NXP Semiconductors

MC9S12XS128MAE - 16-bit 128KB Flash HCS12X MCU 64-LQFP | NXP (Tape & Reel)

Référence : MC9S12XS128MAE ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
5 V Vdss 64-LQFP (10x10 mm) Package 40 MHz Speed 128KB (128K x 8) FLASH Memory
À partir de $16.4122 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-19
Tarifs dégressifs
Qté Prix unitaire Total
1 $16.4122 $16,41
ℹ️ Tous les prix sont en USD

MC9S12XS128MAE Présentation

The NXP MC9S12XS128MAE is a 16-bit HCS12X CISC microcontroller with 128KB Flash, 40MHz CPU speed, integrated CANbus/SCI/SPI connectivity, and a 64-pin LQFP (10x10 mm) package designed for cost-sensitive automotive body electronics. It is part of the S12XS family, optimized for scalable automotive platforms requiring hardware and software reusability across vehicle electronics.

An HCS12X microcontroller is a 16-bit CISC (Complex Instruction Set Computer) MCU built around Freescale/NXP's enhanced HCS12 architecture with XGATE co-processor extensions. It belongs to the broader category of automotive-grade microcontrollers (MCUs), sitting hierarchically below embedded controllers and above general-purpose 8/32-bit MCUs in the automotive ECU design stack. The S12XS family specifically targets body electronics modules where moderate performance, peripheral integration, and AEC-Q100 reliability are required without the cost of 32-bit Cortex-M parts.

Key features include 128KB Flash program memory, 8KB EEPROM, 8KB RAM, 44 I/O pins, and integrated peripherals such as LVD (Low-Voltage Detect), POR (Power-On Reset), PWM (Pulse Width Modulation) channels, and a Watchdog Timer. The device operates from a 5V supply and supports industrial temperature grade, making it suitable for under-hood and cabin automotive environments. The HCS12X core with XGATE delivers efficient peripheral event handling and deterministic interrupt response for real-time body control tasks.

Architecture-wise, the HCS12X uses a 16-bit data path with enhanced addressing modes, a hardware multiplier, and an XGATE peripheral co-processor for offloading interrupt-driven tasks. The integrated CANbus module supports CAN 2.0A/B protocols required for automotive networking, while SCI (Serial Communication Interface) and SPI enable additional in-vehicle and inter-IC communication. The 64-LQFP package (10x10 mm body) provides ample pin-out for the 44 I/O plus dedicated supply, oscillator, and debug pins.

Typical applications include automotive body control modules (BCMs) for door/window/lighting control, instrument cluster driver modules, HVAC controllers, and gateway modules bridging CAN and LIN networks. The combination of CAN, SCI, and SPI makes the S12XS suitable for body domain controllers in mid-tier vehicles and commercial fleet telematics.

When designing with this device, ensure the BDM (Background Debug Mode) interface is accessible for in-circuit programming and debug. The device requires a stable 5V supply; place decoupling capacitors (100nF plus bulk) close to VDD pins. Pay attention to oscillator pin loading and follow NXP EMC guidelines for in-vehicle PCB layout.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for engineers evaluating the MC9S12XS128MAE for automotive body electronics applications.

Alternatives de remplacement direct pour MC9S12XS128MAE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S12XS128MAE (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, ADC, Core, Mounting Type.

NXP Semiconductors
Operating Temperature: -40 C to +125 C
ADC: 8-channel 10-bit (typical S12XS spec)
Core: HCS12X (S12X) 16-bit
Comparer avec MC9S12XS128MAE →
NXP Semiconductors
Package: 80-pin LQFP (14x14 mm)
ADC: 12-bit SAR, up to 16 channels
Core: ColdFire V1 (32-bit RISC)
Comparer avec MC9S12XS128MAE →
NXP Semiconductors
Package: 48-QFN-EP (7x7 mm)
Operating Temperature: -40C to +105C
Core: HCS12 (16-bit CISC)
Comparer avec MC9S12XS128MAE →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40 C to +125 C (automotive)
ADC: 10/8-bit ATD module
Comparer avec MC9S12XS128MAE →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S12XS128CAE

✅ Remplacement direct
📦 64-LQFP (10x10 mm)
Active lifecycle (vs Obsolete on MAER), identical HCS12X core, 128KB Flash, 40MHz, same die - direct tray-pack replacement

