MC9S12E256VFUE - 16-Bit 25MHz HCS12 MCU, 256KB Flash, 80-QFP | NXP
Référence : MC9S12E256VFUE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.29 | $14,29 |
| 10 | $12.86 | $128,60 |
| 100 | $11.43 | $1 143,00 |
| 500 | $10 | $5 000,00 |
| 1 000 | $8.57 | $8 570,00 |
MC9S12E256VFUE Présentation
A microcontroller (MCU) is a single-chip computer integrating a CPU core, program memory, data memory, and peripherals. The HCS12 is a 16-bit CISC core used in NXP's S12 family. Within that hierarchy, the E-series sits below the XG/XS performance tiers and above the C-series cost-optimized parts. The MC9S12E256 belongs to the HCS12 microcontroller family -> 16-bit MCU -> embedded microcontroller -> semiconductor IC taxonomy.
Key features include 256 KB of Flash (256K x 8), 16 KB RAM, three SCI modules, one SPI, one IIC, three 4-channel 16-bit timer modules (TIM), a 6-channel PWM, 60 I/O lines, and an external bus interface (EBI/EMI). The 25 MHz bus clock enables deterministic control loops. Integrated peripherals reduce BOM cost in body, chassis, and industrial-control modules.
The architecture uses a 16-bit HCS12 CPU with enhanced indexed addressing and a built-in hardware multiply/divide for DSP-style operations. The 256 KB Flash supports in-application reprogramming via SCI or CAN-style bootloader, while the 16 KB RAM supports modest data buffering. The on-chip oscillator and PLL simplify BOM by removing external crystal requirements.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, industrial PLCs, sensor nodes, and consumer appliances. The 60 I/O count and PWM/ADC resources support multi-channel actuator and sensor fusion designs. Freescale/NXP's standard S12 toolchain (CodeWarrior, P&E Multilink) eases firmware development and debugging.
When designing with this part, ensure the BKGD pin is accessible for in-circuit debug and that the EBI pins are correctly configured when external memory is used. Decouple VDD/VSS pairs with 100 nF ceramic capacitors placed within 5 mm of each supply pin. The V suffix indicates an 80-pin LQFP package.
This page synthesizes distributor pricing, drop-in HCS12 family alternatives, and practical design notes not found in the manufacturer datasheet alone. Source data was retrieved from DigiKey, Mouser, NXP, and Octopart.
Alternatives de remplacement direct pour MC9S12E256VFUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12E256VFUE (même facteur de forme et même empreinte) — différant par Package, Supply Voltage, Core Processor, PWM Channels, Connectivity.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12E256CFUE
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →MC9S12E256MPVE
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →MC9S12E256CPE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12E128CFU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12E64MFU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12E256VFUE Valeurs maximales et caractéristiques électriques
| Core Processor | HCS12 |
| Core Size | 16-Bit |
| Core Speed | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| Program Memory Type | FLASH EEPROM |
| RAM Size | 16 KB (16K x 8) |
| Number of I/O | 60 |
| Connectivity | EBI/EMI, I2C, SCI, SPI |
| Peripherals | POR, PWM, WDT |
| PWM Channels | 6 |
| SCI Modules | 3 |
| SPI Modules | 1 |
| IIC Modules | 1 |
| Timer Modules | 3 x TIM (4-channel 16-bit) |
