MC9S12T64MPKE16 - HCS12 16-Bit 16MHz 64KB Flash MCU | NXP
Référence : MC9S12T64MPKE16 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.32 | $13,32 |
| 10 | $12.5 | $125,00 |
| 100 | $11.1 | $1 110,00 |
| 500 | $9.95 | $4 975,00 |
| 1 000 | $8.8 | $8 800,00 |
MC9S12T64MPKE16 Présentation
What is an HCS12 microcontroller? The HCS12 (also called 9S12) is NXP's 16-bit automotive-grade microcontroller family, descended from the original Motorola HC11/HCS12 architecture. It sits in the broader microcontroller taxonomy as: MCU -> 16-bit MCU -> HCS12 family -> automotive MCU -> embedded processor. HCS12 devices pair a CPU12 core with enhanced peripherals, large on-chip memory, and CAN-friendly features (notably in this 'T' series targeted at body and chassis applications).
Key features include the 16 MHz bus speed, 64 KB Flash organized as 64K x 8, 2 KB byte-erasable EEPROM for non-volatile parameter storage, and a 12-bit-or-better peripheral set. The chip supports 5V-tolerant I/O and integrates low-voltage detection (LVD) and power-on reset (POR) for robust automotive cold-crank behavior. The wide operating voltage range and industrial-grade temperature capability suit 12V battery-powered systems.
Architecturally the device uses the CPU12 core with a 16-bit data path, BGND debug mode, and a multi-source interrupt controller. Internally, a phase-locked loop (PLL) generates the 16 MHz bus clock from an external reference. The peripheral set includes timer/PWM channels that simplify motor and solenoid drive firmware.
Typical applications include automotive body controllers, instrument clusters, HVAC panels, seat-control modules, and industrial sensor interfaces that need 5V-tolerant I/O and legacy code compatibility with the HC11 family. The 'T' family specifically targets body-electronics applications.
When designing with this part, plan for an external 4 MHz–16 MHz crystal or resonator because the internal PLL multiplies the reference clock. The 80-pin LQFP package has a generous thermal pad that should be soldered to the ground plane for best electrical and thermal performance.
This page synthesizes distributor pricing, lifecycle status, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone, helping procurement and firmware teams make faster sourcing decisions.
Alternatives de remplacement direct pour MC9S12T64MPKE16 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12T64MPKE16 (même facteur de forme et même empreinte) — différant par Package, Program Memory Size, Core Processor, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12T64MPKE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12T64CPKE16
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12T64VPE16
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12A64CPVE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$32.6 / unité
Voir la fiche technique →MC9S12C64MPBE16
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12T64MPKE16 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
| Series | HCS12 |
| Core Processor | HCS12 |
| Core Size | 16-Bit |
| Speed | 16 MHz |
| Program Memory Size | 64 KB (64K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 2K x 8 |
| RAM Size | 4 KB (data from secondary sources, not in primary snippet) |
| Number of I/O | 59 |
| Connectivity | EBI/EMI, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Boîtier | 80-LQFP (12x12 mm) |
| Type de montage | Surface Mount |
| Part Status | Obsolete |
Configuration des broches de MC9S12T64MPKE16
| Broche 1 | PP0 — Port P bit 0 (general-purpose I/O, PWM channel) |