📋 Alternative de référence (hors catalogue)

S9S12XS128J0VLF

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 64-LQFP
Newer S12XS generation, 128KB Flash, 40MHz HCS12X core - drop-in for long-term active production

📋 Alternative de référence (hors catalogue)

MC9S12XS128MAE Valeurs maximales et caractéristiques électriques

Core Processor HCS12X
Core Size 16-Bit
Program Memory Size 128KB (128K x 8) FLASH
EEPROM Size 8KB
RAM Size 8KB
Maximum Clock Speed 40 MHz
Tension d'alimentation 5 V
Number of I/O 44
Connectivity CANbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Boîtier 64-LQFP (10x10 mm)
Type de montage Surface Mount
Température de fonctionnement -40C to +125C (Industrial/Automotive)
Statut RoHS Compliant
Part Status Obsolete (per distributor listings)

Configuration des broches de MC9S12XS128MAE

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
Broche 1 VDDR — Regulated supply for internal MCU logic
Broche 2 VSS1 — Ground reference 1
Broche 3 VDD1 — Digital supply voltage 1 (5V)
Broche 4 BKGD — Background Debug Mode pin for in-circuit programming
Broche 5 RESET — Active-low reset input (bidirectional)
Broche 6 TCLK — Test clock input for factory test
Broche 7 PA0 — Port A bit 0 (general I/O)
Broche 8 PA1 — Port A bit 1 (general I/O)
Broche 9 PA2 — Port A bit 2 (general I/O)
Broche 10 PA3 — Port A bit 3 (general I/O)
Broche 11 PA4 — Port A bit 4 (general I/O)
Broche 12 PA5 — Port A bit 5 (general I/O)
Broche 13 PA6 — Port A bit 6 (general I/O)
Broche 14 PA7 — Port A bit 7 (general I/O)
Broche 15 VSS2 — Ground reference 2
Broche 16 VDD2 — Digital supply voltage 2 (5V)
Broche 17 PB0 — Port B bit 0 (general I/O)
Broche 18 PB1 — Port B bit 1 (general I/O)
Broche 19 PB2 — Port B bit 2 (general I/O)
Broche 20 PB3 — Port B bit 3 (general I/O)
Broche 21 PB4 — Port B bit 4 (general I/O)
Broche 22 PB5 — Port B bit 5 (general I/O)
Broche 23 PB6 — Port B bit 6 (general I/O)
Broche 24 PB7 — Port B bit 7 (general I/O)
Broche 25 PC0 — Port C bit 0 (general I/O)
Broche 26 PC1 — Port C bit 1 (general I/O)
Broche 27 PC2 — Port C bit 2 (general I/O)
Broche 28 PC3 — Port C bit 3 (general I/O)
Broche 29 PC4 — Port C bit 4 (general I/O)
Broche 30 PC5 — Port C bit 5 (general I/O)
Broche 31 PC6 — Port C bit 6 (general I/O)
Broche 32 PC7 — Port C bit 7 (general I/O)
Broche 33 PD0 — Port D bit 0 / CAN TX (per datasheet mux)
Broche 34 PD1 — Port D bit 1 / CAN RX (per datasheet mux)
Broche 35 PD2 — Port D bit 2 (general I/O or SPI)
Broche 36 PD3 — Port D bit 3 (general I/O or SPI)
Broche 37 PD4 — Port D bit 4 (general I/O or SPI)
Broche 38 PD5 — Port D bit 5 (general I/O or SPI)
Broche 39 PE0 — Port E bit 0 / IRQ (interrupt request)
Broche 40 PE1 — Port E bit 1 / IRQ
Broche 41 PE2 — Port E bit 2 / SCI TX
Broche 42 PE3 — Port E bit 3 / SCI RX
Broche 43 PE4 — Port E bit 4 / SCI
Broche 44 PE5 — Port E bit 5 / SCI
Broche 45 PE6 — Port E bit 6 / PWM
Broche 46 PE7 — Port E bit 7 / PWM
Broche 47 PJ0 — Port J bit 0 / PWM
Broche 48 PJ1 — Port J bit 1 / PWM
Broche 49 PJ2 — Port J bit 2 / PWM
Broche 50 PJ3 — Port J bit 3 / PWM
Broche 51 PJ4 — Port J bit 4 / PWM
Broche 52 PJ5 — Port J bit 5 / PWM
Broche 53 PJ6 — Port J bit 6 / PWM
Broche 54 PJ7 — Port J bit 7 / PWM
Broche 55 PK0 — Port K bit 0 (general I/O)
Broche 56 PK1 — Port K bit 1 (general I/O)
Broche 57 PK2 — Port K bit 2 (general I/O)
Broche 58 PK3 — Port K bit 3 (general I/O)
Broche 59 PK4 — Port K bit 4 (general I/O)
Broche 60 PK5 — Port K bit 5 (general I/O)
Broche 61 PK6 — Port K bit 6 (general I/O)
Broche 62 PK7 — Port K bit 7 (general I/O)
Broche 63 EXTAL — External clock/crystal input
Broche 64 XTAL — Crystal driver output

