MCIMX6DP6AVT1AA - i.MX6DualPlus 1GHz Dual A9 MPU | NXP
Référence : MCIMX6DP6AVT1AA ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $45.2 | $452,00 |
| 100 | $41 | $4 100,00 |
| 500 | $36.75 | $18 375,00 |
| 1 000 | $32.5 | $32 500,00 |
MCIMX6DP6AVT1AA Présentation
An applications processor is a system-on-chip (SoC) class integrated circuit designed to run an operating system (typically Linux or Android) and execute complex user applications, as opposed to a microcontroller that typically runs bare-metal or a small RTOS. Within the broader taxonomy, the i.MX6DualPlus sits in the chain: applications processor -> multimedia processor -> ARM Cortex-A based SoC -> NXP i.MX family -> NXP Layerscape/i.MX product portfolio. It integrates the CPU cores, GPU, display controllers, and memory interfaces that historically required several discrete ICs.
Key features include dual ARM Cortex-A9 cores with NEON SIMD and VFPv3, an enhanced GC2000-series GPU for OpenGL ES 3.0 and OpenCL, dual-stream 1080p video decode/encode, LVDS and MIPI-DSI display outputs, and three memory controller options (LPDDR2, DDR3L, DDR3). According to NXP product information, this variant carries the automotive temperature grade and is qualified for AEC-Q100-style harsh-environment use, making it suitable for in-vehicle infotainment, cluster, and telematics platforms.
The architecture uses a heterogeneous multi-core approach with the Cortex-A9 cores connected via an ARM NIC-301 interconnect to L2 cache, multimedia accelerators, and a wide peripheral set including USB, PCIe, SATA, Gigabit Ethernet, and multiple SD/eMMC controllers. The 'Plus' suffix denotes the upgraded GPU/memory subsystem versus the earlier i.MX6Dual, while remaining software-compatible at the BSP level.
Typical applications include automotive infotainment head units, industrial human-machine interfaces (HMIs), digital signage, point-of-sale terminals, and patient-side medical terminals. The 1 GHz speed grade and the dual-core configuration deliver enough headroom to drive two independent displays concurrently.
When designing with this device, ensure the PCB uses the 21x21 mm, 0.8 mm pitch FCBGA land pattern, route matched-length DDR3 traces, and provide a clean 1.35 V/1.5 V core supply. The part is marked NRND on the NXP product page; verify lifetime and recommended replacements before new designs.
Alternatives de remplacement direct pour MCIMX6DP6AVT1AA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCIMX6DP6AVT1AA (même facteur de forme et même empreinte) — différant par Display Interfaces, Mounting Type, Number of Cores, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCIMX6DP4AVT1AA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX6DP6AVT8AA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX6DP6AVT1AB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX6QP6AVT1AA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX6DQP6AVT1AA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX6DP6AVT1AA Valeurs maximales et caractéristiques électriques
| Product Family | i.MX 6DualPlus |
| Core Architecture | ARM Cortex-A9 |
| Number of Cores | 2 (Dual) |
| Largeur du bus de données | 32-bit |
| Maximum CPU Clock | 1.0 GHz |
| Co-Processor / DSP | Multimedia; NEON SIMD |
| Graphics Acceleration | Yes (GC2000-class GPU, OpenGL ES 3.0) |
| Memory Controllers | LPDDR2, DDR3L, DDR3 |
| Display Interfaces | LVDS (x2), MIPI-DSI, HDMI |
| Video Decode | 1080p60 H.264 dual-stream |
| Boîtier | 624-FCBGA (21x21 mm, 0.8 mm pitch) |
| Type de montage | Surface Mount (BGA) |
| Automotive Qualification | AEC-Q100 qualified (auto grade) |
| Statut RoHS | Compliant |
| Statut du cycle de vie | NRND (Not Recommended for New Designs) |
Guide de configuration des broches du MCIMX6DP6AVT1AA 624-fcbga (21x21 mm, 0.8 mm pitch)
Configuration des broches du MCIMX6DP6AVT1AA (boîtier 624-fcbga (21x21 mm, 0.8 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCIMX6DP6AVT1AA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCIMX6DP6AVT1AA convient pour 6 applications: Automotive Infotainment Head Unit, Industrial Human-Machine Interface (HMI), Digital Signage Media Player, Point-of-Sale (POS) Terminal, Medical Patient-Side Terminal, IoT Edge Gateway with Local Analytics.
