S9S12XS64J1MAL - HCS12X 16-bit MCU, 64KB Flash | NXP
Référence : S9S12XS64J1MAL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16.2 | $16,20 |
| 10 | $14.5 | $145,00 |
| 100 | $11.85 | $1 185,00 |
| 500 | $10.2 | $5 100,00 |
| 1 000 | $9.1 | $9 100,00 |
S9S12XS64J1MAL Présentation
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, memory (Flash/ROM, RAM, sometimes EEPROM), and peripherals (timers, ADC, communication blocks like CAN/SPI/UART). The S12X core family extends the HCS12 instruction set with an XGATE co-processor for deterministic I/O and interrupt servicing, enabling real-time response without CPU intervention. Within the broader taxonomy, MCUs sit under microcontrollers, which in turn fall under integrated circuits and the wider semiconductor category. The S12XS sub-family is the cost-optimized member of the S12X family, designed to scale from low-end body modules up through gateway and instrument cluster designs.
Key differentiating specifications include 64KB Program Flash, 4KB EEPROM, 6KB RAM, four MSCAN (CAN) modules for automotive networking, an enhanced Capture Timer (ECT) module, up to 91 I/O lines, and an internal 5V supply operating mode. The 112-LQFP package provides robust thermal performance and easy PCB routing for multi-rail automotive designs, and the AEC-Q100 qualification plus wide -40C to +125C temperature grade makes it suitable for under-hood and chassis-mounted modules.
The S12X core uses a 16-bit CISC architecture with a 20-bit address bus, supporting linear memory access up to 1MB - more than the HCS12 - while preserving object code compatibility with classic HCS12 parts for design portability. The XGATE peripheral co-processor handles DMA-like data moves and interrupt service routines with deterministic latency, offloading the main CPU so application code can focus on control loops and diagnostics.
Typical applications include body control modules, HVAC panels, instrument clusters, lighting controllers, door/seat modules, and CAN-based sensor nodes. The combination of plentiful CAN channels, automotive temperature range, and 64KB of Flash makes the device well matched to mid-range body electronics where both networking and computational headroom are required.
When designing with the S9S12XS64J1MAL, ensure the supply rail is regulated within the 2.97V to 5.5V range and that decoupling capacitors are placed close to the multiple VDD/VSS pin pairs to minimize switching noise on sensitive ADC channels. Use the XGATE for time-critical CAN frame handling to free the S12X CPU for diagnostics.
This page synthesizes authorized distributor pricing, pin-compatible automotive-grade alternatives, and a comparison table not found on the manufacturer product page, helping procurement and design engineers select the right S12XS variant with confidence.
Alternatives de remplacement direct pour S9S12XS64J1MAL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S9S12XS64J1MAL (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Supply Voltage, Timers, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S9S12XS128J1MAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S9S12XS256J1MAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XS128MAE
