MIMX8QM5CVUFFAB - i.MX 8QuadMax 8-Core SoC | NXP | 1313-BGA
Référence : MIMX8QM5CVUFFAB ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $39.8 | $398,00 |
| 100 | $36.2 | $3 620,00 |
| 500 | $33.9 | $16 950,00 |
| 1 000 | $31.5 | $31 500,00 |
MIMX8QM5CVUFFAB Présentation
An SoC (System on Chip) consolidates CPU, GPU, memory interfaces, and peripheral controllers into a single integrated circuit, forming the complete computing heart of an embedded system. The i.MX 8QuadMax sits at the top of the NXP i.MX 8 family (alongside 8QuadPlus and 8DualMax), targeting high-performance automotive, industrial, and consumer platforms that need advanced graphics, vision processing, and deterministic real-time control in one device.
Key features include full-chip hardware virtualization with domain protection for secure multi-OS operation, independent graphics across four HD displays or one 4K screen, an integrated vision pipeline for ADAS-class perception, and an audio subsystem optimized for voice and speech recognition. The dual Cortex-A72 cores handle heavy application workloads, the quad Cortex-A53 cores provide power-efficient scaling, and the dual Cortex-M4F cores run real-time, safety-relevant tasks - a heterogeneous balance of throughput and efficiency.
The architecture supports Android, Linux, FreeRTOS, QNX, Green Hills, and Dornerworks XEN operating systems, and the family offers pin- and power-compatible packages for hardware design reuse. Typical applications include automotive digital cockpits, infotainment, ADAS vision systems, industrial HMI panels, and medical imaging equipment, where rich UI and real-time control must coexist.
Design consideration: the 1313-ball BGA demands a multi-layer PCB with thermal vias and strict power sequencing; the MSL 3 rating (168-hour floor life) requires controlled moisture handling before reflow.
Alternatives de remplacement direct pour MIMX8QM5CVUFFAB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MIMX8QM5AVUFFAB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MIMX8QM6CVUFFAB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MIMX8QM5CVUFFABR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MIMX8DM5CVUFFAB
⚡ Même boîtier ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MIMX8QM5DVUFFAB
⚡ Même boîtier ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MIMX8QM5CVUFFAB Valeurs maximales et caractéristiques électriques
| Core Architecture | 2x Arm Cortex-A72 + 4x Arm Cortex-A53 + 2x Arm Cortex-M4F |
| Total Cores | 8 |
| Product Family | i.MX 8QuadMax |
| Package Type | 1313-FBGA |
| Package Dimensions | 29 x 29 mm |
| Terminal Form | Ball (BGA) |
| Terminal Count | 1313 |
| Type de montage | Surface Mount |
| Temperature Grade | Automotive |
| Display Support | 4x independent HD screens or 1x 4K screen |
| Virtualization | Full-chip hardware virtualization and domain protection |
| Supported OS | Android, Linux, FreeRTOS, QNX, Green Hills, Dornerworks XEN |
| MSL Rating | MSL 3 - 168 hours |
| Packaging | Tray |
| Statut du cycle de vie | Active |
Guide de configuration des broches du MIMX8QM5CVUFFAB 29 x 29 mm
Configuration des broches du MIMX8QM5CVUFFAB (boîtier 29 x 29 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MIMX8QM5CVUFFAB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MIMX8QM5CVUFFAB convient pour 6 applications: Automotive Digital Cockpit, ADAS Vision Processing, Industrial HMI Terminals, Medical Imaging Equipment, Voice-Enabled Smart Devices, In-Vehicle Networking Gateways.
Automotive Digital Cockpit
The MIMX8QM5CVUFFAB drives up to four independent HD displays or one 4K screen with hardware-accelerated graphics, matching the multi-screen requirements of modern digital cockpits. Its automotive temperature grade and full-chip virtualization allow instrument cluster, infotainment, and HUD domains to run on isolated OS instances on one SoC. The dual Cortex-M4F cores absorb real-time cluster tasks while the Cortex-A72 cluster renders rich UI, removing a separate cluster processor from the bill of materials.
Recommandé
ADAS Vision Processing
The integrated vision pipeline of the i.MX 8QuadMax processes camera streams for surround-view and driver-monitoring functions. The dual Cortex-A72 cores execute perception algorithms while Cortex-M4F cores handle time-critical sensor fusion with deterministic latency. Because the SoC combines ISP-class input, GPU-accelerated inference support, and automotive temperature grading, it consolidates vision processing that would otherwise need a discrete vision accelerator, simplifying the camera-to-display latency chain in ADAS domains.
