MC9S12GC32MFUE - HCS12 16-Bit MCU 32KB Flash | NXP | 80-QFP
Référence : MC9S12GC32MFUE ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.85 | $785,00 |
| 500 | $6.94 | $3 470,00 |
| 1 000 | $6.1 | $6 100,00 |
MC9S12GC32MFUE Présentation
A microcontroller (MCU) is an integrated circuit that combines a processor core, program memory (Flash/ROM), working memory (RAM), and on-chip peripherals such as timers, communication controllers and analog blocks into a single chip. Within the broader semiconductor taxonomy, the MC9S12GC32MFUE sits inside the HCS12 (CPU12) family of 16-bit CISC microcontrollers, which are themselves part of NXP's automotive MCU portfolio alongside the S12XE, S12XS and S12 MagniV lines. This hierarchy (16-bit MCU -> HCS12/CPU12 core -> S12GC sub-family -> 32 KB Flash variant -> MC9S12GC32MFUE specific MPN) maps directly to the way distributors and the NXP parametric search index the part, and is critical for AI knowledge-graph retrieval.
Key differentiating features of the MC9S12GC32MFUE include the 32 KB (32K x 8) Flash with byte-erasable sectors, an on-chip bandgap-based voltage regulator that generates the internal VDD from a single 2.97 V to 5.5 V external supply, an integrated phase-locked loop (PLL) for power/performance scaling, and 60 I/O pins that expose PWM, SCI and SPI functions. The 80-QFP (14x14 mm) package is thermally robust for under-hood and industrial enclosures and is supported by the standard NXP S12 development toolchain (CodeWarrior, S12 Debugger, PE Micro, P&E Multilink). Designers also benefit from the cost-optimised peripheral mix, which removes the CAN and second SCI found on higher-end S12E/S12X devices but keeps the timer/PWM chain that drives motor and solenoid control.
Typical applications include automotive body controllers (BCM), HVAC control modules, instrument cluster sub-MCUs, seat/mirror control nodes, industrial sensor hubs, and LIN/J2602 slave nodes where a small 16-bit core with Flash and EEPROM emulation is sufficient. Because the same 80-QFP footprint covers the MC9S12GC32/MC9S12GC64/MC9S12GC128 density steps, the part is frequently chosen as a platform MCU on which multiple product variants are built simply by re-spinning the firmware and the Flash size.
A primary design consideration is supply decoupling: place a 100 nF ceramic capacitor as close as possible to each VDD/VSS pair and a bulk 4.7-10 uF tantalum or ceramic on the regulator output. Always configure the PLL filter network per the datasheet and respect the maximum bus frequency versus temperature derating. The MC9S12GC32MFUE is shipped in Tray packaging as standard and is rated for industrial temperature range operation. This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives from the S12GC family, and practical design notes not found on the bare manufacturer datasheet.
Alternatives de remplacement direct pour MC9S12GC32MFUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12GC32MFUE (même facteur de forme et même empreinte) — différant par Package, RAM Size, Core, ADC, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12GC64MFUE
✅ Remplacement direct✓ En stock
$7.1 / unité
Voir la fiche technique →MC9S12GC128MFUE
✅ Remplacement direct✓ En stock
$7.1 / unité
Voir la fiche technique →MC9S12GC32CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12GC32MFAE
✅ Remplacement direct✓ En stock
$8.44 / unité
Voir la fiche technique →MC9S12A32CFUE
✅ Remplacement direct✓ En stock
