MCF5234CVM150J - 150MHz ColdFire V2 MCU 256-MAPBGA | NXP
Référence : MCF5234CVM150J ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.85 | $2 185,00 |
| 500 | $19.4 | $9 700,00 |
| 1 000 | $17.1 | $17 100,00 |
MCF5234CVM150J Présentation
An integrated microprocessor (MPU/MCU) is a single-chip computer that places a CPU core, program and data memory, and a rich peripheral set on one die. The ColdFire V2 family sits within Freescale/NXP's 32-bit ColdFire product line, which descended from the Motorola M68k architecture. It bridges 8/16-bit MCU designs and higher-end PowerPC ColdFire variants, delivering deterministic interrupt response, an M68k-compatible instruction set, and an AMBA-style peripheral bus. This makes it well-suited to industrial control, factory automation, and Ethernet-connected embedded systems where determinism and code reuse from legacy 68000 designs matter.
Differentiating specifications include 150 MHz core frequency with a hardware multiply/accumulate (MAC) unit, 64 KB unified on-chip SRAM, ROMless external bus supporting up to 8 MB SDRAM, four 32-bit timers, four programmable interrupt timers, dual CAN 2.0B controllers, three UARTs, two I2C channels, QSPI, and a 10/100 Mbps Fast Ethernet MAC with MII/RMII. The device operates from a 1.5 V core / 3.3 V I/O split-rail supply and includes an integrated ColdFire hardware encryption module.
Architecturally, the MCF5234 uses a Harvard-style bus with separate instruction and data paths to the memory controller, plus a peripheral-side APBX/APB bus. The ColdFire V2 core supports the standard ColdFire ISA plus the MAC instructions used in DSP-style filtering and CRC calculation. A dedicated 16-channel DMA controller offloads memory transfers from the core, and the eMAC peripheral enables hardware-accelerated AES, DES, and 3DES algorithms.
Typical applications include industrial Ethernet gateways, CAN-based building automation nodes, networked motor control, POS terminals, and embedded protocol converters bridging RS-232, RS-485, and EtherNet/IP. The combination of CAN, Ethernet, and serial interfaces targets Industrial IoT edge nodes and SCADA equipment.
Design considerations: this part is ROMless and requires external boot memory; supply sequencing must respect core-before-IO with monotonic ramp; PCB layout must control impedance for SDRAM traces. Engineering samples should be derated thermally against the 17x17 BGA thermal envelope.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes for the MCF5234CVM150J that complement the manufacturer datasheet, giving engineers selection and sourcing context in one view.
Alternatives de remplacement direct pour MCF5234CVM150J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF5234CVM150J (même facteur de forme et même empreinte) — différant par Package, Ethernet MAC, Peripherals, Program Memory Type, DMA Channels.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF5234CVM100
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →MCF5234CVM100J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF5235CVM150
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MCF5232CVM150
✅ Remplacement direct✓ En stock
$26.5 / unité
Voir la fiche technique →MCF5233CVM100J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF5234CVM150J Valeurs maximales et caractéristiques électriques
| Core | ColdFire V2 |
| Largeur du bus de données | 32 bit |
| Fréquence d'horloge maximale | 150 MHz |
| On-chip SRAM | 64 KB |
| External Memory Support | ROMless (SRAM/Flash/SDRAM external) |
| Program Memory Type | ROMless |
| Maximum I/O Count | 97 |
| Boîtier / Format | 256-MAPBGA (17x17 mm) |
| Type de montage | Surface Mount |
| Ethernet MAC | 10/100 Mbps Fast Ethernet (MII/RMII) |
| CAN Controllers | 2x CAN 2.0B |
| UART | 3x |
| I2C | 2x |
| QSPI | 1x |
| DMA Channels | 16-channel |
| Hardware Encryption | ColdFire eMAC (AES/DES/3DES) |
| Tension d'alimentation | 1.5 V core / 3.3 V I/O |
Configuration des broches de MCF5234CVM150J
| Broche A1 | VDD — Core supply voltage input (1.5 V nominal). Specific ball assignment and full BGA map are in datasheet section 8. |
| Broche A2 | VSS — Ground reference ball. Specific ball assignment in datasheet section 8. |
| Broche B1 | ETXCLK — Ethernet transmit clock (MII/RMII interface). |
| Broche C3 | ERXD0 — Ethernet receive data bit 0. |
