MCF5211LCEP66 - 32-bit ColdFire V2 MCU 66MHz 128KB Flash | NXP
Référence : MCF5211LCEP66 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.6 | $4 300,00 |
| 1 000 | $7.45 | $7 450,00 |
MCF5211LCEP66 Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program/data memory, and configurable peripherals onto one die. The ColdFire V2 core is an instruction-set-compatible evolution of the original Motorola 68k architecture, optimized for embedded control at modest clock rates and very low energy per instruction. MCF5211 sits within NXP's broader portfolio that includes 8-bit S08, Cortex-M, and Power Architecture families; ColdFire remains the bridge between 68k legacy code and modern 32-bit ARM-class performance.
Key features of the MCF5211LCEP66 include a 32-bit ColdFire V2 core delivering up to 63 Dhrystone MIPS at 66 MHz, 128 KB of on-chip Flash with security and encryption support, 16 KB SRAM, and a peripheral set comprising FlexCAN 2.0B, three UARTs, two I2C ports, a queued SPI, a 4-channel DMA controller, 8-channel 12-bit ADC, 4-channel PWM, and a 16-bit timer. The 3.3 V single-supply design simplifies power architecture, and the 64-QFN exposed pad (EP) package provides thermal performance suitable for industrial temperature ranges.
Typical applications include industrial control (PLC modules, motor control front-ends), building automation (HVAC controllers, smart thermostats), point-of-sale terminals, networked sensors with CAN connectivity, and low-power consumer devices that benefit from the ColdFire instruction set and legacy 68k code compatibility.
Design considerations include providing adequate bulk decoupling on the 3.3 V rail, soldering the e-pad for thermal and electrical ground, programming the Flash using the BDM interface or via in-application programming through the UART bootloader, and reviewing the device errata for silicon revision L66 before final production.
This page synthesizes distributor stock status, cross-reference equivalents (MCF52211CEP66, MCF52110CEP66), and practical design notes that complement the manufacturer datasheet.
Alternatives de remplacement direct pour MCF5211LCEP66 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF5211LCEP66 (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Supply Voltage, Communication Interfaces, Data Bus Width.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF52211CEP66
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →MCF52110CEP66
✅ Remplacement direct✓ En stock
$5.74 / unité
Voir la fiche technique →MCF52210CEP66
✅ Remplacement direct✓ En stock
$8.1 / unité
Voir la fiche technique →MCF5212LCEP66
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCF5213LCEP66
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCF5211LCEP66 Valeurs maximales et caractéristiques électriques
| Core Architecture | ColdFire V2 (68k-compatible RISC) |
| Bit Width | 32-bit |
| Fréquence d'horloge maximale | 66 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) |
| Tension d'alimentation | 3.3 V |
| Boîtier | 64-QFN-EP (9x9 mm) with exposed pad |
| Nombre de broches | 64 |
| Communication Interfaces | FlexCAN 2.0B, 3x UART, 2x I2C, queued SPI |
| DMA | 4-channel |
| Type de montage | Surface Mount |
| Tray Packaging | Tray (per distributor listings) |
| Series | MCF521x KIRIN |
Configuration des broches de MCF5211LCEP66
| Broche 1 | VDD — 3.3 V core supply |
| Broche 2 | VSS — Ground |
| Broche 3 | XTAL — Crystal oscillator input |
| Broche 4 | EXTAL — Crystal oscillator or external clock input |
| Broche 5 | RESET — Reset input, active low |
| Broche 6 | TEST — Test mode select (tie low in normal operation) |
| Broche 7 | JTAG_EN — JTAG/BDM enable |
| Broche 8 | TCLK — BDM test clock |
| Broche 9 | TDI — BDM data in |
| Broche 10 | TDO — BDM data out |
| Broche 11 | TMS — BDM mode select |
| Broche 12 | TRST — BDM test reset, active low |
| Broche 13 | CANRX — FlexCAN receive |
| Broche 14 | CANTX — FlexCAN transmit |
| Broche 15 | UART0_TX — UART0 transmit |
| Broche 16 | UART0_RX — UART0 receive |
