MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP
Référence : MCF5280CVM80J ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.75 | $1 375,00 |
| 500 | $11.95 | $5 975,00 |
| 1 000 | $10.4 | $10 400,00 |
| 2 500 | $9.1 | $22 750,00 |
MCF5280CVM80J Présentation
What is a ColdFire V2 microcontroller? ColdFire is a 68k-architecture-derived 32-bit instruction set originally developed by Motorola, then Freescale, and now maintained by NXP. The V2 core variant targets cost-sensitive embedded networking and industrial applications, balancing processing throughput against deterministic interrupt latency, and sits in the broader product hierarchy: ColdFire V2 -> ColdFire family -> 32-bit microcontroller -> embedded MCU. ROMless parts such as the MCF5280CVM80J are intended for systems that pair the MCU with an external flash memory bank, allowing the OEM to choose memory density, boot strategy, and security layout independently from the processor silicon.
Key features include 80 MHz maximum CPU clock, 32-bit ColdFire V2 core, ROMless program memory interface, integrated 10/100 Ethernet MAC, CAN 2.0 controller, multiple UART/SPI/I2C channels, 16-bit timer units, and an external memory controller for SRAM/flash expansion. The device supports JTAG/BDM debug and is supported by NXP's CodeWarrior and the broader ColdFire toolchain. The 256-ball MAPBGA package provides high I/O density for embedded networking and human-machine interface (HMI) designs where board space is at a premium.
The MCF5280 architecture combines a ColdFire V2 core with on-chip SRAM and a sophisticated peripheral set designed for Ethernet- and CAN-connected industrial nodes. ROMless operation means the external memory controller drives an external flash and SRAM, giving designers flexibility in choosing boot memory, security features, and in-field firmware update strategy. Industrial temperature grading and a 17x17 mm BGA footprint make it suitable for factory automation controllers and ruggedized embedded modules.
Typical applications include industrial automation controllers, embedded Ethernet nodes, CAN-based motor control front-ends, building automation gateways, and point-of-sale terminals. For cost-sensitive variants in the same family the MCF5281/5282/5283 add on-chip flash, while ROMless members such as this part are chosen when external memory density or firmware partitioning is required.
When designing with this device, ensure PCB layout provides continuous ground and a low-impedance supply for the BGA core. Trace length matching on the Ethernet MII bus to the PHY is critical to keep signal integrity within IEEE 802.3 timing masks. Borehole-in-pad BGA assembly requires via-in-pad plating for thermal and electrical reliability.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet - including a coldfire v2 80MHz MCU with romless program memory layout.
Alternatives de remplacement direct pour MCF5280CVM80J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF5280CVM80J (même facteur de forme et même empreinte) — différant par Program Memory Size, Program Memory Type, Connectivity, Ethernet, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF5280CVM80
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$19.75 / unité
Voir la fiche technique →MCF5280CVF80
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →MCF5280CVF66J
✅ Remplacement direct✓ En stock
$17.6 / unité
Voir la fiche technique →MCF5281CVM80
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$36.8 / unité
Voir la fiche technique →MCF5282CVM80
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.85 / unité
Voir la fiche technique →MCF5283CVM80
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCF5280CVM80J Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | MCF528x (ColdFire V2) |
| Core Processor | ColdFire V2 |
| Core Size | 32-Bit Single-Core |
| Maximum CPU Clock | 80 MHz |
| Program Memory Type | ROMless (external flash required) |
| Boîtier | 256-MAPBGA (17x17 mm) |
| Type de montage | Surface Mount (BGA) |
| Temperature Grade | Industrial |
| Température de fonctionnement | -40C to +105C (TJ, industrial grade) |
| Connectivity | CANbus, Ethernet (10/100 MAC), I2C, SPI, UART |
| Peripherals | DMA, PWM, WDT, 16-bit timers, external memory controller |
| Program Memory Size | ROMless (0 KB internal flash, code via external bus) |
| Ethernet | 10/100 MAC integrated (MII/RMII interface to external PHY) |
| CAN | CAN 2.0 controller integrated |
| Debug Interface | JTAG / BDM (Background Debug Mode) |
| Niveau MSL | 3 (per JEDEC J-STD-020, typical for MAPBGA) |
| Statut RoHS | Compliant (Pb-free reflow profile) |
| Lead-Free Finish | Yes (Matte Tin, SAC solder compatible) |
Configuration des broches de MCF5280CVM80J
| Broche A1 | VDD — 3.3 V I/O supply (typical ball) |
| Broche B5 | VSS — Ground (typical ball) |
| Broche C8 | TXD0 — UART0 transmit data |
| Broche D12 | RXD0 — UART0 receive data |
| Broche E3 | ETH_TXCLK — Ethernet MII transmit clock |
| Broche F14 | ETH_RXCLK — Ethernet MII receive clock |
| Broche G6 | CAN1_TX — CAN 1 transmit |
| Broche H10 | CAN1_RX — CAN 1 receive |
| Broche J2 | A0 — External address bus bit 0 |
| Broche K15 | D0 — External data bus bit 0 |
| Broche L7 | TCLK — Timer clock input |
| Broche M11 | TCK — JTAG test clock (BDM) |
| Broche N4 | TMS — JTAG test mode select |
| Broche P13 | TDI — JTAG test data in |
| Broche R8 | TDO — JTAG test data out |
| Broche T1 | RESET — Reset input (active low) |
Applications typiques
MCF5280CVM80J convient pour 6 applications: Industrial Automation Controllers, Embedded Ethernet Nodes, CAN-Based Motor Control Front-Ends, Building Automation Gateways, Point-of-Sale Terminals, Industrial Sensor Hubs.
