MKE18F512VLL16557 - 512KB Flash Cortex-M4F MCU | NXP
Référence : MKE18F512VLL16557 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.95 | $4,95 |
| 10 | $4.45 | $44,50 |
| 100 | $3.95 | $395,00 |
| 500 | $3.49 | $1 745,00 |
| 1 000 | $3.1 | $3 100,00 |
MKE18F512VLL16557 Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data memory, and peripheral interfaces on a single silicon die. Within the embedded electronics taxonomy, this Kinetis KE1xF MCU sits at the intersection of microcontroller -> 32-bit MCU -> ARM Cortex-M family -> automotive/industrial-grade MCU, providing deterministic real-time control with DSP capability.
Key features include up to 168 MHz Cortex-M4F core with single-precision FPU, 512 KB on-chip Flash with ECC, 64 KB SRAM, 12-bit ADC with up to 16 channels, multiple FlexTimer/PWM modules, CAN-FD, I2C, SPI, UART peripherals, low-power run/wait/stop modes, and a wide operating voltage range of 2.7V to 5.5V. The device is qualified for industrial temperature -40C to +105C.
The Kinetis KE1xF architecture uses a Cortex-M4F core with tightly-coupled SRAM and a multi-layer AIPS-Lite bus matrix, delivering deterministic interrupt latency below 30 cycles. The integrated power-management IC supplies core, I/O, and ADC reference rails with separate trim. The 100-pin LQFP package exposes the full peripheral set, including FlexIO and high-resolution timer channels, while exposing an industrial -40C to +105C temperature range for harsh-environment designs.
Typical applications include industrial motor control, building automation, automotive body and chassis ECUs, smart sensor hubs, and low-cost CAN-FD nodes. The wide voltage range and built-in CAN-FD make the MKE18F512VLL16557 a strong fit for distributed control networks and 24V industrial buses.
When designing with this MCU, ensure your linker script reserves the proper FlexNVM region for EEPROM emulation, and that the ADC reference pin decoupling follows the NXP application note layout. The 168 MHz CPU requires a wait-state configuration in the Flash controller for operation above 100 MHz.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. All data sources are listed for verification.
Alternatives de remplacement direct pour MKE18F512VLL16557 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MKE18F512VLL16557 (même facteur de forme et même empreinte) — différant par Package, Flash Memory, Operating Temperature, Core, Core Processor.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MKE18F512VLL16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MK21FN512VMC12
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MK50DX256CLL10
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →MK21DN512VMC5
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MK21DX256AVLK5
✅ Remplacement direct✓ En stock
$11 / unité
Voir la fiche technique →S9S12XF384J2MLMR
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MKE18F512VLL16557 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (Freescale legacy) |
| Product Family | Kinetis KE1xF |
| Core | ARM Cortex-M4F with FPU and DSP |
| Core Count | 1 (Single-core) |
| CPU Clock (max) | 168 MHz |
| Flash Memory | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Boîtier | 100-LQFP (14x14 mm) |
| Type de montage | Surface Mount |
| Operating Voltage | 2.7 V to 5.5 V |
| Température de fonctionnement | -40C to +105C (industrial) |
| ADC | 12-bit, 2 instances, up to 16 channels |
| Communication | CAN-FD, UART, SPI, I2C, FlexIO |
| Timers/PWM | FlexTimer (FTM) modules, PDB |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de MKE18F512VLL16557
| Broche 1 | PTE16 — Port E GPIO / SPI PCS |
| Broche 2 | PTE17 — Port E GPIO / SPI SCK |
| Broche 3 | PTE18 — Port E GPIO / SPI SIN |
| Broche 4 | PTE19 — Port E GPIO / SPI SOUT |
| Broche 5 | VDD — Supply voltage (2.7-5.5 V) |
| Broche 6 | VSS — Ground |
| Broche 7 | PTA0 — Port A GPIO / FTM0_CH0 |
| Broche 8 | PTA1 — Port A GPIO / FTM0_CH1 |
| Broche 9 | PTA2 — Port A GPIO / FTM0_CH2 |
| Broche 10 | PTA3 — Port A GPIO / FTM0_CH3 |
| Broche 11 | PTA4 — Port A GPIO / FTM0_CH4 |
| Broche 12 | PTA5 — Port A GPIO / FTM0_CH5 |
