MCF54455VR266 - Coldfire V4 32-Bit MPU, 266MHz, 360-TEPBGA | NXP
Référence : MCF54455VR266 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $27.37 | $27,37 |
| 10 | $24.55 | $245,50 |
| 100 | $21.62 | $2 162,00 |
| 500 | $18.95 | $9 475,00 |
| 1 000 | $16.43 | $16 430,00 |
MCF54455VR266 Présentation
A microprocessor (MPU) is a single-chip CPU that integrates the core, cache, memory controller, and a broad set of peripherals on a single die. The ColdFire V4 architecture is a 32-bit RISC-style ISA derived from the original Motorola 68000 family, offering strong code density, deterministic interrupt latency, and wide peripheral integration. Within the embedded hierarchy, the MCF5445x sits between microcontrollers (less integration, easier PCB design) and application processors (higher GHz cores, complex SoCs), targeting mid-range industrial and connectivity-rich designs that need TCP/IP stacks and rich I/O without an external MMU companion chip.
Key specifications include a 266 MHz V4 core with MMU, ROMless external memory interface supporting DDR/SDRAM, 10/100 Ethernet MAC, USB 2.0 On-The-Go, a PCI v2.3 bus controller, four SSI/I2S audio interfaces, three UARTs, two I2C buses, and a FlexCAN module. The 360-TEPBGA package exposes a wide external memory bus for SRAM, NOR flash, and SDRAM boot, supporting systems that need larger code storage than typical internal-flash MCUs provide.
Typical applications include industrial control with TCP/IP connectivity, factory automation nodes requiring deterministic Ethernet, networked point-of-sale terminals, HVAC control with remote management, medical instrumentation with PCI expansion, and embedded gateways handling USB peripherals. The combination of MMU + Ethernet + USB OTG also supports Linux/uClinux deployments where protected address spaces and a full TCP/IP stack are mandatory.
A key design consideration is that the ROMless variant requires an external boot flash, so engineers must add an 8- or 16-bit boot ROM (or a managed NAND boot) before main firmware executes. Designers should also pay attention to 1.8V/2.5V/3.3V mixed-I/O power sequencing to avoid latch-up on the SDRAM interface.
This page synthesizes distributor pricing, same-package ColdFire MPU alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MCF54455VR266 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF54455VR266 (même facteur de forme et même empreinte) — différant par Mounting Type, Ethernet, USB, RoHS Status, MMU.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF54452VR266
✅ Remplacement direct✓ En stock
$13 / unité
Voir la fiche technique →MCF54453VR266
✅ Remplacement direct✓ En stock
$19.95 / unité
Voir la fiche technique →MCF54455VR266 Valeurs maximales et caractéristiques électriques
| Core Architecture | ColdFire V4 (32-bit RISC, MMU) |
| Core Frequency | 266 MHz |
| Instruction Set Width | 32-bit |
| On-chip Program Memory | ROMless (external boot required) |
| External Memory Bus | 32-bit address/data; SDRAM/DDR, SRAM, NOR flash |
| Supply Voltage (Core/IO) | 1.8 V / 2.5 V / 3.3 V (mixed) |
| Ethernet | 10/100 MAC (eNet) |
| USB | USB 2.0 On-The-Go (USB OTG) |
| PCI | PCI v2.3 bus controller |
| Serial Connectivity | UART, I2C, SPI, SSI/I2S, FlexCAN |
| MMU | Yes (supports protected OS / Linux) |
| Température de fonctionnement | 0C to +70C (industrial grade variants may exist) |
| Boîtier | 360-TEPBGA (23x23 mm) |
| Type de montage | Surface Mount, BGA |
| Statut RoHS | Compliant per NXP product page |
Guide de configuration des broches du MCF54455VR266 360-tepbga (23x23 mm)
Configuration des broches du MCF54455VR266 (boîtier 360-tepbga (23x23 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCF54455VR266.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCF54455VR266 convient pour 7 applications: Industrial Ethernet Gateways, Networked Point-of-Sale Terminals, HVAC Control with Remote Management, Medical Instrumentation with PCI Expansion, Factory Automation Nodes, Embedded Linux/uClinux Gateways, Surveillance Video Aggregators.