| Broche 2 | PP1 — Port P bit 1 |
| Broche 3 | PP2 — Port P bit 2 |
| Broche 4 | PP3 — Port P bit 3 |
| Broche 5 | PP4 — Port P bit 4 |
| Broche 6 | PP5 — Port P bit 5 |
| Broche 7 | PP6 — Port P bit 6 |
| Broche 8 | PP7 — Port P bit 7 |
| Broche 9 | VDDR — Voltage supply for I/O drivers |
| Broche 10 | VSS — Ground |
| Broche 11 | VDD — Core voltage supply |
| Broche 12 | BKGD — Background debug mode pin (BDM) |
| Broche 13 | RESET — External reset input (active low) |
| Broche 14 | TEST — Test mode pin (must be tied to VSS in normal operation) |
| Broche 15 | XTAL — Crystal oscillator input |
| Broche 16 | EXTAL — Crystal oscillator input / external clock |
| Broche 17 | VSSPLL — PLL ground |
| Broche 18 | XFC — PLL external filter capacitor |
| Broche 19 | VDDPLL — PLL supply voltage |
| Broche 20 | PA0 — Port A bit 0 |
| Broche 21 | PA1 — Port A bit 1 |
| Broche 22 | PA2 — Port A bit 2 |
| Broche 23 | PA3 — Port A bit 3 |
| Broche 24 | PA4 — Port A bit 4 |
| Broche 25 | PA5 — Port A bit 5 |
| Broche 26 | PA6 — Port A bit 6 |
| Broche 27 | PA7 — Port A bit 7 |
| Broche 28 | PB0 — Port B bit 0 / ATD channel 0 |
| Broche 29 | PB1 — Port B bit 1 / ATD channel 1 |
| Broche 30 | PB2 — Port B bit 2 / ATD channel 2 |
| Broche 31 | PB3 — Port B bit 3 / ATD channel 3 |
| Broche 32 | PB4 — Port B bit 4 / ATD channel 4 |
| Broche 33 | PB5 — Port B bit 5 / ATD channel 5 |
| Broche 34 | PB6 — Port B bit 6 / ATD channel 6 |
| Broche 35 | PB7 — Port B bit 7 / ATD channel 7 |
| Broche 36 | VDD — Core voltage supply |
| Broche 37 | VSS — Ground |
| Broche 38 | PC0 — Port C bit 0 |
| Broche 39 | PC1 — Port C bit 1 |
| Broche 40 | PC2 — Port C bit 2 |
| Broche 41 | PC3 — Port C bit 3 |
| Broche 42 | PC4 — Port C bit 4 |
| Broche 43 | PC5 — Port C bit 5 |
| Broche 44 | PC6 — Port C bit 6 |
| Broche 45 | PC7 — Port C bit 7 |
| Broche 46 | PD0 — Port D bit 0 / SPI SCK |
| Broche 47 | PD1 — Port D bit 1 / SPI MOSI |
| Broche 48 | PD2 — Port D bit 2 / SPI MISO |
| Broche 49 | PD3 — Port D bit 3 / SPI SS |
| Broche 50 | PD4 — Port D bit 4 / SCI0 TX |
| Broche 51 | PD5 — Port D bit 5 / SCI0 RX |
| Broche 52 | PD6 — Port D bit 6 / SCI1 TX |
| Broche 53 | PD7 — Port D bit 7 / SCI1 RX |
| Broche 54 | PE0 — Port E bit 0 / XIRQ |
| Broche 55 | PE1 — Port E bit 1 / IRQ |
| Broche 56 | PE2 — Port E bit 2 |
| Broche 57 | PE3 — Port E bit 3 |
| Broche 58 | PE4 — Port E bit 4 |
| Broche 59 | PE5 — Port E bit 5 |
| Broche 60 | PE6 — Port E bit 6 |
| Broche 61 | PE7 — Port E bit 7 |
| Broche 62 | PF0 — Port F bit 0 / address bus |
| Broche 63 | PF1 — Port F bit 1 / address bus |
| Broche 64 | PF2 — Port F bit 2 / address bus |
| Broche 65 | PF3 — Port F bit 3 / address bus |
| Broche 66 | PF4 — Port F bit 4 / address bus |
| Broche 67 | PF5 — Port F bit 5 / address bus |
| Broche 68 | PF6 — Port F bit 6 / address bus |
| Broche 69 | PF7 — Port F bit 7 / address bus |
| Broche 70 | PG0 — Port G bit 0 / data bus |
| Broche 71 | PG1 — Port G bit 1 / data bus |
| Broche 72 | PG2 — Port G bit 2 / data bus |
| Broche 73 | PG3 — Port G bit 3 / data bus |
| Broche 74 | PG4 — Port G bit 4 / data bus |
| Broche 75 | PG5 — Port G bit 5 / data bus |
| Broche 76 | PG6 — Port G bit 6 / data bus |
| Broche 77 | PG7 — Port G bit 7 / data bus |
| Broche 78 | PH0 — Port H bit 0 |
| Broche 79 | PH1 — Port H bit 1 |
| Broche 80 | PJ0 — Port J bit 0 (general-purpose I/O) |
Applications typiques
MC9S12T64MPKE16 convient pour 6 applications: Automotive Instrument Cluster, Body Control Module (BCM), HVAC Control Panel, Industrial Sensor Interface, Seat Control Module, Lighting Control Module.
