MCIMX253CVM4 - i.MX25 ARM9 MPU 400MHz 400-LFBGA | NXP
Référence : MCIMX253CVM4 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.4 | $254,00 |
| 100 | $22.1 | $2 210,00 |
| 500 | $19.85 | $9 925,00 |
| 1 000 | $17.95 | $17 950,00 |
MCIMX253CVM4 Présentation
An ARM9 microprocessor (MPU) is a 32-bit RISC processor core that integrates memory management, instruction, and data caches plus a flexible peripheral set onto a single die; the i.MX25 family is NXP's long-lifecycle industrial-grade ARM926EJ-S line that sits within the broader i.MX applications processor taxonomy (i.MX25 -> i.MX applications processor -> applications MPU -> embedded processor -> semiconductor). This taxonomy makes the part suitable for engineers who need deterministic Linux or WinCE behavior without migrating to a Cortex-A class core.
Key features include 400 MHz ARM926EJ-S core with 16 KB instruction cache and 16 KB data cache, integrated DDR/DDR2 memory controller supporting up to 1 GB, and a rich peripheral set covering dual 10/100 Ethernet MACs, USB 2.0 OTG with PHY, four UARTs, three SPI, two I2C, two I2S/AC97 audio ports, and a hardware cryptographic accelerator (MAX, SHA-1, TRNG). Display support is provided through an LCD controller capable of up to XGA resolution, while connectivity includes a 12-bit ADC and PWM for motor and lighting control.
The device is fabricated in a low-leakage 90 nm CMOS process and operates across a -40C to +85C industrial temperature range. The 400-LFBGA package exposes both industrial buses and parallel memory interfaces, allowing mixed-voltage designs without external level shifters on most rails.
Typical applications include industrial HMI panels, factory automation controllers, point-of-sale terminals, energy-meter gateways, and connectivity-enabled IoT edge nodes. Designers also deploy i.MX25 in medical point-of-care instruments and e-ink/e-paper signage where Linux support and long-term supply continuity matter more than raw MHz.
When designing with this part, allocate area for a 4-layer PCB with continuous reference planes beneath the 400-ball grid to preserve DDR2 signal integrity and to keep via stubs below the package keep-out zone. Use NXP's MCIMX25 Linux BSP and DDR calibration script (i.MX25 TO1.1 reference design) before tape-out because DDR2 timing margins on LFBGA are tighter than on equivalent BGA parts from newer i.MX families.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes from the manufacturer datasheet and reference design.
Alternatives de remplacement direct pour MCIMX253CVM4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCIMX253CVM4 (même facteur de forme et même empreinte) — différant par Package, Mounting Type, Core Architecture, Ethernet, Operating Temperature Range.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCIMX257CVM4
✅ Remplacement direct✓ En stock
$19.4 / unité
Voir la fiche technique →MCIMX253CJM4
✅ Remplacement direct✓ En stock
$17.65 / unité
Voir la fiche technique →MCIMX257DJN4D
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCIMX25WPDK
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCIMX27LMOP4A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMA5D31A-CUR
✅ Remplacement direct✓ En stock
$12.85 / unité
Voir la fiche technique →MCIMX253CVM4 Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM926EJ-S |
| Number of Cores | 1 |
| Largeur du bus de données | 32 bit |
| Fréquence d'horloge maximale | 400 MHz |
| Plage de température de fonctionnement | -40C to +85C |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Memory Controller | DDR/DDR2, up to 1 GB |
| Ethernet | 2x 10/100 MAC |
| USB | USB 2.0 OTG with PHY |
| Display Controller | LCD, up to XGA |
| Cryptographic Accelerator | AES, DES, SHA-1, TRNG |
| Boîtier | 400-LFBGA (MAPBGA) 17x17 mm |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Process Technology | 90 nm CMOS |
Configuration des broches de MCIMX253CVM4
| Broche A1 | VDD — Core supply |
| Broche B1 | VSS — Ground |
| Broche G10 | DDR_A0 — DDR2 address line 0 |
| Broche H10 | DDR_DQM0 — DDR2 data mask 0 |
| Broche J20 | USB_DP — USB 2.0 OTG D+ |
| Broche J19 | USB_DM — USB 2.0 OTG D- |
| Broche L20 | JTAG_TCK — JTAG test clock |
| Broche L19 | JTAG_TMS — JTAG test mode select |
| Broche N20 | JTAG_TDI — JTAG test data in |
| Broche N19 | JTAG_TDO — JTAG test data out |
| Broche T18 | FEC_TXD0 — Ethernet MAC transmit data 0 |
| Broche T17 | FEC_RXD0 — Ethernet MAC receive data 0 |
| Broche U20 | LCD_DATA0 — LCD data line 0 |
| Broche U19 | LCD_PCLK — LCD pixel clock |
| Broche W20 | NVCC_LCD — LCD I/O supply |
Applications typiques
MCIMX253CVM4 convient pour 6 applications: Industrial Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, Energy Meter and Grid Gateways, Factory Automation Controllers, Connected Medical Point-of-Care Devices, IoT Edge Gateways and Sensor Hubs.
