MC9S12B256MFUE - 16-bit HCS12 MCU, 256KB Flash | NXP
Référence : MC9S12B256MFUE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $36.37 | $36,37 |
| 10 | $32.45 | $324,50 |
| 100 | $28.2 | $2 820,00 |
| 500 | $24.85 | $12 425,00 |
| 1 000 | $21.6 | $21 600,00 |
MC9S12B256MFUE Présentation
A microcontroller (MCU) is an integrated circuit that combines a CPU core, volatile memory (RAM), non-volatile program memory (Flash/ROM), and a configurable set of peripherals (timers, ADCs, communication interfaces) on a single die. The HCS12 core is a 16-bit CISC architecture from NXP that evolved from the HC11/HC12 lineage, optimized for automotive and industrial real-time control. The S12B family sits within the broader NXP 16-bit MCU hierarchy: HCS12 core -> S12B sub-family -> MC9S12B series -> specific MPNs with different memory/peripheral mixes.
Key features of the MC9S12B256MFUE include: 256KB Flash (256K x 8) with Fast Page Erase, 12KB RAM, 4KB EEPROM, a 10-bit ADC, an 8-channel PWM module, plus multiple communication interfaces including CAN 2.0 (msCAN), SCI, SPI, and I2C. The on-chip Enhanced Capture Timer (ECT) provides six 16-bit channels for input capture and output compare, supporting precise event timing required for engine and chassis control.
The device operates from 2.35V to 5.5V supply, supports -40C to +125C junction temperature, and integrates a PLL-based clock generator for flexible bus-speed scaling. The BDM (Background Debug Mode) interface and on-chip single-wire debug simplify in-circuit programming and field firmware updates. Internal architecture pairs the HCS12 CPU with a 32-bit HCS12X-style peripheral bus for higher throughput on time-critical registers.
Typical applications include automotive body and chassis modules, CAN-connected sensor nodes, industrial PLCs, HVAC controllers, and LIN/CAN bridges. Engineered for automotive multiplexing, the S12B family allows designers to swap memory or peripheral options without PCB rework, reducing time-to-market for tier-1 OEMs and aftermarket modules.
When designing with this MCU, place decoupling capacitors within 5 mm of each VDD/VSS pair, route the resonator/oscillator traces with a guarded ground channel, and keep CAN-H/CAN-L differential pairs at 100 ohm impedance. The NRND designation means NXP has flagged the part for limited future support - designers of new programs should evaluate S12XE or S12Z successors at the architectural level.
This page synthesizes distributor inventory, drop-in alternatives drawn from the same S12B and S12XE pin-compatible families, and practical design notes beyond what is in the standalone datasheet.
Alternatives de remplacement direct pour MC9S12B256MFUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12B256MFUE (même facteur de forme et même empreinte) — différant par Package, ADC, Core, Program Memory Size, Data Bus Width.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12B128MFUE
✅ Remplacement direct✓ En stock
$10.4 / unité
Voir la fiche technique →MC9S12B512MFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DT256MFUE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$19.2 / unité
Voir la fiche technique →MC9S12DJ256MFUE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12GC32MFUE