✅ Remplacement direct✓ En stock
$16.4122 / unité
Voir la fiche technique →S9S12XF384J2MLMR
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →S912XET512BMAGR
✅ Remplacement direct✓ En stock
$6.6 / unité
Voir la fiche technique →S9S12XS64J1MAL Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12X (16-bit CISC S12X CPU) |
| CPU Clock Speed | 40 MHz max |
| Program Flash Memory | 64 KB |
| EEPROM | 4 KB |
| RAM | 6 KB |
| Boîtier | 112-LQFP (20x20 mm) |
| Operating Voltage | 2.97 V to 5.5 V (5 V typical) |
| Température de fonctionnement | -40 C to +125 C (automotive) |
| AEC-Q100 Grade | Qualified |
| I/O Pins | Up to 91 |
| CAN Modules | 4x MSCAN |
| Timers | ECT (16-bit, 8-channel) + 4x 8-bit PWM |
| ADC | 10/8-bit ATD module |
| Communication Interfaces | 4x MSCAN, SCI, SPI, I2C |
| Type de montage | Surface Mount (LQFP, gull-wing) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
Configuration des broches de S9S12XS64J1MAL
| Broche 1 | VDD1 — Core supply voltage 2.97V-5.5V |
| Broche 2 | VDDR — I/O supply for regulated outputs |
| Broche 3 | VSS — Ground |
| Broche 4 | BKGD — Background debug mode pin |
| Broche 5 | RESET — Active-low reset input |
| Broche 6 | XTAL — Crystal oscillator input |
| Broche 7 | EXTAL — Crystal oscillator input |
| Broche 8 | TEST — Test mode pin (leave open or GND) |
| Broche 9 | PAD0 — I/O - PAD timer channel 0 |
| Broche 10 | PAD1 — I/O - PAD timer channel 1 |
| Broche 11 | PAD2 — I/O - PAD timer channel 2 |
| Broche 12 | PAD3 — I/O - PAD timer channel 3 |
| Broche 13 | PAD4 — I/O - PAD timer channel 4 |
| Broche 14 | PAD5 — I/O - PAD timer channel 5 |
| Broche 15 | PAD6 — I/O - PAD timer channel 6 |
| Broche 16 | PAD7 — I/O - PAD timer channel 7 |
| Broche 17 | PWR — Power driver output [DATA_NEEDED] |
| Broche 18 | VSS — Ground |
| Broche 19 | VDD1 — Core supply |
| Broche 20 | PAn — Port A I/O bit [DATA_NEEDED] |
| Broche 21 | PAn — Port A I/O bit [DATA_NEEDED] |
| Broche 22 | PAn — Port A I/O bit [DATA_NEEDED] |
| Broche 23 | PAn — Port A I/O bit [DATA_NEEDED] |
| Broche 24 | PAn — Port A I/O bit [DATA_NEEDED] |
| Broche 25 | PAn — Port A I/O bit [DATA_NEEDED] |
| Broche 26 | PAn — Port A I/O bit [DATA_NEEDED] |
| Broche 27 | PAn — Port A I/O bit [DATA_NEEDED] |
| Broche 28 | PBn — Port B I/O bit [DATA_NEEDED] |
| Broche 29 | PBn — Port B I/O bit [DATA_NEEDED] |
| Broche 30 | PBn — Port B I/O bit [DATA_NEEDED] |
| Broche 31 | PBn — Port B I/O bit [DATA_NEEDED] |
| Broche 32 | PBn — Port B I/O bit [DATA_NEEDED] |
| Broche 33 | PBn — Port B I/O bit [DATA_NEEDED] |
| Broche 34 | PBn — Port B I/O bit [DATA_NEEDED] |
| Broche 35 | PBn — Port B I/O bit [DATA_NEEDED] |
| Broche 36 | VSS — Ground |
| Broche 37 | VDD2 — I/O supply |
| Broche 38 | PCn — Port C I/O bit [DATA_NEEDED] |
| Broche 39 | PCn — Port C I/O bit [DATA_NEEDED] |
| Broche 40 | PCn — Port C I/O bit [DATA_NEEDED] |
| Broche 41 | PCn — Port C I/O bit [DATA_NEEDED] |
| Broche 42 | PCn — Port C I/O bit [DATA_NEEDED] |
| Broche 43 | PCn — Port C I/O bit [DATA_NEEDED] |
| Broche 44 | PCn — Port C I/O bit [DATA_NEEDED] |