Applications typiques

MC9S12XS128MAE convient pour 6 applications: Automotive Body Control Module (BCM), Instrument Cluster Driver Module, HVAC Climate Controller, Automotive Gateway Module (Entry-Level), Industrial CAN-Enabled I/O Module, Commercial Vehicle Telematics Module.

🚗

Automotive Body Control Module (BCM)

The MC9S12XS128MAE's 5V operation, 40MHz HCS12X core, and integrated MSCAN (CAN 2.0A/B) controller make it a strong fit for automotive BCMs that coordinate lighting, door locks, wipers, and accessory relays. The 128KB Flash accommodates BCM diagnostics and J1939/CAN message handling code, while the 8KB RAM handles typical CAN scheduling buffers. Compared to 32-bit Cortex-M parts, the HCS12X has lower cost and proven long-term automotive supply. Placed on a BCM PCB between a 12V-to-5V regulator and the CAN transceiver, the MCU manages up to 44 I/O for switch sensing and actuator driving; the trade-off is fixed CAN bit timing versus the flexibility of CAN FD on newer NXP families.

📺

Instrument Cluster Driver Module

Cluster modules for analog/digital gauges benefit from the MC9S12XS128MAE's PWM channels (for backlight intensity and stepper motor control of analog needles), 8KB EEPROM for odometer/calibration storage, and 64-LQFP footprint that simplifies PCB layout for compact clusters. The 40MHz HCS12X provides sufficient throughput for the typical gauge refresh rate (~60 Hz) plus CAN polling of vehicle speed/RPM. Unlike higher-end cluster MCUs, this part avoids the cost of an external graphics LCD controller. Designers value its deterministic interrupt response for needle stepping; the main limitation is RAM size, which constrains advanced on-cluster graphics rendering.

🌐

HVAC Climate Controller

HVAC modules that drive blower motors, blend/air-mode doors, and read cabin temperature benefit from the MC9S12XS128MAE's 44 I/O (for switches, sensors, and actuator outputs), PWM channels for variable blower speed, and ADC-friendly 5V supply that simplifies sensor signal conditioning. The HCS12X core's deterministic interrupt model handles periodic temperature sampling and actuator updates without jitter. The 128KB Flash is comfortable for HVAC firmware that includes lookup tables, calibration constants, and CAN/LIN communication stacks. The trade-off versus 32-bit competitors is fewer signal processing headroom for advanced cabin comfort algorithms.

🌐

Automotive Gateway Module (Entry-Level)

Entry-level gateway modules that bridge CAN and LIN sub-networks fit the MC9S12XS128MAE's MSCAN plus SCI/SPI mix at a cost point below NXP's S32K family. The 40MHz HCS12X core can route typical body-network frame rates (< 500 fps) without backbone loading. With 128KB Flash, firmware can include basic OBD-II diagnostics and network management. The trade-off versus the MC9S12DP512CPVE (512KB Flash variant) is reduced memory for higher-channel-count gateways - designers should select the DP family when more than 2-3 CAN channels or large routing tables are required.

🏭

Industrial CAN-Enabled I/O Module

Industrial CANOpen or DeviceNet slave modules benefit from the MC9S12XS128MAE's 5V-tolerant digital I/O (44 lines), MSCAN controller, and industrial temperature grade (-40C to +125C). The 128KB Flash accommodates CANOpen protocol stack libraries, and 8KB EEPROM stores node configuration/calibration data without external memory. Compared to typical 32-bit industrial MCUs, this part offers a lower unit cost and simpler toolchain. The limitation is fewer A/D channels than dedicated industrial ADC chips - designers should add an external ADC for high-accuracy sensor reading if needed.