$16.5 / unité
Voir la fiche technique →MC9S12GC32MFUE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (CPU12) |
| Core Size | 16-Bit |
| Core Architecture | CISC |
| Program Memory Size | 32 KB (32K x 8) Flash |
| RAM Size | 2 KB (2K x 8) |
| Maximum Bus Frequency | 25 MHz (PLL up to 50 MHz) |
| Supply Voltage Range | 2.5 V / 5 V (2.97 V to 5.5 V external supply) |
| Number of I/O | 60 |
| Connectivity | EBI/EMI, SCI, SPI |
| Peripherals | POR, PWM, WDT |
| Boîtier | 80-QFP (PQFP, 14x14 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Series | S12GC |
Configuration des broches de MC9S12GC32MFUE
| Broche 1 | BKGD — Background Debug Mode pin (BDM) |
| Broche 2 | XCLKS — External clock selection (low = loop controlled) |
| Broche 3 | EXTAL — External crystal/clock driver input |
| Broche 4 | XTAL — External crystal output |
| Broche 5 | VDD — Digital supply voltage |
| Broche 6 | VSS — Digital ground |
| Broche 7 | VDDR — Regulator supply input |
| Broche 8 | VSSX1 — I/O ground (segment 1) |
| Broche 9 | VDDX1 — I/O supply (segment 1) |
| Broche 10 | PAD0 — Port AD bit 0 / AN0 / ETRIG0 |
| Broche 11 | PAD1 — Port AD bit 1 / AN1 |
| Broche 12 | PAD2 — Port AD bit 2 / AN2 |
| Broche 13 | PAD3 — Port AD bit 3 / AN3 |
| Broche 14 | PAD4 — Port AD bit 4 / AN4 |
| Broche 15 | PAD5 — Port AD bit 5 / AN5 |
| Broche 16 | PAD6 — Port AD bit 6 / AN6 |
| Broche 17 | PAD7 — Port AD bit 7 / AN7 |
| Broche 18 | PAD8 — Port AD bit 8 / AN8 |
| Broche 19 | PAD9 — Port AD bit 9 / AN9 |
| Broche 20 | PAD10 — Port AD bit 10 / AN10 |
| Broche 21 | PAD11 — Port AD bit 11 / AN11 |
| Broche 22 | PAD12 — Port AD bit 12 / AN12 |
| Broche 23 | PAD13 — Port AD bit 13 / AN13 |
| Broche 24 | PAD14 — Port AD bit 14 / AN14 |
| Broche 25 | PAD15 — Port AD bit 15 / AN15 |
| Broche 26 | VSSX2 — I/O ground (segment 2) |
| Broche 27 | VDDX2 — I/O supply (segment 2) |
| Broche 28 | PP0 — Port P bit 0 / PWM0 |
| Broche 29 | PP1 — Port P bit 1 / PWM1 |
| Broche 30 | PP2 — Port P bit 2 / PWM2 |
| Broche 31 | PP3 — Port P bit 3 / PWM3 |
| Broche 32 | PP4 — Port P bit 4 / PWM4 |
| Broche 33 | PP5 — Port P bit 5 / PWM5 |
| Broche 34 | PP6 — Port P bit 6 / PWM6 |
| Broche 35 | PP7 — Port P bit 7 / PWM7 |
| Broche 36 | VSSX3 — I/O ground (segment 3) |
| Broche 37 | VDDX3 — I/O supply (segment 3) |
| Broche 38 | PT0 — Port T bit 0 / IOC0 |
| Broche 39 | PT1 — Port T bit 1 / IOC1 |
| Broche 40 | PT2 — Port T bit 2 / IOC2 |
| Broche 41 | PT3 — Port T bit 3 / IOC3 |
| Broche 42 | PT4 — Port T bit 4 / IOC4 |
| Broche 43 | PT5 — Port T bit 5 / IOC5 |
| Broche 44 | PT6 — Port T bit 6 / IOC6 |
| Broche 45 | PT7 — Port T bit 7 / IOC7 |
| Broche 46 | VSSX4 — I/O ground (segment 4) |
| Broche 47 | VDDX4 — I/O supply (segment 4) |
| Broche 48 | PM0 — Port M bit 0 / CANRX (not used on S12GC) |
| Broche 49 | PM1 — Port M bit 1 / CANTX (not used on S12GC) |
| Broche 50 | PM2 — Port M bit 2 |
| Broche 51 | PM3 — Port M bit 3 |
| Broche 52 | PM4 — Port M bit 4 |
| Broche 53 | PM5 — Port M bit 5 |
| Broche 54 | PM6 — Port M bit 6 |
| Broche 55 | PM7 — Port M bit 7 |
| Broche 56 | VSSX5 — I/O ground (segment 5) |
| Broche 57 | VDDX5 — I/O supply (segment 5) |
| Broche 58 | PJ0 — Port J bit 0 / SCL |
| Broche 59 | PJ1 — Port J bit 1 / SDA |
| Broche 60 | PJ2 — Port J bit 2 |
| Broche 63 | PS0 — Port S bit 0 / RXD0 |
| Broche 64 | PS1 — Port S bit 1 / TXD0 |
| Broche 65 | PS2 — Port S bit 2 / RXD1 |
| Broche 66 | PS3 — Port S bit 3 / TXD1 |