Industrial Human-Machine Interface (HMI) Panels
The NXP MCIMX253CVM4 drives industrial HMI panels where the ARM926EJ-S core, integrated LCD controller, and dual 10/100 Ethernet MACs let engineers ship a Linux-driven touchscreen in a compact footprint. Its 400 MHz headroom is sufficient for Qt/Embedded GUIs at WVGA resolution while the DDR2 controller keeps BOM cost lower than LPDDR designs. The 400-LFBGA package also enables ground-referenced stacking for ESD protection on the operator-facing side.
Recommandé
Point-of-Sale (POS) Terminals
POS terminals benefit from the MCIMX253CVM4's hardware cryptographic accelerator (AES, DES, SHA-1, TRNG) which accelerates PCI-compliant PIN encryption without offloading to an external secure element. The USB 2.0 OTG with PHY supports barcode scanners, printers, and contactless readers through a single port, while the two I2S channels deliver clean audio for transaction prompts. Industrial temperature grading suits unattended retail kiosks that face wide thermal swings near storefront glass.
Recommandé
Energy Meter and Grid Gateways
Smart energy meters and grid gateways use the MCIMX253CVM4 to run DLMS/COSEM or IEC 61850 stacks on top of a full Linux BSP, with the integrated crypto engine protecting firmware upgrade and key-exchange flows. The two Ethernet MACs support redundant fieldbus or HAN/LAN segmentation without an external switch, and the 12-bit ADC reads voltage and current sensors directly. Industrial -40C to +85C grading lets the design pass IEC 62052-11 outdoor reliability tests.
Recommandé
Factory Automation Controllers
Distributed I/O and PLC peripherals use the MCIMX253CVM4's EtherCAT or Modbus TCP stack to expose deterministic Ethernet performance through the integrated FEC MACs. The PWM and four UARTs drive motor pre-drivers and RS-485 sensor chains, while the watchdog timer plus hardware TRNG let the part meet IEC 62443 cybersecurity floor requirements for industrial nodes. The 400-LFBGA package exposes enough GPIO to fan out to 32+ isolated digital inputs without CPLD assist.
Recommandé
Connected Medical Point-of-Care Devices
Bedside diagnostic carts and connected point-of-care analyzers use the MCIMX253CVM4 to run secure Linux alongside clinical algorithms, benefiting from the hardware crypto engine for HIPAA-aligned transport encryption. Two audio I2S channels enable stethoscope auscultation paths, while the LCD controller drives clinician-facing color displays. Industrial-temperature grading and NXP's 10-year supply program help medical OEMs plan long lifecycle deployments that match FDA revalidation windows.