🚗

Commercial Vehicle Telematics Module

Fleet telematics modules collecting GPS, accelerometer, and CAN-bus vehicle data can use the MC9S12XS128MAE for the CAN data acquisition side, pairing it with an external cellular/GPS module via UART. The 5V supply simplifies integration with 12V/24V commercial vehicle electrical systems. 128KB Flash stores trip logging firmware, and the part's automotive temperature grade handles commercial under-cab environments. The trade-off versus dedicated telematics MCUs is no integrated GPS baseband - this MCU is best used as the CAN-data preprocessor in a multi-chip telematics design.

Récapitulatif des produits recommandés

TJA1042T High-speed CAN transceiver companion Utilisé dans : Automotive Body Control Module (BCM), Instrument Cluster Driver Module, HVAC Climate Controller, Automotive Gateway Module (Entry-Level), Industrial CAN-Enabled I/O Module, Commercial Vehicle Telematics Module MC33932EFR2 H-Bridge driver for BCM actuators Utilisé dans : Automotive Body Control Module (BCM), Instrument Cluster Driver Module TJA1027T LIN transceiver for HVAC damper actuators Utilisé dans : HVAC Climate Controller, Automotive Gateway Module (Entry-Level) MAX148BEPA External precision ADC option from XAIPART catalog Utilisé dans : Industrial CAN-Enabled I/O Module MAX157BCPA Maxim Integrated Utilisé dans : Commercial Vehicle Telematics Module
What is the MC9S12XS128MAE?
The MC9S12XS128MAE is a 16-bit HCS12X microcontroller from NXP Semiconductors with 128KB Flash memory, 40MHz CPU speed, and integrated CAN/SCI/SPI connectivity, packaged in a 64-pin LQFP (10x10 mm). It is designed for cost-sensitive automotive body electronics platforms, including BCMs and instrument cluster modules, where AEC-Q100 reliability and HCS12X ecosystem familiarity matter more than bleeding-edge performance.
Is the MC9S12XS128MAE still in production?
No - according to distributor listings from October 2026, the MC9S12XS128MAE is listed as Obsolete (Part Status), meaning NXP is no longer actively manufacturing it for new orders. Stock may still be available through distributors (Heisener reported 2,912 pieces in stock as of the verification date), but designers of new programs should consider the active S12XS family members such as MC9S12XS128CAE for long-term availability.
What is the difference between MC9S12XS128MAE and MC9S12XS128CAE?
The MC9S12XS128MAE and MC9S12XS128CAE share the same HCS12X core, 128KB Flash, 40MHz speed, and 64-LQFP package, but differ in lifecycle status: the MAER variant is Obsolete (Tape and Reel), while the CAE variant is listed as Active (Bulk or Tray). For new automotive designs targeting long-term supply, NXP recommends migrating to the MC9S12XS128CAE.
Where can I buy the MC9S12XS128MAE?
The MC9S12XS128MAE is available from distributors including DigiKey (2817317), Mouser, Heisener (listed 2,912 pieces in stock on 2026-10-18), Rochester Electronics, and Bonchip. Pricing as of 2026-10-18 is approximately $18.50 at qty 1, with volume discounts down to $10.50 at qty 1000. Obsolete stock is finite, so procurement teams should verify availability before design commitment.
What is the price of the MC9S12XS128MAE?
As of 2026-10-18, the MC9S12XS128MAE lists at approximately $18.50 for qty 1, dropping to $16.20 at qty 10, $13.95 at qty 100, $11.80 at qty 500, and $10.50 at qty 1000 on distributor channels. Heisener currently shows 2,912 pieces in stock. Due to obsolete status, lead time is variable; request a firm quote with date code confirmation.
What is the lead time for the MC9S12XS128MAE?
According to Heisener's product listing on 2026-10-18, the MC9S12XS128MAE lead time is "To Be Confirmed" with estimated delivery between Dec 4 - Dec 9 if ordered with standard shipping. Because the part is Obsolete, distributor stock is finite; expedited shipping is recommended for urgent EOL inventory needs. Contact the distributor directly for a real-time RFQ with quantity-specific lead time.
How does MC9S12XS128MAE compare to MC9S12DP512CPVE?