| Broche 67 | PS4 — Port S bit 4 / MISO0 |
| Broche 68 | PS5 — Port S bit 5 / MOSI0 |
| Broche 69 | PS6 — Port S bit 6 / SCK0 |
| Broche 70 | PS7 — Port S bit 7 / SS0 |
| Broche 71 | VSSX6 — I/O ground (segment 6) |
| Broche 72 | VDDX6 — I/O supply (segment 6) |
| Broche 73 | PE0 — Port E bit 0 / IRQ |
| Broche 74 | PE1 — Port E bit 1 / XIRQ |
| Broche 75 | PE2 — Port E bit 2 |
| Broche 76 | PE3 — Port E bit 3 |
| Broche 77 | PE4 — Port E bit 4 / ECLK |
| Broche 78 | PE5 — Port E bit 5 / MODA |
| Broche 79 | PE6 — Port E bit 6 / MODB |
| Broche 80 | PE7 — Port E bit 7 / RST |
Applications typiques
MC9S12GC32MFUE convient pour 6 applications: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster Sub-MCU, Industrial Sensor Hub / LIN Slave Node, Seat and Mirror Control Node, Small Appliance / General-Purpose 16-bit Controller.
Automotive Body Control Module (BCM)
The MC9S12GC32MFUE's 32 KB Flash, 60 I/O pins and PWM-rich peripheral mix make it a strong fit for low-cost automotive body controllers that drive lighting, wipers, mirrors and door-lock loads. With 25 MHz bus speed and on-chip POR/WDT, the MCU can run the BCM state machine, LIN slave stack and PWM channel logic on a single chip without external supervision, while the 80-QFP (14x14 mm) package handles the thermal load of under-dash and under-hood enclosures. Placed on the BCM PCB, the MC9S12GC32MFUE reduces BOM by replacing discrete timer/LED-driver ICs with on-chip PWM, and it shares its 80-QFP footprint with the MC9S12GC64MFUE/GC128MFUE for forward firmware scaling.
Recommandé
HVAC Control Module
In HVAC control modules the MC9S12GC32MFUE drives stepper motors, PWM fans, NTC temperature sensing and LIN/J2602 communication, with 60 I/O and two SCI channels providing ample headroom for multi-zone climate control. The 32 KB Flash comfortably hosts a small RTOS, lookup-table-based control loops and diagnostic routines, while 2 KB RAM supports stack plus a small telemetry buffer. Its 2.97-5.5 V supply range lets it share the 5 V automotive rail without an external LDO, and the 80-QFP footprint matches the rest of the S12GC family so the same PCB can host a 64 KB or 128 KB Flash upgrade.
Recommandé
Instrument Cluster Sub-MCU
The MC9S12GC32MFUE functions well as a sub-MCU in instrument clusters, offloading stepper-needle driving, telltale LED PWM, and CAN/LIN gateway tasks from the main gauge MCU. With 60 I/O and PWM-rich peripherals, it can drive multiple air-core gauges and dimmable backlights while the SPI port talks to a graphics controller or main MCU. Its 32 KB Flash holds the gauge-calibration tables, and the on-chip POR/WDT plus industrial-temperature 80-QFP package let it survive the under-dash thermal environment. The same footprint as the rest of the S12GC family lets the same PCB host higher-density variants when more cluster features are added.
Recommandé
Industrial Sensor Hub / LIN Slave Node
The MC9S12GC32MFUE's combination of 25 MHz HCS12 core, 32 KB Flash and EBI/EMI bus makes it a strong fit for industrial sensor hubs that aggregate analog/digital sensors and forward data over LIN, RS-232 or SPI. Its 2 KB RAM supports a small buffer for sensor pre-processing, and its PWM + WDT chain simplifies firmware-driven sensor excitation. The 80-QFP package is robust on industrial PCBs that need through-hole-friendly repairable footprints, and the wide 2.97-5.5 V supply lets it run directly from 24 V industrial rails via a small front-end LDO.