| Boîtier | 80-QFP (LQFP, 14x14 mm) |
| Type de montage | Surface Mount |
| Part Status | Obsolete / Nearing Last Time Buy |
Configuration des broches de MC9S12E256VFUE
| Broche 1 | IRQ — Interrupt request input |
| Broche 10 | VDDR — Voltage regulator supply |
| Broche 11 | VDD — Digital supply voltage |
| Broche 12 | VSS — Ground |
| Broche 13 | ECLK — E-clock output |
| Broche 14 | XCLKS — Crystal select / mode |
| Broche 15 | XTAL — Crystal oscillator pin |
| Broche 16 | EXTAL — External clock/crystal pin |
| Broche 17 | RESET — Reset input (active low) |
| Broche 18 | BKGD — Background debug mode |
| Broche 19 | PE0 — Port E bit 0 |
| Broche 2 | XIRQ — Non-maskable interrupt |
| Broche 20 | PE1 — Port E bit 1 |
| Broche 21 | PE2 — Port E bit 2 |
| Broche 22 | PE3 — Port E bit 3 |
| Broche 23 | PE4 — Port E bit 4 |
| Broche 24 | PE5 — Port E bit 5 |
| Broche 25 | PE6 — Port E bit 6 |
| Broche 26 | PE7 — Port E bit 7 |
| Broche 27 | PA0 — Port A bit 0 |
| Broche 28 | PA1 — Port A bit 1 |
| Broche 29 | PA2 — Port A bit 2 |
| Broche 3 | MODC — Mode select |
| Broche 30 | PA3 — Port A bit 3 |
| Broche 31 | PA4 — Port A bit 4 |
| Broche 32 | PA5 — Port A bit 5 |
| Broche 33 | PA6 — Port A bit 6 |
| Broche 34 | PA7 — Port A bit 7 |
| Broche 35 | PB0 — Port B bit 0 |
| Broche 36 | PB1 — Port B bit 1 |
| Broche 37 | PB2 — Port B bit 2 |
| Broche 38 | PB3 — Port B bit 3 |
| Broche 39 | PB4 — Port B bit 4 |
| Broche 4 | MODB — Mode select B |
| Broche 40 | PB5 — Port B bit 5 |
| Broche 41 | PB6 — Port B bit 6 |
| Broche 42 | PB7 — Port B bit 7 |
| Broche 43 | PC0 — Port C bit 0 |
| Broche 44 | PC1 — Port C bit 1 |
| Broche 45 | PC2 — Port C bit 2 |
| Broche 46 | PC3 — Port C bit 3 |
| Broche 47 | PC4 — Port C bit 4 |
| Broche 48 | PC5 — Port C bit 5 |
| Broche 49 | PC6 — Port C bit 6 |
| Broche 5 | MODA — Mode select A |
| Broche 50 | PC7 — Port C bit 7 |
| Broche 51 | PD0 — Port D bit 0 |
| Broche 52 | PD1 — Port D bit 1 |
| Broche 53 | PD2 — Port D bit 2 |
| Broche 54 | PD3 — Port D bit 3 |
| Broche 55 | PD4 — Port D bit 4 |
| Broche 56 | PD5 — Port D bit 5 |
| Broche 57 | PD6 — Port D bit 6 |
| Broche 58 | PD7 — Port D bit 7 |
| Broche 59 | PH0 — Port H bit 0 |
| Broche 6 | VDDX — I/O supply voltage |
| Broche 60 | PH1 — Port H bit 1 |
| Broche 61 | PH2 — Port H bit 2 |
| Broche 62 | PH3 — Port H bit 3 |
| Broche 63 | PH4 — Port H bit 4 |
| Broche 64 | PH5 — Port H bit 5 |
| Broche 65 | PH6 — Port H bit 6 |
| Broche 66 | PH7 — Port H bit 7 |
| Broche 67 | PJ0 — Port J bit 0 |
| Broche 68 | PJ1 — Port J bit 1 |
| Broche 69 | PJ2 — Port J bit 2 |
| Broche 7 | VSSX — I/O ground |
| Broche 70 | PJ3 — Port J bit 3 |
| Broche 71 | PJ4 — Port J bit 4 |
| Broche 72 | PJ5 — Port J bit 5 |
| Broche 73 | PJ6 — Port J bit 6 |
| Broche 74 | PJ7 — Port J bit 7 |
| Broche 75 | PK0 — Port K bit 0 |
| Broche 76 | PK1 — Port K bit 1 |
| Broche 77 | PK2 — Port K bit 2 |
| Broche 78 | PK3 — Port K bit 3 |
| Broche 79 | PK4 — Port K bit 4 |
| Broche 8 | VDDA — Analog supply voltage |
| Broche 80 | PK5 — Port K bit 5 |
| Broche 9 | VSSA — Analog ground |
Applications typiques
MC9S12E256VFUE convient pour 6 applications: Automotive Body Controllers, Instrument Cluster and HVAC Modules, Industrial PLC and Sensor Nodes, Consumer Appliance Control Boards, Smart Sensor and Edge Connectivity Hubs, Battery Management and Power Conversion Controllers.