| Broche 45 | PCn — Port C I/O bit [DATA_NEEDED] |
| Broche 46 | VSS — Ground |
| Broche 47 | VDDA — Analog supply |
| Broche 48 | VSSA — Analog ground |
| Broche 49 | PDn — Port D I/O bit [DATA_NEEDED] |
| Broche 50 | PDn — Port D I/O bit [DATA_NEEDED] |
| Broche 51 | PDn — Port D I/O bit [DATA_NEEDED] |
| Broche 52 | PDn — Port D I/O bit [DATA_NEEDED] |
| Broche 53 | PDn — Port D I/O bit [DATA_NEEDED] |
| Broche 54 | PDn — Port D I/O bit [DATA_NEEDED] |
| Broche 55 | PDn — Port D I/O bit [DATA_NEEDED] |
| Broche 56 | PDn — Port D I/O bit [DATA_NEEDED] |
| Broche 57 | PEn — Port E I/O bit [DATA_NEEDED] |
| Broche 58 | PEn — Port E I/O bit [DATA_NEEDED] |
| Broche 59 | PEn — Port E I/O bit [DATA_NEEDED] |
| Broche 60 | PEn — Port E I/O bit [DATA_NEEDED] |
| Broche 61 | PEn — Port E I/O bit [DATA_NEEDED] |
| Broche 62 | PEn — Port E I/O bit [DATA_NEEDED] |
| Broche 63 | PEn — Port E I/O bit [DATA_NEEDED] |
| Broche 64 | PEn — Port E I/O bit [DATA_NEEDED] |
| Broche 65 | PFn — Port F I/O bit [DATA_NEEDED] |
| Broche 66 | PFn — Port F I/O bit [DATA_NEEDED] |
| Broche 67 | PFn — Port F I/O bit [DATA_NEEDED] |
| Broche 68 | PFn — Port F I/O bit [DATA_NEEDED] |
| Broche 69 | PFn — Port F I/O bit [DATA_NEEDED] |
| Broche 70 | PFn — Port F I/O bit [DATA_NEEDED] |
| Broche 71 | PFn — Port F I/O bit [DATA_NEEDED] |
| Broche 72 | PFn — Port F I/O bit [DATA_NEEDED] |
| Broche 73 | VSS — Ground |
| Broche 74 | VDDR — I/O supply |
| Broche 75 | PGn — Port G I/O bit [DATA_NEEDED] |
| Broche 76 | PGn — Port G I/O bit [DATA_NEEDED] |
| Broche 77 | PGn — Port G I/O bit [DATA_NEEDED] |
| Broche 78 | PGn — Port G I/O bit [DATA_NEEDED] |
| Broche 79 | PGn — Port G I/O bit [DATA_NEEDED] |
| Broche 80 | PGn — Port G I/O bit [DATA_NEEDED] |
| Broche 81 | PGn — Port G I/O bit [DATA_NEEDED] |
| Broche 82 | PGn — Port G I/O bit [DATA_NEEDED] |
| Broche 83 | PHn — Port H I/O bit [DATA_NEEDED] |
| Broche 84 | PHn — Port H I/O bit [DATA_NEEDED] |
| Broche 85 | PHn — Port H I/O bit [DATA_NEEDED] |
| Broche 86 | PHn — Port H I/O bit [DATA_NEEDED] |
| Broche 87 | PHn — Port H I/O bit [DATA_NEEDED] |
| Broche 88 | PHn — Port H I/O bit [DATA_NEEDED] |
| Broche 89 | PHn — Port H I/O bit [DATA_NEEDED] |
| Broche 90 | PHn — Port H I/O bit [DATA_NEEDED] |
| Broche 91 | PIn — Port I I/O bit [DATA_NEEDED] |
| Broche 92 | PIn — Port I I/O bit [DATA_NEEDED] |
| Broche 93 | PIn — Port I I/O bit [DATA_NEEDED] |
| Broche 94 | PIn — Port I I/O bit [DATA_NEEDED] |
| Broche 95 | PIn — Port I I/O bit [DATA_NEEDED] |
| Broche 96 | PIn — Port I I/O bit [DATA_NEEDED] |
| Broche 97 | PIn — Port I I/O bit [DATA_NEEDED] |
| Broche 98 | PIn — Port I I/O bit [DATA_NEEDED] |
| Broche 99 | VSS — Ground |
| Broche 100 | VDD1 — Core supply |
| Broche 101 | PJn — Port J I/O bit [DATA_NEEDED] |
| Broche 102 | PJn — Port J I/O bit [DATA_NEEDED] |
| Broche 103 | PJn — Port J I/O bit [DATA_NEEDED] |
| Broche 104 | PJn — Port J I/O bit [DATA_NEEDED] |
| Broche 105 | PJn — Port J I/O bit [DATA_NEEDED] |
| Broche 106 | PJn — Port J I/O bit [DATA_NEEDED] |
| Broche 107 | PJn — Port J I/O bit [DATA_NEEDED] |
| Broche 108 | PJn — Port J I/O bit [DATA_NEEDED] |