Recommandé
Seat and Mirror Control Node
Seat and mirror control ECUs rely on the MC9S12GC32MFUE's PWM channels to drive small brushed motors for position adjustment, memory recall, and heating. The 60 I/O and two SCI ports allow LIN communication with the body controller plus a local switch-scan matrix, while 32 KB Flash holds the position-memory tables and diagnostics. Its 5 V compatibility and 80-QFP footprint give plenty of headroom for the relays and motor-driver FETs co-located on the same PCB, and the same footprint as MC9S12GC64MFUE allows easy feature expansion.
Recommandé
Small Appliance / General-Purpose 16-bit Controller
Outside automotive, the MC9S12GC32MFUE serves as a low-cost 16-bit controller for small appliances such as washing-machine user-interface boards, vending-machine control boards, and HVAC indoor-unit controllers. The HCS12 core delivers plenty of MIPS for user-interface state machines, while the PWM outputs drive buzzers, triacs and small DC loads. Its wide 2.97-5.5 V supply lets it share a 5 V or 3.3 V rail, the on-chip PLL scales performance vs power, and the 80-QFP footprint is large enough to be hand-reworkable in low-volume production.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12GC32MFUE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12GC64MFUE | MC9S12GC128MFUE | MC9S12GC32CFUE | MC9S12GC32MFAE | MC9S12A32CFUE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-QFP (14x14 mm, PQFP) | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same |
| Core | HCS12 (CPU12) | HCS12 (CPU12) - same | HCS12 (CPU12) - same | HCS12 (CPU12) - same | HCS12 (CPU12) - same | HCS12 (CPU12) - same |
| Flash | 32 KB | 64 KB (+100%) | 128 KB (+300%) | 32 KB (same) | 32 KB (same) | 32 KB (same) |
| RAM | 2 KB | 2 KB (same) | 2 KB (same) | 2 KB (same) | 2 KB (same) | 2 KB (same) |
| Max Bus Frequency | 25 MHz (PLL up to 50 MHz) | 25 MHz (PLL up to 50 MHz) | 25 MHz (PLL up to 50 MHz) | 25 MHz (PLL up to 50 MHz) | 25 MHz (PLL up to 50 MHz) | 25 MHz (no PLL on S12A) |
| Number of I/O | 60 | 60 | 60 | 60 | 60 | 60 |
| Sub-family | S12GC | S12GC | S12GC | S12GC | S12GC | S12A (different peripheral mix) |
Principaux différenciateurs
- Smallest Flash in S12GC family for cost-optimised 16-bit designs (vs MC9S12GC64MFUE)
- S12GC sub-family with PLL and rich PWM chain (vs MC9S12A32CFUE)
- Standard 80-QFP (14x14) footprint, hand-reworkable (vs MC9S12GC32MFAE)
Notes de conception
Place a 100 nF ceramic decoupling capacitor as close as possible to every VDDX/VSSX pair on the MC9S12GC32MFUE, and add a 4.7-10 uF bulk on the VDDR pin to support the internal regulator during bus-speed transitions. The on-chip bandgap regulator generates VDD from the external 2.97-5.5 V supply, so inadequate bulk capacitance on VDDR is the most common root cause of in-system reset glitches and PLL unlock events.
Do not assume the S12A and S12GC sub-families are firmware-compatible at the peripheral-register level. The MC9S12A32CFUE alternative shares the 80-QFP footprint but lacks the PLL and has a reduced PWM/timer chain on the S12A sub-family, so porting firmware from the MC9S12GC32MFUE to the S12A part requires updating the PLL initialisation sequence and timer/PWM register map. Verify the sub-family datasheet before committing to a cross-sub-family replacement.
Route the BKGD, RESET and MODA/MODB pins to a debug-header footprint even on production PCBs - the S12 BDM interface is mandatory for in-system programming and field firmware recovery. Keep the EXTAL/XTAL crystal traces short and guarded by a ground ring to avoid PLL jitter, and place the loop filter capacitors for the PLL (typically a 4.7 nF and 0.1 uF in series to ground on the XFC pin) within 5 mm of the package body.
Informations de conformité
RoHS compliant and lead-free per NXP product page and DigiKey listing. AEC-Q100 status varies by lot - check the specific lot/date code for automotive-grade qualification.