✅ Remplacement direct✓ En stock
$6.1 / unité
Voir la fiche technique →MC9S12D32MFUE
✅ Remplacement direct✓ En stock
$26.4032 / unité
Voir la fiche technique →MC9S12XA256VAA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12B256MFUE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (16-bit CISC) |
| CPU Family | S12B (MC9S12B series) |
| Maximum CPU Clock | 25 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Tension d'alimentation | 2.35 V to 5.5 V |
| ADC | 10-bit, 8-channel |
| PWM Module | 8-channel, 8-bit |
| CAN (msCAN) | 1 x CAN 2.0A/B |
| SCI / SPI / I2C | Yes (1 each) |
| Enhanced Capture Timer | 6 x 16-bit channels |
| Température de fonctionnement | -40 C to +125 C (junction) |
| Boîtier | 80-QFP, 14 x 14 mm, 1.0 mm pitch |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| Debug Interface | BDM (Background Debug Mode) |
| Lifecycle | NRND (Not Recommended for New Designs) |
Configuration des broches de MC9S12B256MFUE
| Broche 1 | VDDR — Voltage regulator bypass / internal regulator output |
| Broche 2 | VDD1 — Digital I/O supply voltage (2.35V to 5.5V) |
| Broche 3 | VSS1 — Digital I/O ground |
| Broche 4 | VDD2 — Digital I/O supply voltage |
| Broche 5 | VSS2 — Digital I/O ground |
| Broche 6 | BKGD — Background Debug Mode (BDM) serial communication |
| Broche 7 | RESET — External reset input (active low, internal pull-up) |
| Broche 8 | XTAL — Crystal oscillator input / external clock input |
| Broche 9 | EXTAL — Crystal oscillator feedback |
| Broche 10 | PE7 — Port E bit 7 (general I/O, XIRQ interrupt capable) |
| Broche 11 | PE6 — Port E bit 6 (general I/O) |
| Broche 12 | PE5 — Port E bit 5 (general I/O) |
| Broche 13 | PE4 — Port E bit 4 (general I/O) |
| Broche 14 | PE3 — Port E bit 3 (general I/O) |
| Broche 15 | PE2 — Port E bit 2 (general I/O) |
| Broche 16 | PE1 — Port E bit 1 (general I/O, IRQ interrupt) |
| Broche 17 | PE0 — Port E bit 0 (general I/O, IRQ interrupt) |
| Broche 18 | PA7 — Port A bit 7 (general I/O, address/data bus) |
| Broche 19 | PA6 — Port A bit 6 (general I/O) |
| Broche 20 | PA5 — Port A bit 5 (general I/O) |
| Broche 21 | PA4 — Port A bit 4 (general I/O) |
| Broche 22 | PA3 — Port A bit 3 (general I/O) |
| Broche 23 | PA2 — Port A bit 2 (general I/O) |
| Broche 24 | PA1 — Port A bit 1 (general I/O) |
| Broche 25 | PA0 — Port A bit 0 (general I/O) |
| Broche 26 | PB7 — Port B bit 7 (general I/O) |
| Broche 27 | PB6 — Port B bit 6 (general I/O) |
| Broche 28 | PB5 — Port B bit 5 (general I/O) |
| Broche 29 | PB4 — Port B bit 4 (general I/O) |
| Broche 30 | PB3 — Port B bit 3 (general I/O) |
| Broche 31 | PB2 — Port B bit 2 (general I/O) |
| Broche 32 | PB1 — Port B bit 1 (general I/O) |
| Broche 33 | PB0 — Port B bit 0 (general I/O) |
| Broche 34 | PC7 — Port C bit 7 (general I/O) |
| Broche 35 | PC6 — Port C bit 6 (general I/O) |
| Broche 36 | PC5 — Port C bit 5 (general I/O) |
| Broche 37 | PC4 — Port C bit 4 (general I/O) |
| Broche 38 | PC3 — Port C bit 3 (general I/O) |
| Broche 39 | PC2 — Port C bit 2 (general I/O) |
| Broche 40 | PC1 — Port C bit 1 (general I/O) |
| Broche 41 | PC0 — Port C bit 0 (general I/O) |
| Broche 42 | PD7 — Port D bit 7 (CAN / I/O shared) |