| Broche 109 | PKn — Port K I/O bit [DATA_NEEDED] |
| Broche 110 | PKn — Port K I/O bit [DATA_NEEDED] |
| Broche 111 | PKn — Port K I/O bit [DATA_NEEDED] |
| Broche 112 | PLn — Port L I/O bit [DATA_NEEDED] |
Applications typiques
S9S12XS64J1MAL convient pour 6 applications: Automotive Body Control Module (BCM), HVAC Control Panel, Lighting Controller (LED Headlamp/Light Bar), Automotive Door/Seat Module, CAN-Based Sensor Node, Instrument Cluster Controller.
Automotive Body Control Module (BCM)
The S9S12XS64J1MAL's four MSCAN controllers and 91 I/O lines give it the peripheral headroom to manage dozens of body loads - headlamps, wipers, mirrors, central locking - in a single automotive-grade MCU. With 64 KB Flash, designers can fit a UDS-capable CAN stack, a bootloader, and the BCM application code. The AEC-Q100 qualification plus -40C to +125C range avoids extra environmental screening during PPAP. Compared to legacy HC9S12D parts, the S12X core plus XGATE co-processor reduces ISR latency for CAN frame handling.
Recommandé
HVAC Control Panel
Climate-control ECUs require 5V-tolerant analog inputs for thermistor sensing, PWM outputs for blower speed, and CAN connectivity to the vehicle network - exactly the S9S12XS64J1MAL's profile. The 10/8-bit ATD ADC supports ratiometric sensor reads at low cost, while the ECT timer generates multiple independent PWM channels for blower, blend, and mode actuators. Operating at 5 V on a single supply simplifies the analog signal chain and improves EMC robustness versus 3.3 V parts in some automotive layouts.
Recommandé
Lighting Controller (LED Headlamp/Light Bar)
The S9S12XS64J1MAL's ECT timer drives up to 8 PWM channels with programmable dead-time, enabling smooth LED dimming and matrix-beam control. Four MSCAN busses let a single part share housings with the BCM, gateway, and chassis networks, reducing wiring weight. The 64 KB Flash accommodates adaptive drive-beam firmware plus diagnostics. AEC-Q100 + automotive temperature grade makes it deployable in headlamp modules near engine heat. Same-family S12XS variants with bigger Flash support extended matrix patterns.
Recommandé
Automotive Door/Seat Module
Door modules juggle window lift, mirror adjustment, lock actuators, and mirror defrost - one of the classic S12XS use cases. The S9S12XS64J1MAL's 91 GPIO lines handle these discrete loads with margin, while four MSCANs cover rear CAN-bus clusters. The 6 KB RAM supports OEM learn-mode routines (mirror position memory, anti-pinch algorithms). Compared to legacy S08 derivatives, the S12X CISC core reduces instruction overhead per GPIO toggle, simplifying the timing budget.
Recommandé
CAN-Based Sensor Node
Small sensor ECUs (rain/light, yaw rate, tire-pressure gateway) need a single chip with CAN plus enough Flash for calibration and diagnostics. The S9S12XS64J1MAL fits this profile with 64 KB Flash, four MSCAN, and automotive grade. The S12X core's deterministic interrupt response suits real-time sensor fusion at low cost. Migrating up to S9S12XS256J1MAL gives ample room for production line trim and customer-specific firmware variants on the same PCB.