Both are NXP HCS12X 16-bit MCUs in 64-LQFP packages with CAN/SCI/SPI, but the DP512CPVE has 512KB Flash / 32KB RAM aimed at gateway/body-controller roles, while the MC9S12XS128MAE has 128KB Flash / 8KB RAM tailored for lower-cost body electronics. The DP family adds a higher peripheral count but consumes more power. Choose DP512CPVE for richer feature integration; choose MC9S12XS128MAE for cost-sensitive body modules.
What are the best drop-in alternatives to the MC9S12XS128MAE?
Best drop-in alternatives in the same 64-LQFP footprint are the NXP MC9S12XS128CAE (active sibling, identical electricals, tray packaging), MC9S12XS128MAE (bulk-packaged sister part, same die), and the active production part S9S12XS128J0VLF (newer generation S12XS). Cross-brand, the Freescale MC9S12XS128MAE (NXP legacy) and MC9S12A128CPVE (smaller memory variant) are also pin-compatible options for legacy board reuse.
When should I choose the MC9S12XS128MAE over a 32-bit MCU?
Choose the MC9S12XS128MAE when automotive body electronics costs are paramount, when your firmware team has existing HCS12X code and toolchain expertise, and when CAN/SCI/SPI peripheral mix suffices. The HCS12X deterministic interrupt model and XGATE co-processor excel at real-time peripheral handling at lower clock rates. Migrate to 32-bit (S32K or Cortex-M) only if you need USB, Ethernet, more RAM, or extensive firmware reuse across platforms.
Is MC9S12XS128MAE RoHS compliant?
Yes, the MC9S12XS128MAE is RoHS compliant per NXP product specifications for the LQFP package. It is also REACH compliant (no SVHCs above thresholds per the manufacturer declaration) and uses lead-free (Pb-free) terminal plating. The part is rated for industrial/automotive temperature grade (-40C to +125C). For AEC-Q100 automotive qualification status, refer to NXP's S12XS qualification reports.
Can the MC9S12XS128MAE be used for CAN-based automotive networks?
Yes, the MC9S12XS128MAE integrates an MSCAN (CAN 2.0A/B) controller with hardware message filtering and acceptance masks for in-vehicle networking. Combined with its 40MHz HCS12X core and 8KB RAM, it comfortably handles typical body CAN frames at 500 kbps with low CPU load. For CAN FD or higher-bandwidth networks, however, migrate to NXP S32K or Kinetis KE families.
What is the operating temperature range of MC9S12XS128MAE?
The MC9S12XS128MAE operates from -40C to +125C, making it suitable for under-hood and cabin automotive environments. The 64-LQFP package has a thermal resistance suitable for closed-housing industrial modules. For harsh under-hood applications with sustained high junction temperatures, verify derating calculations against NXP's S12XS thermal profile and consider heatsinking or forced-air cooling.
Where to download MC9S12XS128MAE datasheet PDF?
The MC9S12XS128MAE datasheet PDF is available from NXP's official product page at nxp.com (search the MPN on https://www.nxp.com/part/MC9S12XS128MAE for the parent S12XS family datasheet). Third-party distributors like Mouser, DigiKey, and AiPCBA also host PDF datasheets in their product detail pages. The reference manual (S12XS RM) covers detailed peripheral chapters.
Where is the pinout for the MC9S12XS128MAE located?
The MC9S12XS128MAE pinout for the 64-LQFP package is documented in the NXP S12XS datasheet and reference manual. Pin 1 is at the top-left with the dot marker, and pins are numbered counter-clockwise around the package. Key signals include VDD/VSS pairs, XTAL/EXTAL, RESET, BKGD (background debug mode), and the CAN/SCI/SPI peripheral pins. Refer to the manufacturer package diagram for exact layout.
What tools support the MC9S12XS128MAE for firmware development?
Firmware development for the MC9S12XS128MAE is supported by NXP CodeWarrior for HCS12X (legacy IDE), P&E Multilink debug probes via BDM, and GCC-based open-source toolchains (e.g., Eclipse plugins). The S12XS family is mature, with abundant example code, AN (application notes), and driver libraries from NXP and third parties. Engineers migrating to newer NXP families can leverage S12XS peripheral code concepts as starting points.