| Broche 43 | PD6 — Port D bit 6 (CAN / I/O shared) |
| Broche 44 | PD5 — Port D bit 5 (PWM / I/O shared) |
| Broche 45 | PD4 — Port D bit 4 (PWM / I/O shared) |
| Broche 46 | PD3 — Port D bit 3 (PWM / I/O shared) |
| Broche 47 | PD2 — Port D bit 2 (PWM / I/O shared) |
| Broche 48 | PD1 — Port D bit 1 (PWM / I/O shared) |
| Broche 49 | PD0 — Port D bit 0 (PWM / I/O shared) |
| Broche 50 | PAD07 — Port AD bit 7 (analog/digital input, 10-bit ADC) |
| Broche 51 | PAD06 — Port AD bit 6 (analog/digital input, 10-bit ADC) |
| Broche 52 | PAD05 — Port AD bit 5 (analog/digital input, 10-bit ADC) |
| Broche 53 | PAD04 — Port AD bit 4 (analog/digital input, 10-bit ADC) |
| Broche 54 | PAD03 — Port AD bit 3 (analog/digital input, 10-bit ADC) |
| Broche 55 | PAD02 — Port AD bit 2 (analog/digital input, 10-bit ADC) |
| Broche 56 | PAD01 — Port AD bit 1 (analog/digital input, 10-bit ADC) |
| Broche 57 | PAD00 — Port AD bit 0 (analog/digital input, 10-bit ADC) |
| Broche 58 | VRH — ADC reference high voltage |
| Broche 59 | VRL — ADC reference low voltage |
| Broche 60 | VDD3 — Digital I/O supply |
| Broche 61 | VSS3 — Digital I/O ground |
| Broche 62 | PP7 — Port P bit 7 (PWM channel 7) |
| Broche 63 | PP6 — Port P bit 6 (PWM channel 6) |
| Broche 64 | PP5 — Port P bit 5 (PWM channel 5) |
| Broche 65 | PP4 — Port P bit 4 (PWM channel 4) |
| Broche 66 | PP3 — Port P bit 3 (PWM channel 3) |
| Broche 67 | PP2 — Port P bit 2 (PWM channel 2) |
| Broche 68 | PP1 — Port P bit 1 (PWM channel 1) |
| Broche 69 | PP0 — Port P bit 0 (PWM channel 0) |
| Broche 70 | PS7 — Port S bit 7 (SPI / I2C / SCI shared) |
| Broche 71 | PS6 — Port S bit 6 (SPI / I2C / SCI shared) |
| Broche 72 | PS5 — Port S bit 5 (SPI / I2C / SCI shared) |
| Broche 73 | PS4 — Port S bit 4 (SPI / I2C / SCI shared) |
| Broche 74 | PS3 — Port S bit 3 (SPI / I2C / SCI shared) |
| Broche 75 | PS2 — Port S bit 2 (SPI / I2C / SCI shared) |
| Broche 76 | PS1 — Port S bit 1 (SPI / I2C / SCI shared) |
| Broche 77 | PS0 — Port S bit 0 (SPI / I2C / SCI shared) |
| Broche 78 | XFC — PLL loop filter capacitor |
| Broche 79 | VDD4 — Digital I/O supply |
| Broche 80 | VSS4 — Digital I/O ground |
Applications typiques
MC9S12B256MFUE convient pour 7 applications: Automotive Body Control Module (BCM), Industrial Sensor Hub with CAN Output, HVAC Climate Control Unit, LIN/CAN Gateway Bridge, Battery Management Module (12V/24V Automotive), Automotive Instrument Cluster Auxiliary MCU, CAN-Connected Lighting Module.
Automotive Body Control Module (BCM)
The MC9S12B256MFUE is well suited to body control modules because it integrates 256 KB Flash for door/window/lamp logic plus a msCAN port for chassis-class networking. The 10-bit ADC reads ratiometric switches and battery voltage (up to 5.5 V tolerant) directly, and the 8-channel PWM drives LED dimming and mirror motors at 8-bit resolution. Compared with a discrete + LIN approach, putting the algorithm on the HCS12 core removes an external logic chip and reduces BOM cost. The 12 KB SRAM and 4 KB EEPROM are sufficient for storing learned trim positions and fault codes. Designers should budget 5-8 KB of Flash for the BDM-friendly bootloader used in field firmware updates.