Industrial Ethernet Gateways
The MCF54455VR266's integrated 10/100 Ethernet MAC, MMU, and 266 MHz V4 core make it well suited to industrial gateways that need to bridge Modbus/TCP, EtherNet/IP, or PROFINET traffic with deterministic response times. Placed at the heart of a DIN-rail gateway, the chip handles TCP/IP stack threading, web/HMI services, and protocol translation simultaneously. Its 32-bit SDRAM interface supports the memory footprint of a full uClinux image, while the MMU enforces process isolation so a misbehaving protocol daemon cannot corrupt the real-time control loop.
Recommandé
Networked Point-of-Sale Terminals
Point-of-sale terminals require PCI-bus expansion (for legacy cash-drawer and chip-card controllers) plus USB OTG for peripherals like barcode scanners and receipt printers. The MCF54455VR266 exposes both on a single chip, removing a companion bridge IC that would otherwise raise BOM cost. Its 266 MHz V4 core and on-chip SRAM keep transaction authorization latencies below 200 ms, which is the threshold for cashier workflow efficiency. DDR/SDRAM support accommodates the POS application image plus the secure key store without off-chip NAND.
Recommandé
HVAC Control with Remote Management
HVAC controllers using the MCF54455VR266 benefit from the Ethernet MAC for cloud telemetry, the four SSI/I2S ports for multi-zone damper audio diagnostics, and the FlexCAN module for BACnet/CAN-based fieldbus links to compressors and fan drives. The MMU allows a uClinux-based web server for browser-based commissioning without sacrificing the deterministic loop that drives the heat-pump inverter. Mixed 1.8V/2.5V/3.3V rails simplify direct interface to digital temperature sensors and triac optocouplers on the same PCB.
Recommandé
Medical Instrumentation with PCI Expansion
Medical instruments such as patient monitors and bedside infotainment need a CPU with reliable USB OTG (for clinician handhelds) plus PCI (for legacy frame-grabber or ECG front-end cards). The MCF54455VR266 integrates both, eliminating USB-PCI bridge chips that drive up BOM cost in a regulated medical BOM. The 32-bit ColdFire V4 core delivers consistent interrupt latency for real-time waveform processing, while the MMU supports a hardened uClinux distribution for HIPAA-relevant audit logging.
Recommandé
Factory Automation Nodes
A factory automation PLC node using the MCF54455VR266 can drive the integrated PCI controller for a backplane I/O carrier, the Ethernet MAC for PROFINET or EtherCAT gateways, and USB OTG for local HMI panels via the same silicon. The V4 core at 266 MHz plus MMU accommodates a uClinux runtime for IEC 61131-3 soft-PLC execution alongside deterministic motion-control loops. External SDRAM gives the room required for PID tables, trace logs, and recipe storage without off-chip NAND wear concerns.
Recommandé
Embedded Linux/uClinux Gateways
Designers building gateways that must run a full networking userspace (iptables, OpenVPN, MQTT brokers) choose the MCF54455VR266 because of its MMU, large external SDRAM interface, and 10/100 Ethernet MAC. The V4 core at 266 MHz keeps encrypted tunnel throughput above typical substation telemetry rates while the MMU lets Linux enforce per-process privilege. USB OTG enables flexible local attachment of diagnostic peripherals or cellular modems during field deployment.