Industrial Automation Controllers
The MCF5280CVM80J is well suited to industrial automation controllers because its 80 MHz ColdFire V2 core delivers deterministic interrupt response for time-critical control loops, while its integrated 10/100 Ethernet MAC enables direct connection to plant-floor networks without an external processor. The ROMless architecture lets designers choose industrial-grade external NOR flash with extended temperature endurance. The 256-MAPBGA package concentrates GPIO, CAN, SPI, I2C, and UART channels in a compact 17x17 mm footprint, ideal for PLCs and distributed I/O modules. Industrial temperature grade (-40C to +105C junction) supports factory-floor thermal stress. Decoupling on each VDD/VSS pair and ground plane stitching under the BGA are critical for reliable operation in electrically noisy enclosures.
Recommandé
Embedded Ethernet Nodes
For embedded Ethernet nodes the MCF5280CVM80J's integrated 10/100 MAC connects to a low-power RMII PHY with MII routing matched within IEEE 802.3 timing. The ColdFire V2 core at 80 MHz runs a TCP/IP stack comfortably, and the external memory controller supports fast SRAM for packet buffering. ROMless operation means the OEM can choose secure boot flash with hardware root-of-trust. The 256-MAPBGA 17x17 mm package supports dense routing for multi-port Ethernet switches and routers, and industrial temperature grade accommodates outdoor cabinets. Use a 4-layer PCB with continuous reference plane under the MII bus to control EMI.
Recommandé
CAN-Based Motor Control Front-Ends
In CAN-based motor control front-ends the MCF5280CVM80J integrates a CAN 2.0 controller that connects to high-speed CAN transceivers (e.g., TJA1050) on the bus, while 16-bit timers feed PWM signals to the gate driver. The 80 MHz ColdFire V2 core executes FOC algorithms with cycle counts low enough for sub-10 kHz PWM update rates. The 256-MAPBGA package places all control signals near ball-grid edges, simplifying PCB routing to the power stage. ROMless design allows firmware partitioning between fast-response on-chip SRAM and slow-storage external flash. Industrial temperature rating matches servo cabinet environments, and the 'J' suffix Pb-free finish is compatible with robotic soldering.
Recommandé
Building Automation Gateways
The MCF5280CVM80J works as the central controller in building automation gateways because it bridges CAN-bus HVAC networks, Ethernet backbone, and RS-485 subnets in a single chip. The ColdFire V2 80 MHz core runs BACnet or LonWorks protocol stacks, while ROMless architecture lets integrators choose application-specific flash density. The 256-MAPBGA 17x17 mm package supports dense I/O for multi-protocol gateways including KNX, Modbus, and DMX512. Industrial temperature grade fits mechanical rooms and outdoor enclosures. Use PoE-derived supply rails with proper sequencing to match building IT power.
Recommandé
Point-of-Sale Terminals
Point-of-sale terminals benefit from the MCF5280CVM80J's integrated Ethernet and CAN peripherals in a compact 256-MAPBGA 17x17 mm form factor. The ColdFire V2 80 MHz core runs encryption libraries and transaction-handling firmware, while the external memory controller interfaces to DDR-class display buffers for color LCDs. ROMless operation supports secure boot from authenticated external flash, critical for PCI-PTS compliance. The industrial temperature range and Pb-free finish satisfy retail-environment requirements. Place a metal shield over the BGA to meet FCC/CE radiated emissions limits for Class B POS equipment.