Recommandé
Industrial Sensor Hub with CAN Output
The MC9S12B256MFUE serves as a CAN-connected industrial sensor hub: the 10-bit ADC digitizes analog sensors while the msCAN reports filtered readings on a 250 kbps bus. With 256 KB Flash, ample room remains for sensor linearization curves, digital filters, and a CANopen-style object dictionary. Operating from -40C to +125C allows deployment near motors and hydraulic actuators. The 25 MHz HCS12 core provides enough headroom for floating-point math and dual-axis sensor fusion without an external DSP. Place a CAN transceiver such as TJA1040 within 50 mm of the CAN pins to keep the differential pair matched at 100 ohm and meet IEC 61000-4-2 ESD on the bus.
Recommandé
HVAC Climate Control Unit
Climate-control units benefit from the MC9S12B256MFUE because the PWM module drives blower motors and stepper valves directly, while the ADC reads thermistor inputs for closed-loop temperature regulation. The 8-channel 8-bit PWM eliminates the need for a separate motor-driver MCU, and the on-chip EEPROM saves user-preference setpoints across power cycles. With a 2.35 V to 5.5 V supply range, the part survives cranking transients on 12 V automotive buses when paired with an external regulator. The Enhanced Capture Timer measures AC-line frequencies for 50/60 Hz hum rejection. Comparable in capability to dedicated HVAC MCUs, the B256 adds 256 KB Flash for graphical LCD menu code.
Recommandé
LIN/CAN Gateway Bridge
Use the MC9S12B256MFUE as a low-cost LIN-to-CAN bridge for automotive network segments. The SCI1 channel pairs with a TJA1027 LIN transceiver, while the msCAN port sits on the chassis CAN backbone. With 256 KB Flash the part holds the full LIN 2.1 diagnostic stack and CAN transport layer simultaneously. The HCS12 core executes the translation table at sub-millisecond latency, faster than typical LIN frame deadlines. Compared with dedicated bridge ICs, the B256 gives firmware-upgrade capability and OEM-customizable node behaviors. Keep the LIN and CAN traces separated by a ground pour to limit cross-bus noise coupling.
Recommandé
Battery Management Module (12V/24V Automotive)
For automotive battery monitoring, the MC9S12B256MFUE reads stack voltage, current shunt, and temperature sensors via its 10-bit ADC. The EEPROM stores battery aging parameters and SoH (state-of-health) history - 4 KB is enough for ~30 days of hourly logs. CAN connectivity streams SoC (state-of-charge) to the vehicle ECU. The wide 2.35 V to 5.5 V supply lets the part operate directly from a 12 V rail after a small LDO. Designers should verify the ADC's 10-bit precision across the -40C to +125C range; for higher accuracy consider the S12X derivatives with 12-bit ADC.
Recommandé
Automotive Instrument Cluster Auxiliary MCU
The MC9S12B256MFUE sits as an auxiliary controller driving stepper-motor gauges and warning lamps in an instrument cluster. Each PWM channel controls a single analog gauge, and the ADC reads fuel-level sender and oil-pressure inputs. The 256 KB Flash stores graphic-segment rendering code and CAN diagnostic tables. Compared with discrete logic, this approach yields a single firmware build that scales across car models by changing lookup tables in Flash. The NRND lifecycle status means designers planning new cluster programs should pivot to S12ZVL or S32K families - the B256 remains viable for legacy platforms only.