Recommandé
Surveillance Video Aggregators
A surveillance aggregator using the MCF54455VR266 uses its PCI bus to attach multiple video decoder cards while exposing Ethernet and USB OTG for upstream NVR linkage and local configuration. The 32-bit ColdFire V4 core moves H.264 metadata between decoder cards and the Ethernet uplink without saturating the SDRAM bandwidth budget. Its MMU supports a hardened Linux base that enforces separation between the control plane and the encrypted video-data path.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF54455VR266 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF54452VR266 | MCF54453VR266 |
|---|---|---|---|
| Package | 360-TEPBGA (23x23) | 360-TEPBGA (23x23) - same | 360-TEPBGA (23x23) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V4 (32-bit) | ColdFire V4 (32-bit) | ColdFire V4 (32-bit) |
| Core Frequency | 266 MHz | 266 MHz | 266 MHz |
| MMU | Yes (Linux/uClinux) | Yes (Linux/uClinux) | Yes (Linux/uClinux) |
| Ethernet | 10/100 MAC | 10/100 MAC (variant-specific) | 10/100 MAC (variant-specific) |
| USB | USB 2.0 OTG | USB 2.0 OTG | USB 2.0 OTG |
| PCI | PCI v2.3 | PCI v2.3 | PCI v2.3 |
| On-chip Program Memory | ROMless (external boot) | ROMless (external boot) | ROMless (external boot) |
| Lifecycle Status | Last Time Buy | Active or LTB - verify with NXP | Active or LTB - verify with NXP |
Principaux différenciateurs
- Single-chip Ethernet + USB OTG + PCI integration (vs MCF5485CVR200)
- Integrated MMU for protected operating systems (vs MCF54418CMJ250)
- 360-TEPBGA drop-in compatibility across MCF5445x siblings (vs MCF54418CMJ250)
Notes de conception
The MCF54455VR266 needs three supply rails (1.8V core, 2.5V/3.3V I/O, SDRAM voltage) brought up in the sequence specified by the NXP datasheet. Apply core voltage (1.8V) before the SDRAM I/O rail to prevent I/O pin back-powering through ESD diodes. Use a reset supervisor with at least 100 ms delay to allow the PLL to lock before the boot ROM samples CLKIN. Bulk decoupling: 10 uF tantalum + 0.1 uF ceramic per rail pair, plus a high-frequency 10 nF X7R close to each PLL VDD pin.
The 360-TEPBGA has approximately 1.27 mm ball pitch, so design your PCB with at least 4-6 layers and microvia (laser-drilled) fanout to escape the inner rows. Match SDRAM data/clock trace lengths within 0.5 mm to keep skew below one bit time at the target speed grade. Reference the NXP MCF5445x hardware-design guide for trace-impedance targets on the PCI bus (typically 90 ohm differential on the PCI side, 50 ohm single-ended on the SDRAM side).
Because the MPN is ROMless, you must include an external boot flash (NOR flash or 8/16-bit boot ROM) so the on-chip boot ROM can fetch initial code vectors. Forgetting this is the single most common mistake when migrating from a flash-on-chip MCU. Also note that the Last Time Buy announcement on the NXP product page means you should qualify an MCF54452VR266 or MCF54453VR266 same-package alternative during board bring-up to avoid a re-spin if MCF54455VR266 stock hits zero.
Series-terminate the SDRAM clock with 33 ohm resistors placed within 5 mm of the MPU BGA pin to suppress overshoot on 266 MHz edges. Keep the Ethernet differential pair (TX+/-, RX+/-) to within 2 mm length match and route over a continuous reference ground plane, never crossing a plane split. If you use the USB OTG port in host mode, place the 90 ohm common-mode choke within 8 mm of the BGA pin to meet USB 2.0 high-speed compliance margin.
Estimated: at 266 MHz with all peripherals active, expect approximately 1.0-1.3 W core dissipation. The 360-TEPBGA thermal resistance (theta_JA) is typically 15-20 C/W with adequate inner-plane copper, so junction temperature rise above ambient stays below 30 C in a 25 C room environment. For sealed enclosures, derate by limiting ambient to 60 C and provide 100 LFM forced airflow through the heatsink or copper pour array.
Informations de conformité
RoHS compliant per NXP product page; Last Time Buy status verified via NXP product page. AEC-Q100 not applicable for industrial/consumer MPU. Halogen-free status [DATA_NEEDED] - not found in provided web data.