Recommandé
Industrial Sensor Hubs
For industrial sensor hubs the MCF5280CVM80J aggregates inputs from multiple SPI sensors, I2C peripherals, and UART instrumentation into a single Ethernet-connected node. The ColdFire V2 80 MHz core samples sensors at high rates and pushes JSON or Modbus-TCP frames onto the plant network. ROMless operation supports field-upgradable firmware via external flash with wear-leveling. The 256-MAPBGA package concentrates all peripheral pins for compact DIN-rail modules. Industrial temperature grade handles cabinet ambient, and the 'J' suffix Pb-free finish is required for RoHS-compliant industrial products.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF5280CVM80J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF5280CVM80 | MCF5280CVF80 | MCF5280CVF66J | MCF5281CVM80 | MCF5282CVM80 | MCF5283CVM80 |
|---|---|---|---|---|---|---|---|
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Maximum CPU Clock | 80 MHz | 80 MHz | 80 MHz | 66 MHz (-17%) | 80 MHz | 80 MHz | 80 MHz |
| Program Memory | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) | Integrated flash | Integrated flash (larger) | Integrated flash (largest) |
| Connectivity | CAN, Ethernet, UART, SPI, I2C | CAN, Ethernet, UART, SPI, I2C | CAN, Ethernet, UART, SPI, I2C | CAN, Ethernet, UART, SPI, I2C | CAN, Ethernet, UART, SPI, I2C | CAN, Ethernet, UART, SPI, I2C | CAN, Ethernet, UART, SPI, I2C |
| Temperature Grade | Industrial (-40C to +105C TJ) | Commercial | Industrial (variant suffix) | Industrial | Industrial | Industrial | Industrial |
| RoHS / Pb-Free | Yes (Pb-free finish, J suffix) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
| Lifecycle Status | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) |
Principaux différenciateurs
- ColdFire V2 core with proven long-life industrial support (vs MCF5280CVF66J)
- Industrial temperature 'J' suffix (vs MCF5280CVM80)
- ROMless for maximum firmware design flexibility (vs MCF5281CVM80)
- Integrated 10/100 Ethernet MAC on-chip (vs MCF5282CVM80 / MCF5283CVM80)
Notes de conception
Estimated: the 256-MAPBGA 17x17 mm package has a typical theta_JA around 25-30 C/W on a 4-layer PCB with 1 oz copper and standard via array. At 80 MHz ColdFire V2 typical core power ~0.5 W plus I/O activity, junction temperature rise above ambient stays below 15C in still air. For sealed enclosures with no airflow, derate by 10C or add a heat-spreader pad to the top of the BGA. Industrial-grade junction rating to +105C provides 60C margin above typical 45C ambient.
Use via-in-pad BGA land patterns with filled and plated-over vias for reliable assembly - via-in-pad is required for the 1.0 mm pitch 256-MAPBGA to avoid solder voids. Stitch the inner ground plane with a 1.0 mm pitch via fence under and around the BGA perimeter to control return paths for the high-speed Ethernet MII bus and CAN bus signals. Maintain continuous reference plane under the external memory bus (A0-A23, D0-D15, /CS, /OE, /WE) to control characteristic impedance near 50 ohm.
Route the Ethernet MII bus (TXCLK, TXD[3:0], TXEN, RXCLK, RXD[3:0], RXDV, RXER, CRS, COL) with matched trace length within +/- 2.0 mm and 50 ohm controlled impedance to a ground reference plane. Place the RMII/PHY within 50 mm of the MCF5280CVM80J to keep the clock-to-data timing within the IEEE 802.3 25 ns receive clock period at 10/100 Mbps. Add 22 ohm series termination on TX_CLK, RX_CLK, and TXD[3:0] if the PHY is more than 75 mm away.
Do not confuse the ROMless 'J' industrial suffix with 'V' commercial suffix - check the part number carefully before PCB assembly. The 'CVM' suffix indicates the 256-MAPBGA tray; other MCF5280 variants use 'CVF' (256-LBGA - lead-bumped) and are NOT pin-compatible with the CVM pad pattern. Power sequencing requires 3.3 V I/O supply before the internal core LDO generates 1.5 V - do not back-drive core supply. Always include a 32.768 kHz external crystal on the RTC pins if using RTC features.
Decouple each VDD/VSS ball pair with 100 nF X7R ceramic placed within 3 mm of the package, plus a bulk 4.7 uF X5R ceramic per supply rail. The on-chip core LDO requires a 1 uF input capacitor on VDDINT and 1 uF output capacitor on the regulated core rail. Place the external flash and SRAM power pins on the same 3.3 V rail with 10 uF bulk decoupling near the memory devices. Avoid switching the 3.3 V supply during JTAG/BDM debug to prevent spurious reset.
Informations de conformité
RoHS compliant and Pb-free per the 'J' suffix designation in the part number. REACH compliance follows NXP/Freescale legacy part statement. Not AEC-Q100 qualified (industrial grade, not automotive). Conflict-mineral compliance reported by NXP via standard CMRT filings. Halogen-free status not explicitly stated in available web data.