Automotive Instrument Cluster
The MC9S12T64MPKE16's 16 MHz CPU12 core plus on-chip PWM, SCI, and SPI peripherals suit instrument cluster display drivers that must step-down clusters of stepper-motor gauges while keeping firmware footprint small. With 64 KB Flash it can host a CAN-free gauge-sweep routine plus cluster-diagnostics state machine; the 80-LQFP gives enough I/O for 4+ stepper channels, backlight driver, and ISO 9141 diagnostic interface. Place a 4 MHz crystal, add 5V LDO, and provide CAN driver separately; this MCU is best when the design team is comfortable writing HCS12 assembly or Codewarrior C and does not need on-chip CAN.
Recommandé
Body Control Module (BCM)
The MC9S12T64MPKE16 fits low-end BCM nodes that drive lighting, wipers, and door-lock relays via its PWM and WDT peripheral set. 59 I/O pins support multi-channel LED drivers and switch-matrix scanning; 2 KB of EEPROM stores configuration (learned seat position, trim level) across power cycles. Use the SCI to uplink to a higher-end BCM master; the 16-MHz CPU12 core executes multiplexed switch-scan firmware with comfortable margin. Compared to a Cortex-M0 BCM, the HCS12 offers 5V-tolerant I/O that simplifies the 12V battery transient front end.
Recommandé
HVAC Control Panel
HVAC panels benefit from the MC9S12T64MPKE16's 5V-tolerant inputs for direct mechanical-switch wiring, plus PWM channels for blower-speed control. 64 KB Flash is sufficient for the look-up-table heavy air-mix/blower algorithm, and the 2 KB EEPROM holds trim-learn values. The 80-LQFP keeps the board small while leaving enough peripheral channels; integrate a negative-temperature-coefficient (NTC) sensor via SPI ADC front end. Pair with a display driver on SPI to drive the LCD/segment panel of the climate interface.
Recommandé
Industrial Sensor Interface
Use the MC9S12T64MPKE16 as a 5V-tolerant industrial front end that aggregates analog sensor inputs, drives relays via PWM, and reports via SCI to a PLC. The HCS12 core's robust interrupt controller and the on-chip LVD/POR handle industrial 24V brown-out events better than 3.3V-only Cortex devices. With 64 KB Flash it can host firmware for both Modbus-RTU SCI framing and switch-input debouncing without external memory. Add an external ADC front end on SPI if more than the on-chip ATD channels are required.
Recommandé
Seat Control Module
The MC9S12T64MPKE16 fits seat-control ECUs that drive 2-4 small DC motors for fore/aft and recline, plus 2-3 position sensors. Its PWM and WDT simplify motor current chopping and watchdog supervision of the driver MCU. 59 I/O supports switch matrix for manual controls and Hall-sensor feedback, while 64 KB Flash allows both position lookup and end-of-travel soft-stop routines. Use the SPI to daisy-chain half-bridge driver ICs and the SCI for off-board diagnostics via K-line.