Automotive Body Controllers
The MC9S12E256VFUE's 25 MHz HCS12 core, 256 KB Flash, and 60 I/O lines make it well suited to body controller modules that aggregate door, lighting, mirror, and wiper functions. The three SCI modules handle LIN/UART slaves, the SPI drives smart-power companions, and the 6-channel PWM provides direct FET drive for seat or window actuators. The wide industrial temperature grade (V suffix) supports under-hood and cabin thermal environments. The 16 KB RAM buffers diagnostic and CAN-style state data without external SRAM, lowering BOM cost compared to external-memory MCUs. Pin compatibility with the S12E family lets OEMs reuse the same PCB across vehicle variants with different Flash density.
Recommandé
Instrument Cluster and HVAC Modules
Cluster and HVAC control modules demand a real-time control loop, PWM for backlight/stepper drive, and reliable Flash for graphics/control tables. The MC9S12E256VFUE delivers deterministic 16-bit performance at 25 MHz, three 16-bit timer modules (TIM) for capture/compare, and a 6-channel PWM that drives BLDC fans and stepper motors. The 256 KB Flash holds lookup tables for PWM compensation curves, while 16 KB RAM is sufficient for menu state and PID loop variables. SCI modules link to the body network, and SPI drives graphical LCD companions. Industrial-grade temperature support covers the cabin environment where ambient can exceed 70 C near the dash.
Recommandé
Industrial PLC and Sensor Nodes
Industrial PLCs, sensor aggregation nodes, and motor-control peripherals benefit from the MC9S12E256VFUE's HCS12 16-bit performance and broad peripheral mix. The hardware multiply/divide engine accelerates PID loops executed every control cycle, while three SCI modules enable multi-drop RS-485 sensor networks. The 6-channel PWM drives brushed DC or small BLDC motors, the IIC interface talks to EEPROM or RTC companions, and SPI connects to ADC front-ends. Industrial temperature grade (-40 C to +85 C typical for the V suffix) supports factory-floor deployments. The 80-QFP package allows hand-solderable prototypes and high-volume SMT lines, easing manufacturing.
Recommandé
Consumer Appliance Control Boards
Washing machines, dishwashers, and white-goods control boards need an MCU that can drive multi-segment displays, sense water level/temperature, and switch power triacs. The MC9S12E256VFUE handles user-interface keypads via I/O interrupts, drives triac/SCR gates through its PWM channels, and uses SCI for inverter-board communication. The 256 KB Flash holds appliance firmware including safety routines and self-test diagnostics, while 16 KB RAM manages display buffers and PID setpoints. The HCS12 BDM debug port simplifies in-circuit firmware development, accelerating time-to-market for high-volume consumer products.
Recommandé
Smart Sensor and Edge Connectivity Hubs
Edge sensor hubs aggregate analog/digital sensor data and forward it over UART, SPI, or wireless links. The MC9S12E256VFUE provides three SCI modules that can drive multiple wireless modems (Wi-Fi, Bluetooth, LoRa) via UART bridges, while SPI talks to high-speed ADC front-ends and the IIC port reads environmental sensors. The 256 KB Flash fits local protocol stacks and edge-processing algorithms, and 16 KB RAM buffers batched sensor reads before transmission. The integrated EBI allows external memory expansion when larger data logs are needed, though for many edge hubs the on-chip resources are sufficient.
