTF3 — General-purpose I/O |
| Broche 23 | PTF2 — General-purpose I/O |
| Broche 24 | PTF1 — General-purpose I/O |
| Broche 25 | PTF0 — General-purpose I/O |
| Broche 26 | PTE7 — General-purpose I/O |
| Broche 27 | PTE6 — General-purpose I/O |
| Broche 28 | PTE5 — General-purpose I/O |
| Broche 29 | PTE4 — General-purpose I/O |
| Broche 30 | VSS — Ground |
| Broche 31 | VDD — Power supply |
| Broche 32 | PTE3 — General-purpose I/O |
Applications typiques
MC9S08DN32CLC convient pour 6 applications: LIN Automotive Body Modules, White-Goods Motor Control Boards, HVAC Control Panels, Industrial Sensor Hubs, Low-Cost HMI Displays, Battery-Powered Metering Peripherals.
LIN Automotive Body Modules
The MC9S08DN32CLC's integrated LINbus peripheral and 32 KB FLASH make it a strong fit for LIN slave nodes in automotive body electronics such as mirror controllers, seat switch panels, and interior lighting drivers. The 40 MHz HCS08 core executes the LIN protocol stack and switch-debounce logic without headroom issues, while the 1 KB EEPROM retains node configuration across power cycles. Unlike higher-end automotive MCUs it adds no CAN burden, reducing cost per node. Place the part between the LIN transceiver and the load-driver transistors to keep the firmware update path routed through the SCI bootloader.
Recommandé
White-Goods Motor Control Boards
In washing-machine, dishwasher, and refrigerator boards, the MC9S08DN32CLC drives small BLDC and brushed-DC motors through its PWM peripheral while the I2C bus talks to sensor and user-interface chips. The 40 MHz speed and 25 GPIO pins handle keypad scanning, LED feedback, and triac-style phase control within the same firmware loop. Compared with a discrete 8051 design, the integrated FLASH/EEPROM/RAM cuts board area by roughly 30% and lets field firmware be updated via SPI from a service tool.
Recommandé
HVAC Control Panels
The MC9S08DN32CLC is well matched to HVAC wall-thermostat and control-panel designs that need a 32 KB firmware budget, multi-segment LCD or LED drive, and LIN/SCI connectivity to indoor and outdoor units. Its 25 GPIO lines accommodate keypad matrix, temperature-sensor I2C bus, and fan-triac control without external expanders. The industrial temperature grade supports installations in unconditioned spaces, and the LVD/POR ensures clean resets through brown-out events caused by HVAC relay switching.
Recommandé
Industrial Sensor Hubs
For industrial sensor-hub PCBs the MC9S08DN32CLC aggregates measurements from SPI ADC, I2C environmental sensors, and a 4-20 mA front end through its 25 GPIO and serial interfaces. The 32 KB FLASH easily holds a Modbus- or IO-Link-style protocol stack, while the 1 KB EEPROM stores calibration constants per channel. The 40 MHz CPU executes 100 Hz sampling loops with <10% CPU load, leaving headroom for diagnostics. Engineers favor the S08 family for sensor hubs because the BDM debug port permits in-system FLASH patching without removing the board from service.
Recommandé
Low-Cost HMI Displays
Cost-sensitive human-machine interfaces - small appliance keypads, building-access keypads, and vending-machine front panels - use the MC9S08DN32CLC to drive multiplexed LED or low-segment LCD displays while scanning up to 4x5 keypad matrices through the 25 GPIOs. The SCI port supports 9-bit addressing for legacy host protocols, and the WDT ensures the panel recovers gracefully from firmware lockups. Compared with a CPLD-based design the S08 single-chip solution cuts BOM cost by ~40% while improving firmware updateability over SPI.
Recommandé
Battery-Powered Metering Peripherals
Battery-powered water, gas, and electricity meters leverage the MC9S08DN32CLC's low-power HCS08 modes, 1 KB EEPROM for accumulating usage logs, and LIN or SCI for AMR (automatic meter reading) links. The 40 MHz core processes metrology calculations while the on-chip LVD protects the lithium battery stack from over-discharge. Its small LQFP-32 package and 25 GPIOs fit four-quadrant metering frontend circuits, and the same die is available in an automotive-grade variant for fleet EV chargers. Compared with ASIC metrology solutions it offers in-field reprogrammability to support new billing protocols.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08DN32CLC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08DN32AMLC | MC9S08QE32CLCR | S9S08DZ32F2MLC | MC9S08DZ32AMLH | MC9S08DV32CLC |
|---|---|---|---|---|---|---|
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) |
| CPU Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Program Flash | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB (DV family has larger option) |
| RAM Size | 1 KB | 1 KB | 1 KB | 2 KB | 2 KB | 1-2 KB family option |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB + CAN | 1 KB | 1 KB |
| Number of I/O | 25 | 25 | 25 | 25 | 25 | 25 |
| Connectivity | I2C, LINbus, SCI, SPI | I2C, LINbus, SCI, SPI | I2C, SCI, SPI (no LIN) | I2C, SCI, SPI, CAN | I2C, SCI, SPI, CAN | I2C, SCI, SPI (no LIN) |
| Automotive Grade | Industrial | Automotive (AEC-Q100) | Industrial | Automotive (AEC-Q100) | Automotive (AEC-Q100) | Automotive (AEC-Q100) |
Principaux différenciateurs
- Industrial temperature grade in a 7x7 mm LQFP-32 footprint (vs MC9S08QE32CLCR)
- Integrated LINbus interface for automotive body modules (vs S9S08DZ32F2MLC)
- 32 KB FLASH + 1 KB EEPROM + 1 KB RAM in a single 32-LQFP die (vs MC9S08DN32AMLC)
Notes de conception
Place a 100 nF X7R decoupling capacitor within 5 mm of each VDD/VSS pin pair on the 32-LQFP. Add a bulk 4.7 uF tantalum or ceramic capacitor near the IC to sustain LVD/POR operations through relay-driven supply dips. The S08 LVD threshold is factory-trimmed; designers should not rely solely on internal POR - verify brown-out behavior with the actual load profile.
Route the RESET line as a short trace with a 10 kohm pull-up to VDD and a 1 nF cap to ground for noise immunity. Keep the BDM (Background Debug Mode) pin accessible on the production board by exposing it as a test pad or header - field firmware upgrades typically depend on BDM access for failed-boot recovery.
Do not exceed the maximum I/O sink/source current of 10 mA per pin. The HCS08 watchdog timer must be refreshed within its timeout window or the part will reset; in low-power modes enable the periodic interrupt to wake the core and refresh the WDT. The internal oscillator must be calibrated by trimming for SCI baud-rate accuracy - factory trim is held in a non-volatile location that should not be erased during FLASH programming.
Informations de conformité
RoHS compliance inferred from lead-free LQFP package and NXP product family standards. AEC-Q100 not qualified for the CLC variant; the AMLC variant carries AEC-Q100 qualification. REACH, halogen-free, and conflict-mineral statement not present in the verified web data.