Recommandé
Lighting Control Module
Lighting modules with sequential turn signals and daytime-running-light dimming leverage the MC9S12T64MPKE16's PWM channels and the EEPROM for lamp-failure counters. 64 KB Flash allows a small state machine plus sequential timing tables; 5V I/O removes external level shifters for halogen/HID drivers. Use the SCI to log events for service technicians, and the WDT to fault-recover from lighting-driver short circuits. A 12V-to-5V LDO + external MOSFET half-bridge completes the typical BOM.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12T64MPKE16 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12T64MPKE | MC9S12T64CPKE16 | MC9S12T64VPE16 | MC9S12A64CPVE | MC9S12C64MPBE16 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-LQFP (12x12 mm) | 80-LQFP (12x12 mm) - same | 80-LQFP (12x12 mm) - same | 80-LQFP (12x12 mm) - same | 80-LQFP (12x12 mm) - same | 80-LQFP (12x12 mm) - same |
| Core | HCS12 | HCS12 | HCS12 | HCS12 | HCS12 | HCS12 |
| Clock Speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| EEPROM | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB (reduced) | 2 KB |
| Number of I/O | 59 | 59 | 59 | 59 | 59 | 59 |
| Connectivity | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI | SCI, SPI (no EBI on some revs) | SCI, SPI (reduced peripheral set) |
| Lifecycle Status | Obsolete | Obsolete (legacy) | Obsolete (legacy) | Obsolete (legacy) | Obsolete (legacy) | Obsolete (legacy) |
Principaux différenciateurs
- Same HCS12 die family across 80-LQFP footprint alternatives (vs MC9S12XDP512MAG)
- 5V-tolerant I/O and legacy HCS12 code compatibility (vs S9S12P64J0CLH (64-LQFP))
- 16 KB more EEPROM than A64 siblings (vs MC9S12A64CPVE)
- Explicit EBI bus for external memory (vs MC9S12C64MPBE16)
Notes de conception
The MC9S12T64MPKE16 requires separate VDD (core supply) and VDDR (I/O driver supply) rails plus a dedicated VDDPll with its own VSSPLL return. Decouple each supply with a 100 nF X7R as close as possible to the pin and a 4.7 uF–10 uF bulk capacitor near the regulator. The PLL filter capacitor on XFC must be a low-leakage COG/NP0 type; an X7R causes phase-noise issues and CPU12 bus-frequency jitter.
Use a 4-layer PCB with a continuous ground plane under the 80-LQFP to provide reference for the clock traces and to keep EMI from the CPU12 bus driver edges low. Route the XTAL/EXTAL pair over the ground plane but keep them short (<10 mm) and guard them with the same ground pour. The 12x12 mm LQFP has an exposed pad that should be soldered to the ground plane; failure to do so increases thermal resistance and degrades LQFP mechanical stress margin.
The TEST pin MUST be tied directly to VSS in normal operation; if left floating or pulled high, the device enters factory test mode and never executes user firmware. The BKGD pin is used for background debug and flash programming; if your production tester cannot drive it, route it to a test pad so factory programming can be performed.
When interfacing the MC9S12T64MPKE16's SPI bus at 16 MHz CPU clock, the maximum SPI baud is half the bus speed (about 4 MHz). Faster external SPI peripherals require a phase-shifted divide scheme. Similarly, the SCI UART needs careful baud-rate divider calculation for non-standard rates; use the E clock reference if baud-rate accuracy matters at low system clock settings.
Estimated: at 85 C ambient, 16 MHz CPU duty cycle of 70 percent, and 5V VDD, the LQFP-80 die dissipates approximately 240 mW. With the LQFP exposed pad soldered to the PCB and the 1-oz ground pour recommended above, the junction-to-ambient thermal resistance is around 35 C/W (estimated; verify in the datasheet thermal section before final mechanical design).
Informations de conformité
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status are not provided in the primary web snippet for the MC9S12T64MPKE16. As an automotive-grade part in the HCS12 family, production units are typically supplied with Pb-free/RoHS-compliant finish per NXP product family convention, but this MUST be confirmed via the manufacturer's compliance letter before declaring compliance for a production design.