Recommandé
Battery Management and Power Conversion Controllers
Battery management systems (BMS) for e-mobility, UPS, and solar inverters require deterministic real-time control of switching converters and cell monitoring. The MC9S12E256VFUE's 16-bit HCS12 core runs state-of-charge algorithms at the 25 MHz bus speed, three TIM modules capture MOSFET switching edges, and 6-channel PWM drives synchronous buck/boost stages. SPI talks to daisy-chained battery monitor ICs (e.g., LTC6811-class), while SCI links to the system controller. Industrial-grade thermal tolerance handles the elevated ambient near battery packs. Pin compatibility with the S12E family eases design migration when scaling to larger battery stacks.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12E256VFUE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12E256CFUE | MC9S12E256MPVE | MC9S12E256CPE | MC9S12E128CFU | MC9S12E64MFU |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-QFP (LQFP, 14x14 mm) | 80-QFP (LQFP) - same | 80-QFP (LQFP) - same | 80-QFP (LQFP) - same | 80-QFP (LQFP) - same | 80-QFP (LQFP) - same |
| Core Processor | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit |
| Clock Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Size | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 64 KB (-75%) |
| RAM Size | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Temperature Grade | Industrial (V suffix) | Commercial (C suffix) | Industrial (M suffix variant) | Industrial (CPE suffix) | Commercial (C suffix) | Industrial (M suffix) |
| Number of I/O | 60 | 60 | 60 | 60 | 60 | 60 |
| Connectivity | EBI/EMI, I2C, SCI, SPI | EBI/EMI, I2C, SCI, SPI | EBI/EMI, I2C, SCI, SPI | EBI/EMI, I2C, SCI, SPI | EBI/EMI, I2C, SCI, SPI | EBI/EMI, I2C, SCI, SPI |
Principaux différenciateurs
- Pin-compatible upgrade path within S12E family (vs MC9S12E128CFU)
- Higher Flash density than lower-tier S12E (vs MC9S12E64MFU)
- Lower cost than XGATE-equipped S12XD (vs MC9S12XD256VAA)
- Industrial temperature grade with V suffix (vs MC9S12E256CFUE)
Notes de conception
The MC9S12E256VFUE requires decoupling on every VDD/VSS pin pair. Place 100 nF X7R ceramic capacitors within 5 mm of each supply pin, and add a 4.7 uF tantalum or 10 uF ceramic bulk capacitor at the regulator output. The on-chip voltage regulator (VDDR/VDDX) needs its own 100 nF + 4.7 uF decoupling network to suppress digital switching noise from coupling into analog sections. Estimating from the HCS12 datasheet family typicals, total supply current at 25 MHz with all peripherals active is roughly 40-60 mA; design the 5 V regulator for at least 100 mA to maintain regulation margin.
Route the EXTAL/XTAL traces as short as possible and guard them with a ground ring to minimize EMI pickup. Place the BKGD pull-up resistor (typically 4.7 kohm) close to the BKGD pin. Keep reset (RESET) trace short and away from PWM/SCI switching signals to avoid false resets. The 80-QFP package has a thermal pad beneath the die; provide a copper pour on the top layer even though the LQFP-80 pad is not exposed - this improves thermal dissipation and reduces ground bounce.
Do not leave MODC/MODB/MODA mode-select pins floating - they determine the boot mode (single-chip, expanded, special) at reset. Tie them through 10 kohm resistors to VDD or GND according to the desired mode. The BKGD pin is shared with mode-entry during reset; do not pull it low at startup unless intentionally entering BDM. When migrating from the Freescale-era datasheet to the NXP-rebranded datasheet (MC9S12E256V1.pdf), note that the silicon mask set has not changed but errata documentation has been revised - always consult the latest NXP errata sheet before finalizing firmware.
Separate analog (VDDA/VSSA) ground from digital VSS using a star-ground or split-plane topology, joining at the regulator ground pin. The EBI address/data bus lines should be length-matched within 2-3 mm if used with external memory at >8 MHz. Place the SPI bus away from PWM-driven traces; SPI edges can corrupt PWM measurements due to ground bounce. The SCI TX/RX lines should pass through a protection network (TVS + series resistor) if routed off-board to prevent ESD damage to the HCS12 I/O cells.
Informations de conformité
RoHS and REACH compliance per NXP/Freescale product documentation. The MC9S12E256 family is not AEC-Q100 qualified as a discrete part (AEC-Q100 qualification is at the OEM module level for automotive designs), but the industrial temperature grade supports automotive cabin and under-hood adjacent applications. Conflict-minerals declaration available from NXP.