| Broche D5 | CAN1TX — CAN 1 transmit output. |
| Broche E7 | UART0_TXD — UART0 transmit data output. |
| Broche F9 | I2C0_SDA — I2C0 serial data (bidirectional). |
| Broche G11 | QSPI_CS0 — QSPI chip-select 0 (active low). |
| Broche H13 | IRQ1 — External interrupt request input 1. |
| Broche J15 | TIN3 — Timer input 3. |
| Broche K16 | DTOUT0 — DMA trigger output 0. |
| Broche L14 | ADDR23 — External bus address bit 23. |
| Broche M12 | DATA15 — External bus data bit 15. |
| Broche N10 | CS1 — Chip-select 1 (external memory). |
| Broche P8 | RAS — SDRAM row-address strobe. |
| Broche R6 | CAS — SDRAM column-address strobe. |
| Broche T4 | WE — SDRAM/Flash write-enable (active low). |
| Broche U2 | TSC — Test-mode scan clock (factory only). |
| Broche V1 | VDDPLL — PLL analog supply (1.5 V). |
| Broche W3 | VSSPLL — PLL analog ground. |
| Broche Y5 | RESET — Device reset (active low, open-drain). |
| Broche AA7 | RSTOUT — Reset output (drives external reset). |
| Broche AB9 | XTAL — Crystal oscillator input for system PLL. |
| Broche AC11 | EXTAL — Crystal oscillator output or external clock input. |
| Broche AD13 | VSTBY |
| Broche AE15 | BKPT — Background-debug breakpoint request. |
| Broche AF16 | DSCLK — BDM debug serial clock (real-time debug). |
| Broche T1 | NC — Not connected (per datasheet). |
| Broche T2 | NC — Not connected (per datasheet). |
| Broche T3 | NC — Not connected (per datasheet). |
| Broche T5 | NC — Not connected (per datasheet). |
| Broche T7 | NC — Not connected (per datasheet). |
| Broche T9 | NC — Not connected (per datasheet). |
Applications typiques
MCF5234CVM150J convient pour 6 applications: Industrial Ethernet Gateways, Building Automation Controllers, Factory Automation and PLC Communication Modules, POS Terminals and Payment Processors, Embedded Protocol Converters, Edge IoT Gateways for SCADA.
Industrial Ethernet Gateways
The MCF5234CVM150J is engineered for industrial Ethernet gateways where deterministic protocol conversion matters. Its 150 MHz ColdFire V2 core, 64 KB SRAM and integrated 10/100 Ethernet MAC with MII/RMII enable EtherNet/IP, PROFINET, and Modbus TCP message handling without an external PHY controller. The hardware eMAC engine offloads AES/DES encryption for OPC UA and TLS sessions, while dual CAN 2.0B controllers bridge to legacy CANopen fieldbuses on the shop floor. Compared to a discrete MCU + external MAC + crypto-chip design, this single-chip solution shrinks BOM and PCB area, which is critical for DIN-rail gateways.
Recommandé
Building Automation Controllers
Building automation controllers (BAC) rely on multi-protocol support on a single silicon platform. The MCF5234CVM150J combines dual CAN 2.0B for BACnet MS/TP and CANopen HVAC buses, three UARTs for RS-485 Modbus, and a 10/100 Ethernet MAC for IP-based BMS backbones. At 150 MHz, the ColdFire V2 core processes BACnet/Modbus traffic tables in real time while the 16-channel DMA engine streams sensor data directly to memory. The 97 GPIO lines drive LCD-keypad interfaces, status LEDs and relay outputs typical of thermostats, lighting controllers and access panels.
Recommandé
Factory Automation and PLC Communication Modules
PLCs and remote I/O blocks integrate the MCF5234CVM150J as a communication coprocessor or as the main controller for protocol converter modules. Its ColdFire V2 ISA is binary-compatible with older M68k firmware, easing porting of motor-control libraries from MC68332 designs. The 150 MHz core drives deterministic EtherCAT or Ethernet/IP scan cycles well within 1 ms, while the 64 KB SRAM hosts protocol stacks without external memory wait states. The 256-MAPBGA footprint enables compact 50 mm x 60 mm modules for snap-on field installation.
Recommandé
POS Terminals and Payment Processors
Point-of-sale terminals need secure encrypted communications and multiple peripheral interfaces in a compact design. The MCF5234CVM150J's hardware eMAC engine accelerates AES/DES for PCI-PTS card-data encryption while the ColdFire V2 core runs the payment application stack in uClinux or RTOS. Three UARTs connect to PIN pads and receipt printers, two I2C channels talk to contactless/NFC front-ends, and the Ethernet MAC feeds IP-based payment gateways. The hardware encryption offload reduces CPU load by 30-50% compared with software crypto on a bare 150 MHz core.