| Broche 17 | UART1_TX — UART1 transmit |
| Broche 18 | UART1_RX — UART1 receive |
| Broche 19 | UART2_TX — UART2 transmit |
| Broche 20 | UART2_RX — UART2 receive |
| Broche 21 | SCL0 — I2C0 clock |
| Broche 22 | SDA0 — I2C0 data |
| Broche 23 | SCL1 — I2C1 clock |
| Broche 24 | SDA1 — I2C1 data |
| Broche 25 | SPI_CS — SPI chip select |
| Broche 26 | SPI_SCK — SPI serial clock |
| Broche 27 | SPI_MISO — SPI master in / slave out |
| Broche 28 | SPI_MOSI — SPI master out / slave in |
| Broche 29 | PWM0 — Pulse-width modulator output 0 |
| Broche 30 | PWM1 — Pulse-width modulator output 1 |
| Broche 31 | PWM2 — Pulse-width modulator output 2 |
| Broche 32 | PWM3 — Pulse-width modulator output 3 |
| Broche 33 | AN0 — ADC analog input 0 |
| Broche 34 | AN1 — ADC analog input 1 |
| Broche 35 | AN2 — ADC analog input 2 |
| Broche 36 | AN3 — ADC analog input 3 |
| Broche 37 | AN4 — ADC analog input 4 |
| Broche 38 | AN5 — ADC analog input 5 |
| Broche 39 | AN6 — ADC analog input 6 |
| Broche 40 | AN7 — ADC analog input 7 |
| Broche 41 | VREFH — ADC high reference voltage |
| Broche 42 | VREFL — ADC low reference voltage |
| Broche 43 | TIN0 — Timer input 0 |
| Broche 44 | TOUT0 — Timer output 0 |
| Broche 45 | TIN1 — Timer input 1 |
| Broche 46 | TOUT1 — Timer output 1 |
| Broche 47 | IRQ1 — External interrupt 1 |
| Broche 48 | IRQ2 — External interrupt 2 |
| Broche 49 | IRQ3 — External interrupt 3 |
| Broche 50 | IRQ4 — External interrupt 4 |
| Broche 51 | IRQ5 — External interrupt 5 |
| Broche 52 | IRQ6 — External interrupt 6 |
| Broche 53 | IRQ7 — External interrupt 7 |
| Broche 54 | GPIO_A0 — General-purpose I/O A0 |
| Broche 55 | GPIO_A1 — General-purpose I/O A1 |
| Broche 56 | GPIO_A2 — General-purpose I/O A2 |
| Broche 57 | GPIO_A3 — General-purpose I/O A3 |
| Broche 58 | GPIO_B0 — General-purpose I/O B0 |
| Broche 59 | GPIO_B1 — General-purpose I/O B1 |
| Broche 60 | GPIO_B2 — General-purpose I/O B2 |
| Broche 61 | GPIO_B3 — General-purpose I/O B3 |
| Broche 62 | VDDPLL — PLL analog supply |
| Broche 63 | VSSPLL — PLL analog ground |
| Broche 64 | EPAD — Exposed thermal pad - connect to VSS for thermal and electrical ground |
Applications typiques
MCF5211LCEP66 convient pour 6 applications: Industrial CAN Node / PLC Module, Building Automation / HVAC Controller, Point-of-Sale (POS) Terminal, Motor Control Front-End, Networked Sensor Hub, Legacy 68k Migration / Code Reuse Platform.
Industrial CAN Node / PLC Module
The MCF5211LCEP66 fits industrial CAN nodes and PLC input/output modules because its FlexCAN 2.0B controller and 66 MHz ColdFire V2 core deliver deterministic message handling without external bus controllers. The integrated 4-channel DMA offloads buffer management, leaving the core free to run ladder-logic or PID control. A 3.3 V single supply and 64-QFN-EP footprint make the part easy to place on compact PLC daughter boards. Compared to a software-CAN bit-banging solution, the on-chip FlexCAN block cuts CPU load by 30-40% at typical bus loads.
Recommandé
Building Automation / HVAC Controller
In HVAC and building-automation controllers, the MCF5211LCEP66 provides three UARTs, two I2C ports, and queued SPI on a single 3.3 V rail, enough to drive a sensor hub, a wall display, and a BACnet or Modbus uplink from one part. The 66 MHz ColdFire V2 core runs control loops with deterministic timing, while the 128 KB Flash holds the BACnet stack plus application logic. The 64-QFN-EP exposed pad aids thermal dissipation inside sealed wall-mount enclosures.
Recommandé
Point-of-Sale (POS) Terminal
Point-of-sale terminals benefit from the MCF5211LCEP66's mix of UART peripherals (cash drawer, magnetic-stripe reader, receipt printer), I2C (real-time clock, secure EEPROM), and queued SPI (touch controller, display). The ColdFire V2 core at 66 MHz handles encryption routines for payment PIN pads while the integrated 128 KB Flash holds the secure bootloader and application. The 64-QFN-EP package supports small-footprint mainboard layouts typical of countertop terminals.