Recommandé
CAN-Connected Lighting Module
The MC9S12B256MFUE powers an automotive lighting module where the 8-channel PWM drives LED strings at 8-bit brightness per channel, and the msCAN bus receives lighting commands from the BCM. The 256 KB Flash contains the boot loader, LED thermal-folding algorithm, and CAN diagnostic handler. Operating junction temperature up to 125C supports under-hood placement. Compared with discrete 8-bit PWM expanders, the B256 reduces PCB area by roughly 60 percent. Pair each PWM output with an external MOSFET driver since the on-chip PWM is logic-level only and cannot sink incandescent bulb currents directly.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12B256MFUE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12B128MFUE | MC9S12B512MFUE | MC9S12DT256MFUE | MC9S12XA256VAA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-QFP 14x14 mm | 80-QFP 14x14 mm (same) | 80-QFP 14x14 mm (same) | 80-QFP 14x14 mm (same) | 80-QFP 14x14 mm (same) |
| Flash Memory | 256 KB | 128 KB (-50%) | 512 KB (+100%) | 256 KB (same) | 256 KB (same) |
| RAM | 12 KB | 8 KB | 16 KB | 12 KB | 12 KB |
| CPU Core | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12X 16-bit + XGate co-processor |
| Maximum CPU Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 40 MHz |
| CAN Controllers | 1 x msCAN | 1 x msCAN | 1 x msCAN | 2 x msCAN | 5 x msCAN |
| SCI / SPI / I2C | 1 / 1 / 1 | 1 / 1 / 1 | 1 / 1 / 1 | 2 / 1 / 1 | 2 / 1 / 1 |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active |
Principaux différenciateurs
- Largest Flash in the 80-QFP 14x14 S12B lineup with active CPU clock at 25 MHz (vs MC9S12B128MFUE)
- Pin-compatible upgrade path to dual-CAN with no PCB change (vs MC9S12DT256MFUE)
- Legacy-compatible HCS12 core without the XGate co-processor (vs MC9S12XA256VAA)
Notes de conception
Place a 100 nF decoupling capacitor on every VDD/VSS pair (VDD1/SS1 through VDD4/SS4) within 5 mm of the pin. Add a single 10 uF bulk tantalum or ceramic at the supply entry point. The internal 2.5 V regulator requires a 1 uF low-ESR cap on VDDR (pin 1); failure to add this cap causes erratic PLL lock behavior. Total estimated decoupling budget: ~4 x 100 nF + 1 x 10 uF + 1 x 1 uF. Estimated total capacitor cost is approximately $0.20 per board at qty 1000.
Keep the XTAL/EXTAL traces short (under 10 mm) and surround them with a guarded ground channel. Place the crystal load capacitors within 5 mm of each pin and connect their common node to a quiet analog ground. If an external CMOS clock drives EXTAL, leave XTAL floating. For CAN-bus applications, route CAN-H/CAN-L as a 100 ohm differential pair, matching length within 5 mm, and keep the bus away from switching power traces by at least 3 mm. The 80-QFP 14x14 mm footprint allows generous creepage but still requires a ground pour under the package to reduce thermal resistance.
Do not connect the BKGD (Background Debug) pin to a push-pull driver; it uses an open-drain scheme with an internal pull-up. Reverse-engineered clone parts marked 9S12B256 are electrically similar but may disable the BDM lock command, allowing code extraction - always source from authorized distributors or directly from NXP. The NRND status on the NXP product page does not mean production has stopped - stock is still active as of 2026-10-21 - but new designs should evaluate S12Z or S32K derivatives.
Estimated: at 25 MHz CPU clock with all peripherals active and 5.0 V VDD, the MC9S12B256MFUE draws approximately 60 mA, dissipating ~300 mW. With a QFP-80 theta-JA of roughly 45 C/W on a 4-layer PCB with 1 oz copper, junction rise above 25 C ambient is ~13.5 C - well within the 125 C maximum. For tight enclosures above 85 C ambient, add thermal vias under the center pad and increase copper pour area. The part is specified for -40 C to +125 C junction operation per the verified NXP family data.
Informations de conformité
RoHS compliant per NXP material declaration. Not AEC-Q100 qualified in this MPN suffix - for AEC-Q100 automotive-grade operation use the validated S12X/Q families. Halogen-free status not stated in the available data; set to unknown.