Recommandé
Embedded Protocol Converters
Industrial protocol converters bridge Modbus RTU on RS-485 to Modbus TCP over Ethernet, or PROFIBUS to PROFINET. The MCF5234CVM150J has the right mix of UARTs, CAN, I2C and Ethernet MAC to act as a multi-protocol hub on the factory floor. The 16-channel DMA engine streams I/O data into SRAM without CPU intervention, and the V2 ColdFire core's deterministic interrupt response keeps message latency under 250 microseconds even at full load. The 97 GPIO count simplifies routing discrete I/O channels through the converter without external expansion chips.
Recommandé
Edge IoT Gateways for SCADA
Industrial IoT edge gateways for SCADA aggregation require Ethernet for uplink and CAN/UART for legacy sensor clusters. The MCF5234CVM150J handles MQTT/Sparkplug-B publish cycles, TLS-secured EtherNet/IP scanning and on-device data buffering in the 64 KB SRAM. With the eMAC hardware encryption, secure-boot handshakes and message authentication codes run without overloading the application core. The wide 256-BGA integration lets gateway OEMs shrink the controller footprint to under 25 mm^2, leaving PCB room for isolated serial drivers and RF modules like LTE-M or LoRaWAN on the same board.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF5234CVM150J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF5234CVM100 | MCF5234CVM100J | MCF5235CVM150 | MCF5232CVM150 | MCF5233CVM100J |
|---|---|---|---|---|---|---|
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock (max) | 150 MHz | 100 MHz | 100 MHz | 150 MHz | 150 MHz | 100 MHz |
| eTPU | Not present | Not present | Not present | 16-channel eTPU | Not present | Not present |
| CAN 2.0B controllers | 2 | 2 | 2 | 2 | 2 | 2 |
| Lifecycle | Obsolete (legacy) | Mature/Legacy | Mature/Legacy | Mature/Legacy | Mature/Legacy | Mature/Legacy |
| GPIO count | 97 | 97 | 97 | 97 | 97 | 97 |
Principaux différenciateurs
- Integrates hardware eMAC encryption alongside Ethernet MAC (vs MCF5232CVM150)
- 150 MHz top-of-family clock without eTPU (vs MCF5235CVM150)
- Highest-frequency ColdFire V2 in the family at 150 MHz (vs MCF5234CVM100J)
Notes de conception
The 256-MAPBGA (17x17 mm) has a thermal resistance (theta_JA) that depends heavily on the PCB stack-up and copper plane count. Estimated: with a 4-layer board and 4 thermal vias under the central ball array, theta_JA stays near 25 C/W. For 150 MHz operation with all peripherals enabled, the core typically dissipates around 0.6-0.8 W; place decoupling directly under the BGA and tie ground balls to inner-plane ground islands to avoid hot spots. Always check the derating curve in NXP datasheet section 6 for junction temperatures against ambient.
The MCF5234CVM150J uses a split-rail supply: 1.5 V for the core and 3.3 V for I/O. Both rails must ramp monotonically and reach stable regulation before the reset line is released. Per the Freescale/NXP datasheet, hold RESET low until both VDD and VDDIO settle to within 5% of nominal. Place 100 nF X7R decoupling on every power-supply ball and a 10 uF bulk tantalum near the package. Power-supply sequencing should use a supervisor IC (e.g., MC33164) rather than RC delays for deterministic boot.
The MAPBGA has 1.27 mm ball pitch and requires via-in-pad or dog-bone fan-outs for clean escape routing. Keep trace impedance 50 ohms for SDRAM address/data and match trace lengths within 100 ps for DQS strobes to the external memory controller. Use a continuous ground plane under the BGA to minimise EMI and provide a low-impedance return path for switching currents. Allocate at least 2 mm clearance between BGA and other components to allow inspection.
The MCF5234CVM150J is ROMless: there is no on-chip non-volatile storage. Boot code must reside in external Flash (typically a 16-bit parallel CFI Flash) wired to Chip-Select 0 (CS0) on the external bus. Mis-configuring the bus width (8 vs 16 vs 32 bit) or the chip-select wait states can lock out the device. Always verify the boot-mode pins strap to the correct mode at power-up using the datasheet section 2.1 signal-pinning table.
The 150 MHz core and SDRAM controller generate edges up to 100 MHz equivalent frequency on parallel address/data buses. Use series damping resistors (22-33 ohm) on address and command lines to suppress ringing. Keep clock and strobe traces impedance-matched and length-matched within 50 ps. Differential pair routing rules apply for the MII Ethernet outputs to the PHY; if using RMII, route TX/RX pairs as 50 ohm controlled-impedance lines to match the PHY datasheet.
Informations de conformité
Compliance status not stated in the verified web snippets; verify on NXP product page or directly via the NXP compliance portal before procurement. AEC-Q100 is not_applicable for this industrial MPU grade.