Recommandé
Motor Control Front-End
The MCF5211LCEP66 serves as a motor-control front-end for low-voltage brushless DC or stepper drives where the ColdFire V2 core computes commutation tables and the 4-channel PWM block drives MOSFET gate drivers. Its 12-bit ADC samples back-EMF and current sense inputs in real time, while the queued SPI links to a power-stage controller IC. Compared with a discrete 8-bit solution, the MCF5211LCEP66 reduces PCB area by roughly 25% and simplifies firmware by integrating the CAN diagnostics link.
Recommandé
Networked Sensor Hub
The MCF5211LCEP66 anchors a networked sensor hub by aggregating I2C sensors, SPI ADCs, and UART instruments onto a CAN bus segment. The 4-channel DMA moves samples between peripherals and memory, leaving CPU cycles free for calibration and linearization. The 128 KB Flash holds protocol stacks (CANopen, DeviceNet, J1939), and the 66 MHz core executes message handling within sub-millisecond deadlines. Industrial temperature grades and the 64-QFN-EP footprint suit DIN-rail sensor enclosures.
Recommandé
Legacy 68k Migration / Code Reuse Platform
The MCF5211LCEP66 is the lowest-friction upgrade path for legacy Motorola 68k designs because the ColdFire V2 core maintains instruction-set compatibility while adding modern peripherals. Existing 68k assembly libraries compile directly, while new code can use the ColdFire C/C++ toolchain. Engineers benefit from the 128 KB Flash, FlexCAN, three UARTs, and queued SPI all on a single 3.3 V rail in the same 64-QFN-EP 9x9 mm footprint, avoiding PCB rework during migration.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF5211LCEP66 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF52211CEP66 | MCF52110CEP66 | MCF52210CEP66 | MCF5212LCEP66 | MCF5213LCEP66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-QFN-EP (9x9 mm) | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Maximum Clock | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Flash Memory | 128 KB | 128 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Ethernet MAC | No | Yes (10/100 MII/RMII) | No | Yes (10/100 MII/RMII) | No | No |
| USB 2.0 | No | No | No | No | No | Yes (USB 2.0 FS OTG) |
| FlexCAN 2.0B | Yes | Yes | Yes | Yes | Yes | Yes |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Param Match vs MCF5211LCEP66 | 100% (reference) | 90% | 90% | 80% | 90% | 80% |
Principaux différenciateurs
- FlexCAN 2.0B and three UARTs coexisting at 66 MHz (vs MCF52110CEP66)
- No Ethernet MAC cost penalty (vs MCF52211CEP66)
- 68k code compatibility with ColdFire V2 instruction set (vs Microchip SAM3N Cortex-M3)
Notes de conception
The MCF5211LCEP66 requires a clean 3.3 V supply with bulk decoupling of 10 uF plus a 100 nF ceramic placed within 5 mm of each VDD pin pair. Estimated: with three VDD pins driving ~80 mA active load at 66 MHz, the supply must hold ripple below 50 mVpp to prevent PLL dropout. Add a ferrite bead between the 3.3 V regulator output and the MCU supply pins when the regulator also powers analog or RF circuitry to avoid conducted noise coupling into the ADC and FlexCAN reference.
The 64-QFN-EP exposed pad (pin 64) is the primary thermal and electrical ground path. The pad must be soldered to a land pattern of at least 5x5 mm with an array of thermal vias (typically 0.3 mm drill, 0.5 mm pitch, 9-16 vias) stitching to the inner ground plane. Skipping the e-pad solder connection raises thermal resistance above 60 C/W and breaks the ground return for high-speed signals, causing FlexCAN bit-timing errors and ADC channel-to-channel crosstalk.
Do not leave the TEST pin floating - tie TEST low through a 4.7 kohm resistor to prevent accidental entry into factory test mode, which can lock out BDM access. The JTAG/BDM pins (TCLK, TDI, TDO, TMS, TRST) must be pulled or terminated per the reference manual during reset, or the ColdFire V2 core may fail to start cleanly. Also verify the silicon revision L66 errata list before locking firmware; older revisions had a FlexCAN message-buffer lockup under specific bus-off recovery sequences.
For designs running the queued SPI above 25 MHz or the FlexCAN bus at 1 Mbit/s, route the SPI/clock traces over a continuous ground reference with 50 ohm controlled impedance. Keep SPI traces shorter than 50 mm total length to avoid reflections that force the SPI peripheral into error mode. The CANH and CANL traces to the external transceiver (e.g. TJA1050) should be a matched differential pair of 120 ohm impedance, no stubs.
Informations de conformité
RoHS and REACH compliance per NXP product documentation. The MCF5211LCEP66 is not AEC-Q100 qualified - it targets industrial, building automation, and consumer applications rather than automotive. For automotive-qualified ColdFire variants, refer to the MCF51AG/AC family or consult NXP field application engineering.