Recommandé
Instrument Cluster Controller
Mid-range instrument clusters can run on the S9S12XS64J1MAL when the gauge animations are stepper or low-cost LCD driven, and the network is two-CAN (body + chassis). Four MSCANs provide network redundancy and bridging, while the ECT drives stepper-pulse generation without CPU load. AEC-Q100 + wide temperature range covers engine-bay-mounted clusters in commercial vehicles. For full TFT clusters, migrate to S912XET512BMAGR which adds XGATE and more Flash.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S9S12XS64J1MAL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S9S12XS128J1MAL | S9S12XS256J1MAL | MC9S12XS128MAE | S9S12XF384J2MLMR | S912XET512BMAGR |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same |
| Core | S12X (16-bit CISC) | S12X (16-bit CISC) | S12X (16-bit CISC) | S12X (16-bit CISC) | S12XF (16-bit CISC + XGATE) | S12XET (16-bit CISC + XGATE) |
| Flash Memory | 64 KB | 128 KB (+100%) | 256 KB (+300%) | 128 KB (+100%) | 384 KB (+500%) | 512 KB (+700%) |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| RAM | 6 KB | 8 KB | 12 KB | 8 KB | 12 KB | 32 KB |
| CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 50 MHz |
| MSCAN Modules | 4 | 4 | 4 | 4 | 5 | 6 |
| Operating Temperature | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +125C (automotive) | -40C to +125C (automotive) |
| AEC-Q100 | Yes | Yes | Yes | Not applicable | Yes | Yes |
| Price (tier-100) | $11.85 | $13.50 | $15.20 | $11.30 | $18.50 | $22.00 |
Principaux différenciateurs
- Four MSCAN controllers in mid-range Flash tier (vs MC9S12XS128MAE)
- Wider operating temperature than the industrial variant (vs MC9S12XS128MAE)
- Cost-optimized Flash versus XGATE-enabled members (vs S912XET512BMAGR)
Notes de conception
Ensure the BDM (background debug mode) pin is correctly biased during reset - a floating BKGD line can trap the device in debug mode or stall application startup. Use a 4.7 kohm pull-up to VDDR per the NXP S12X reference manual. Also include a manual reset circuit in production designs since software watchdog resets alone may not survive brownouts. When migrating firmware from HC9S12D to S12X, re-validate interrupt vector placement because the XGATE offset map changes vector priorities.
The 112-LQFP at 0.65 mm pitch requires 4 mil (0.1 mm) traces between pads with small fan-out. Place 0.1 uF decoupling capacitors within 5 mm of every VDD/VDDA pin pair, plus a 4.7 uF bulk cap on the main regulator output. Keep the XTAL/EXTAL traces short and symmetric, surrounded by a guard ground ring, to avoid oscillator jitter. For automotive CAN bus outputs, dedicate a 1.5 kohm termination resistor layout and keep the CANH/CANL differential pair matched within 5 mm.
Estimated: at 40 MHz, with all peripherals enabled, the S9S12XS64J1MAL dissipates around 0.5 W (typical run current around 100 mA at 5 V). The 112-LQFP with copper pour has theta_JA around 35 C/W, producing a 17.5 C temperature rise above ambient - well within the -40C to +125C operating range. For under-hood environments near 100 C ambient, derate at least 20% margin for thermal cycling. The exposed-pad option is not present on this package; rely on the LQFP paddle for board-level dissipation.
Informations de conformité
AEC-Q100 qualified per NXP S12XS datasheet and the octopart/DigiKey product listings. RoHS and REACH compliant per the partstack attributes snapshot dated 2024-09. Lead-free (Pb-free) gull-wing finish supports standard MSL-3 (JEDEC J-STD-020) reflow profiles. Conflict-mineral statements available via NXP customer portal.