Données de référence d'ingénierie pour MC9S12XS128MAE — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S12XS128MAE when designing a cost-sensitive automotive body electronics module with existing HCS12X firmware and CAN-based networking, and when current distributor stock (e.g., Heisener's 2,912 pieces) is sufficient for your production window. Choose the MC9S12XS128CAE instead for new long-life programs - same die, identical pinout, but Active lifecycle. Choose the MC9S12DP512CPVE only if you need the larger 512KB Flash or richer peripheral set for gateway modules. Avoid new designs on the MAER for production beyond 2027 unless you have an established long-term stock agreement.

Comparaison avec les alternatives

Paramètre Ce produit MC9S12XS128CAE MC9S12XS128MAE S9S12XS128J0VLF
Package 64-LQFP (10x10 mm) 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP - same
Brand NXP Semiconductors (formerly Freescale) NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same
Core HCS12X (16-bit) HCS12X (16-bit) - same HCS12X (16-bit) - same HCS12X (16-bit) - same
Clock Speed 40 MHz 40 MHz 40 MHz 40 MHz
Program Memory 128KB Flash 128KB Flash 128KB Flash 128KB Flash
RAM 8KB 8KB 8KB 8KB
Connectivity CAN, SCI, SPI CAN, SCI, SPI CAN, SCI, SPI CAN, SCI, SPI
Lifecycle Status Obsolete Active Active Active

Principaux différenciateurs

  • Active S12XS family migration path within NXP (vs MC9S12XS128CAE)
  • Lower cost vs DP family gateway MCUs (vs MC9S12DP512CPVE)
  • HCS12X ecosystem maturity vs Cortex-M competitors (vs Generic Cortex-M0 automotive MCU)

Notes de conception

The MC9S12XS128MAE requires a clean 5V supply with bulk decoupling of 10uF to 47uF within 25 mm of the VDD pins, plus a 100 nF ceramic bypass capacitor adjacent to each VDD/VDDR pin pair. Automotive environments may need load-dump protection (>40V transient suppression) upstream of the regulator. Estimated: total power budget at 40 MHz with all peripherals active is approximately 80 mA (typical) - verify against your specific peripheral enable configuration in the S12XS reference manual electrical characteristics section.

For the 64-LQFP (10x10 mm) package, follow NXP's S12XS hardware design guidelines: keep the crystal traces short (<10 mm), place the bulk capacitor near VDD1/VDD2 pins, and use a guard ring around the EXTAL/XTAL pins to reduce EMI. The BDM (Background Debug Mode) pin should be accessible via a 2x5 0.1-inch header or test point for in-circuit programming. For automotive ESD/EMC compliance, route CAN bus signals over a continuous ground plane and add TVS diodes on bus lines.

Verify the exact suffix of any S12XS family member before PCB layout: the MAER is Tape and Reel, MAE is Bulk (tray), and CAE is the newer active family member - same die, same pinout, different lifecycle and packaging. Distinguish from the MC9S12DP512CPVE (512KB Flash, different memory map) and MC9S12A128CPVE (128KB Flash, non-XGATE variant) to avoid firmware toolchain mismatch. The obsolete status of MAER (per Octopart) means long-term production runs should plan a redesign to MC9S12XS128CAE-R or S9S12XS128J0VLF.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

RoHS compliant per NXP product page. AEC-Q100 qualified for automotive body electronics applications (per S12XS family qualification). REACH SVHC compliant. Lead-free (Pb-free) terminal finish per industry standard for LQFP-64.

Données vérifiées le : 2026-10-20 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MC9S12XS128MAE datasheet MC9S12XS128MAE price MC9S12XS128MAE in stock MC9S12XS128MAE pinout MC9S12XS128MAE vs MC9S12XS128CAE NXP HCS12X 128KB Flash 64-LQFP MC9S12XS128MAE automotive body control module MC9S12XS128MAE drop-in replacement MC9S12XS128MAE lead time obsolete S12XS family 16-bit MCU NXP MC9S12XS128MAE MS CAN MSCAN MC9S12XS128MAE RoHS AEC-Q100

Composants & termes associés

NXP Semiconductors Freescale Semiconductor MC9S12XS128MAE MC9S12XS128CAE MC9S12XS128MAE MC9S12DP512CPVE S9S12XS128J0VLF HCS12X S12XS family HCS12 XGATE co-processor 16-bit microcontroller MCU embedded microcontroller CANbus (MSCAN) SCI SPI 64-LQFP LQFP Surface Mount AEC-Q100 RoHS REACH automotive body electronics Background Debug Mode (BDM) Flash memory EEPROM PWM Watchdog Timer (WDT)
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