Automotive Infotainment Head Unit
The MCIMX6DP6AVT1AA is well-suited to automotive infotainment head units because its dual ARM Cortex-A9 cores at 1 GHz can run a Linux or Android automotive stack, render dual-display UIs, and decode dual-stream 1080p video concurrently. The GC2000-class GPU provides OpenGL ES 3.0 acceleration for 3D maps and HVAC graphics, while the LVDS and MIPI-DSI outputs drive the central TFT and cluster panel. AEC-Q100 qualification and the -40C to +85C operating range meet the harsh automotive environment. Paired with NXP's PF8200 PMIC and TJA1043 CAN transceivers, the i.MX6DualPlus underpins mainstream in-vehicle infotainment designs.
Recommandé
Industrial Human-Machine Interface (HMI)
In factory automation HMIs, the MCIMX6DP6AVT1AA drives capacitive touchscreens running Qt or embedded Linux while simultaneously streaming process data over Ethernet. The dual cores reserve one core for real-time UI updates and one for OPC-UA, Modbus-TCP, or MQTT communication stacks. Hardware-accelerated graphics eliminate the need for a discrete GPU on the panel, and the DDR3L memory controller supports the bandwidth required for 1920x1080 panels. The wide operating temperature range and long-life industrial screening make it appropriate for control cabinets, machine tools, and building automation panels.
Recommandé
Digital Signage Media Player
The MCIMX6DP6AVT1AA fits commercial digital signage players because its hardware video decode block supports dual-stream 1080p60 H.264 playback and its GPU can overlay HTML5 graphics layers on top of decoded video. A single chip can drive two independent screens via LVDS or HDMI, enabling menu-board and wayfinding installations. Low BOM cost and small FCBGA-624 footprint let signage integrators build slim enclosures, while the proven NXP BSP reduces time-to-market for new deployments.
Recommandé
Point-of-Sale (POS) Terminal
POS terminals benefit from the MCIMX6DP6AVT1AA's dual-core compute for concurrent barcode scanning, payment-processing cryptography, and receipt printing. The integrated peripherals (USB, SD, Ethernet, MIPI camera) cover the typical POS I/O set without external bridges. The dual-display capability drives a cashier-facing touchscreen plus a customer-facing display, and the AES/SHA hardware accelerators speed up EMV chip-card transaction flows. Linux BSP support enables PCI-PTS validated payment stacks to be ported quickly.
Recommandé
Medical Patient-Side Terminal
Patient-side medical terminals (infusion-pump controllers, bedside infotainment, vital-signs gateways) use the MCIMX6DP6AVT1AA for its deterministic dual-core performance and long-life silicon program. The Cortex-A9 cores run a real-time-safe Yocto Linux build while securely rendering touch UIs and streaming HL7 or FHIR data to hospital networks. The -40C to +85C screening covers the operating envelope of bedside carts and ambulance-borne equipment. Hardware crypto accelerators accelerate TLS sessions, and the USB, Ethernet, and SD/MMC controllers integrate directly with typical medical I/O.