Recommandé
Industrial HMI Terminals
Industrial human-machine interface panels benefit from the SoC's multi-display graphics, responsive Android/Linux stacks, and dual Cortex-M4F cores for deterministic PLC-adjacent control loops. The four Cortex-A53 cores sustain multi-application UI workloads at lower dynamic power than A72-only designs, reducing heatsinking in sealed panel enclosures. Hardware domain protection allows a vendor HMI application and a customer's runtime to coexist securely, and the long-lifecycle i.MX family suits multi-year industrial deployments.
Recommandé
Medical Imaging Equipment
Ultrasound and point-of-care imaging consoles use the MIMX8QM5CVUFFAB for 4K display output, GPU-accelerated rendering of scan data, and a responsive touch UI under Linux or QNX. The dual Cortex-M4F cores manage probe interface timing and motor control with real-time determinism, while hardware virtualization separates clinical application software from connectivity stacks. Its heterogeneous performance-per-watt profile reduces fan noise and enclosure size in bedside and portable imaging form factors.
Recommandé
Voice-Enabled Smart Devices
The i.MX 8QuadMax audio processing subsystem is optimized for voice and speech recognition, supporting far-field microphone arrays and on-device wake-word processing. Running Android or Linux on the A72/A53 clusters with recognition workloads accelerated by the SoC's DSP-class resources, designers avoid cloud round-trips for latency-critical interactions. The dual M4F cores continuously sample the mic array at low power, keeping the system responsive between wake events in smart speakers, kiosks, and conference systems.
Recommandé
In-Vehicle Networking Gateways
As a gateway processor, the SoC aggregates CAN-FD, Ethernet, and LIN traffic while running security stacks and OTA update managers under QNX or Linux. Its virtualization isolates the safety-critical network forwarding domain from open application domains, and the M4F cores service low-latency CAN interrupt handling independently of the application OS. Combined with NXP transceivers, the part anchors zonal gateway designs for next-generation vehicle E/E architectures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MIMX8QM5CVUFFAB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MIMX8QM5AVUFFAB | MIMX8QM6CVUFFAB | MIMX8DM5CVUFFAB | MIMX8QM5DVUFFAB |
|---|---|---|---|---|---|
| Package | 1313-FBGA (29x29 mm) | 1313-FBGA (29x29 mm) - same | 1313-FBGA (29x29 mm) - same | 1313-FBGA (29x29 mm) - same | 1313-FBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Cores | 2x A72 + 4x A53 + 2x M4F | 2x A72 + 4x A53 + 2x M4F | 2x A72 + 4x A53 + 2x M4F | 8DualMax - reduced core count | 2x A72 + 4x A53 + 2x M4F |
| Temperature Grade | Automotive | Automotive | Automotive | Automotive | Automotive |
| Hardware Virtualization | Yes, full-chip with domain protection | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Highest performance grade in the pin-compatible family (vs MIMX8QM5AVUFFAB)
- Eight heterogeneous cores vs reduced-core variants (vs MIMX8DM5CVUFFAB)
- Automotive temperature grade with hardware virtualization (vs Consumer application processors (cross-brand))
Notes de conception
The 29x29 mm, 1313-ball FBGA concentrates high dynamic power from the Cortex-A72 cluster. Provide a dense array of thermal vias (0.3 mm drill, ~1 mm pitch) under the package center connecting to internal copper planes and an external heatsink surface. Estimate junction temperature with the IMX8DQMAX datasheet thermal metrics for your specific airflow condition before finalizing enclosure design.
A 1313-ball BGA at 29x29 mm demands at least 8-10 PCB layers with dedicated DDR routing layers, microvia-in-pad structures, and reference planes for signal integrity. Follow the NXP i.MX 8QuadMax hardware design guide for LPDDR trace length matching and ballmap escape routing. Plan the stackup before layout begins - retrofitting layers later is not feasible.
The i.MX 8QuadMax requires strict power rail sequencing across core, SOC, DDR, and I/O domains. Use a dedicated PMIC with sequencing outputs and monitor PGOOD signals. Decouple each major rail per the datasheet decoupling table, placing bulk capacitance near the balls and high-frequency ceramics within 2 mm. Verify rail-up order in hardware before first OS boot to avoid latch-up.
MSL 3 (168-hour floor life) means boards must be reflowed within 168 hours of the moisture barrier bag being opened, or the parts must be baked per J-STD handling practice. Many first-article failures on large automotive BGAs trace to moisture-induced delamination during reflow. Track exposure time and log bake cycles in production.
Informations de conformité
RoHS and lead-free status inferred from current NXP automotive product line; confirm exact Environmental Quality data on the NXP product page. Temperature grade is automotive per distributor data; formal AEC-Q100 qualification level is [DATA_NEEDED: AEC-Q100 level].