Recommandé
IoT Edge Gateways and Sensor Hubs
Industrial IoT edge gateways bridge legacy serial field equipment to cloud platforms by stacking an MQTT broker on a Linux BSP executed on the MCIMX253CVM4. The four UARTs and two I2C buses let designers aggregate multiple sensors without external multiplexers, while the cryptographic accelerator secures TLS handshakes. The compact 400-LFBGA fits inside DIN-rail enclosures with a 4-layer PCB that keeps the DDR2 reference plane continuous for signal-integrity compliance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCIMX253CVM4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCIMX257CVM4 | MCIMX253CJM4 | MCIMX257DJN4D | MCIMX27LMOP4A | ATSAMA5D31A-CUR |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | Microchip Technology - cross-brand |
| Package | 400-LFBGA (17x17) | 400-LFBGA (17x17) - same | 400-LFBGA (17x17) - same | 400-LFBGA (17x17) - same | 400-LFBGA - same | LFBGA-324 - same BGA family |
| Core | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | Cortex-A5 |
| Maximum CPU Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 536 MHz |
| Instruction Cache | 16 KB | 32 KB | 16 KB | 32 KB | 16 KB | 32 KB |
| Data Cache | 16 KB | 32 KB | 16 KB | 32 KB | 16 KB | 32 KB |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | 0C to +70C | -40C to +85C | -40C to +85C | -40C to +85C |
| Cryptographic Accelerator | AES/DES/SHA-1/TRNG | AES/DES/SHA-1/TRNG | AES/DES/SHA-1/TRNG | AES/DES/SHA-1/TRNG | External required | External required (or via SAMA5D3 secure variant) |
| Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 |
Principaux différenciateurs
- Hardware cryptographic accelerator included (vs MCIMX27LMOP4A)
- Industrial temperature range in the same package (vs MCIMX253CJM4)
- Mature long-lifecycle industrial roadmap (vs ATSAMA5D31A-CUR)
- Dual 10/100 Ethernet MACs integrated (vs ATSAMA5D31A-CUR)
Notes de conception
The 400-LFBGA package with 0.8 mm ball pitch requires a 4-layer PCB with continuous ground reference under the BGA keep-out zone. Use 0.4 mm laser-drilled micro-vias and avoid placing signal vias inside the keep-out to prevent DDR2 reference-plane discontinuities. NXP application note AN3393 outlines impedance targets of 50 ohm single-ended and 100 ohm differential for USB and Ethernet pairs.
Decouple each NVCC_x rail with one 100 nF X7R plus one 10 uF X5R ceramic capacitor within 3 mm of the ball, plus a bulk 22 uF tantalum per supply island. Core VCC (1.3 V typical) needs its own bulk and must ramp last under PMIC sequencing to avoid latch-up. Always run NXP's DDR2 calibration script (IMX25-DDR-Calibration) before locking the BOM because PCB-via variation on LFBGA designs shifts timing windows noticeably.
Estimated: with theta_JA around 15 C/W (400-LFBGA on 4-layer JEDEC test board) and 0.8 W CPU power at 400 MHz, junction temperature rises roughly 12 C above ambient. The industrial 85 C ceiling is comfortably met for indoor cabinets, but outdoor sealed enclosures may need a thermal pad or aluminum chassis coupling to keep Tj below 105 C during Linux stress tests.
Route DDR2 signals with matched-length groups within 25 mil of each other and keep impedance to 50 ohm +/- 10 percent with reference to a solid ground plane. Match USB 90 ohm differential on DP/DM and Ethernet 100 ohm differential on FEC_RXD/TXD pairs. Avoid routing any high-speed signal across the BGA center keep-out to maintain signal-integrity margins for USB-IF certification.
Do not use the JTAG_TCK pin in production designs without a weak pull-down because floating TCK is known to enter test mode on i.MX25. Always configure the watchdog timer at boot and enable the TRNG to seed any user-space cryptographic library. Reserving the BOOT_MODE pins with a dedicated resistor jumper is mandatory to support field firmware recovery via serial downloader mode.
Informations de conformité
RoHS compliant per NXP product page. Not AEC-Q100 qualified for automotive - the i.MX25 family is industrial-grade (not automotive). Halogen-free per NXP package materials declaration.