Recommandé
IoT Edge Gateway with Local Analytics
Industrial IoT gateways use the MCIMX6DP6AVT1AA to aggregate sensor data over RS-485, CAN, and Ethernet, run local analytics (for example TensorFlow Lite for anomaly detection), and publish to cloud brokers via MQTT. The dual cores isolate deterministic data acquisition on one core and analytics on the other, reducing jitter on the real-time path. The hardware video encode block can be repurposed for compressed image-pipeline pre-processing, and the on-chip GPU accelerates lightweight ML models without an external NPU.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCIMX6DP6AVT1AA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCIMX6DP4AVT1AA | MCIMX6DP6AVT8AA | MCIMX6DP6AVT1AB | MCIMX6QP6AVT1AA | MCIMX6DQP6AVT1AA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 624-FCBGA (21x21) | 624-FCBGA (21x21) - same | 624-FCBGA (21x21) - same | 624-FCBGA (21x21) - same | 624-FCBGA (21x21) - same | 624-FCBGA (21x21) - same |
| Core Count | 2 (Dual Cortex-A9) | 2 (Dual Cortex-A9) | 2 (Dual Cortex-A9) | 2 (Dual Cortex-A9) | 4 (Quad Cortex-A9) | 4 (QuadPlus) |
| CPU Clock | 1.0 GHz | lower speed grade (likely 800 MHz) | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.2 GHz |
| GPU | GC2000-class (OpenGL ES 3.0) | GC2000-class | GC2000-class | GC2000-class | GC2000-class | GC2000-class enhanced |
| Memory Controller | LPDDR2 / DDR3L / DDR3 | LPDDR2 / DDR3L / DDR3 | LPDDR2 / DDR3L / DDR3 | LPDDR2 / DDR3L / DDR3 | LPDDR2 / DDR3L / DDR3 | LPDDR2 / DDR3L / DDR3 |
| Automotive Grade | Yes (A suffix) | Yes (A suffix) | Yes (A suffix) | Yes (A suffix) | Yes (A suffix) | Yes (A suffix) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | Active (newer family) |
Principaux différenciateurs
- Highest-frequency DualPlus variant in the same FCBGA-624 footprint (vs MCIMX6DP4AVT1AA)
- Identical die in tape-and-reel packaging variant (vs MCIMX6DP6AVT8AA)
- Upgrades to quad-core within the same FCBGA-624 footprint (vs MCIMX6QP6AVT1AA)
- Long-term supply via newer QuadPlus variant (vs MCIMX6DQP6AVT1AA)
Notes de conception
The MCIMX6DP6AVT1AA in the 624-FCBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 15-20 C/W on a standard JEDEC 4-layer board with adequate copper. At full CPU+GPU load (estimated ~3 W typical, ~5 W peak), a junction temperature rise of 75-100 C above ambient is expected; a thermal interface material plus a low-profile heatsink is recommended for enclosed designs. The package does not have an exposed pad, so thermal dissipation relies on the inner balls and the PCB copper pours underneath the die shadow.
Route the DDR3 memory traces with matched lengths (data within +/-25 mils of the strobe; address/command within +/-100 mils), maintain 100 ohm differential impedance for USB SuperSpeed pairs, and keep the PHY reference clock traces short and isolated. The FCBGA-624 escape requires microvia-in-pad or staggered via fan-out; reference NXP's i.MX 6 Series Hardware Development Guide for the exact via pattern and layer stack-up. Decouple each core supply pin with a 100 nF X7R capacitor placed within 1 mm of the ball.
Do not assume boot mode without configuring the BOOT_MODE pins; the i.MX6DualPlus supports NOR, NAND, SD/eMMC, and serial download. Ensure the PMIC (e.g., PF8200) sequences the rails in the exact order required (VDD_SOC_IN before VDD_ARM_IN, then I/O) or the part will not boot reliably. Watch out for the GPU driver binary licensing: the Vivante GC2000 userspace libraries are not open source and must be downloaded separately from the NXP BSP site. Finally, confirm the operating temperature grade against the silk-screen (industrial -40 to +85 C versus automotive AEC-Q100) before qualification.
Place the 24 MHz system crystal and load capacitors within 5 mm of the XTAL pins and guard them with a ground ring to reduce EMI. Keep the analog supply (VDDA_*) routed separately from the digital 1.5 V/1.35 V core rails and decouple them with a ferrite bead. MIPI-DSI and LVDS lanes must be length-matched within 0.15 mm of each other and shielded by adjacent ground planes; failure to do so results in display jitter and EMI failures at 1080p60.
Informations de conformité
RoHS and REACH compliance per NXP product page. AEC-Q100 qualified (A suffix denotes automotive grade). Halogen-free status not explicitly stated in the verified data.