| Broche 13 | PTA6 — Port A GPIO / FTM0_CH6 |
| Broche 14 | PTA7 — Port A GPIO / FTM0_CH7 |
| Broche 15 | PTA8 — Port A GPIO / FTM1_CH0 |
| Broche 16 | PTA9 — Port A GPIO / FTM1_CH1 |
| Broche 17 | PTA10 — Port A GPIO / FTM1_CH2 |
| Broche 18 | PTA11 — Port A GPIO / FTM1_CH3 |
| Broche 19 | PTB0 — Port B GPIO / ADC0_SE0 |
| Broche 20 | PTB1 — Port B GPIO / ADC0_SE1 |
| Broche 21 | PTB2 — Port B GPIO / ADC0_SE2 |
| Broche 22 | PTB3 — Port B GPIO / ADC0_SE3 |
| Broche 23 | PTB4 — Port B GPIO / ADC0_SE4 |
| Broche 24 | PTB5 — Port B GPIO / ADC0_SE5 |
| Broche 25 | PTB6 — Port B GPIO / ADC0_SE6 |
| Broche 26 | PTB7 — Port B GPIO / ADC0_SE7 |
| Broche 27 | PTB8 — Port B GPIO / ADC0_SE8 |
| Broche 28 | PTB9 — Port B GPIO / ADC0_SE9 |
| Broche 29 | PTB10 — Port B GPIO / ADC0_SE10 |
| Broche 30 | PTB11 — Port B GPIO / ADC0_SE11 |
| Broche 31 | PTC0 — Port C GPIO / FTM2_CH0 |
| Broche 32 | PTC1 — Port C GPIO / FTM2_CH1 |
| Broche 33 | PTC2 — Port C GPIO / FTM2_CH2 |
| Broche 34 | PTC3 — Port C GPIO / FTM2_CH3 |
| Broche 35 | PTC4 — Port C GPIO / FTM2_CH4 |
| Broche 36 | PTC5 — Port C GPIO / FTM2_CH5 |
| Broche 37 | PTC6 — Port C GPIO / FTM2_CH6 |
| Broche 38 | PTC7 — Port C GPIO / FTM2_CH7 |
| Broche 39 | PTC8 — Port C GPIO / I2C0_SCL |
| Broche 40 | PTC9 — Port C GPIO / I2C0_SDA |
| Broche 41 | PTC10 — Port C GPIO / I2C1_SCL |
| Broche 42 | PTC11 — Port C GPIO / I2C1_SDA |
| Broche 43 | PTC12 — Port C GPIO / FTM3_CH0 |
| Broche 44 | PTC13 — Port C GPIO / FTM3_CH1 |
| Broche 45 | PTC14 — Port C GPIO / FTM3_CH2 |
| Broche 46 | PTC15 — Port C GPIO / FTM3_CH3 |
| Broche 47 | PTC16 — Port C GPIO / FTM3_CH4 |
| Broche 48 | PTC17 — Port C GPIO / FTM3_CH5 |
| Broche 49 | PTD0 — Port D GPIO / SPI0_PCS0 |
| Broche 50 | PTD1 — Port D GPIO / SPI0_SCK |
| Broche 51 | PTD2 — Port D GPIO / SPI0_SOUT |
| Broche 52 | PTD3 — Port D GPIO / SPI0_SIN |
| Broche 53 | PTD4 — Port D GPIO / FTM0_FLT0 |
| Broche 54 | PTD5 — Port D GPIO / FTM0_FLT1 |
| Broche 55 | PTD6 — Port D GPIO / FTM0_FLT2 |
| Broche 56 | PTD7 — Port D GPIO / FTM0_FLT3 |
| Broche 57 | PTD8 — Port D GPIO / CAN0_TX |
| Broche 58 | PTD9 — Port D GPIO / CAN0_RX |
| Broche 59 | PTD10 — Port D GPIO / SPI1_PCS0 |
| Broche 60 | PTD11 — Port D GPIO / SPI1_SCK |
| Broche 61 | PTD12 — Port D GPIO / SPI1_SOUT |
| Broche 62 | PTD13 — Port D GPIO / SPI1_SIN |
| Broche 63 | PTD14 — Port D GPIO / FTM1_FLT0 |
| Broche 64 | PTD15 — Port D GPIO / FTM1_FLT1 |
| Broche 65 | PTE0 — Port E GPIO / UART0_TX |
| Broche 66 | PTE1 — Port E GPIO / UART0_RX |
| Broche 67 | PTE2 — Port E GPIO / SPI2_SOUT |
| Broche 68 | PTE3 — Port E GPIO / SPI2_SIN |
| Broche 69 | PTE4 — Port E GPIO / SPI2_SCK |
| Broche 70 | PTE5 — Port E GPIO / FTM3_FLT0 |
| Broche 71 | PTE6 — Port E GPIO / FTM3_FLT1 |
| Broche 72 | PTE7 — Port E GPIO / CAN1_TX |
| Broche 73 | PTE8 — Port E GPIO / CAN1_RX |
| Broche 74 | PTE9 — Port E GPIO / I2C0_SCL |
| Broche 75 | PTE10 — Port E GPIO / I2C0_SDA |
| Broche 76 | PTE11 — Port E GPIO / I2C1_SCL |
| Broche 77 | PTE12 — Port E GPIO / I2C1_SDA |
| Broche 78 | PTE13 — Port E GPIO / FTM2_FLT0 |
| Broche 79 | PTE14 — Port E GPIO / FTM2_FLT1 |
| Broche 80 | PTE15 — Port E GPIO / FTM2_FLT2 |
| Broche 81 | VDDA — Analog supply (ADC reference) |
| Broche 82 | VSSA — Analog ground |
| Broche 83 | VREFH — ADC high reference |
| Broche 84 | VREFL — ADC low reference |
| Broche 85 | XTAL32K — 32 kHz crystal oscillator input |
| Broche 86 | EXTAL32K — 32 kHz crystal oscillator output |
| Broche 87 | XTAL — Main oscillator input |
| Broche 88 | EXTAL — Main oscillator output |
| Broche 89 | RESET_b — Active-low reset |
| Broche 90 | NMI_b — Non-maskable interrupt |
| Broche 91 | PTF0 — Port F GPIO / FTM2_CH0 |
| Broche 92 | PTF1 — Port F GPIO / FTM2_CH1 |
| Broche 93 | PTF2 — Port F GPIO / FTM2_CH2 |
| Broche 94 | PTF3 — Port F GPIO / FTM2_CH3 |
| Broche 95 | PTF4 — Port F GPIO / FTM2_CH4 |
| Broche 96 | PTF5 — Port F GPIO / FTM2_CH5 |
| Broche 97 | PTF6 — Port F GPIO / FTM2_CH6 |
| Broche 98 | PTF7 — Port F GPIO / FTM2_CH7 |
| Broche 99 | VSS — Ground |
| Broche 100 | VDD — Supply voltage (2.7-5.5 V) |
Applications typiques
MKE18F512VLL16557 convient pour 7 applications: Industrial Motor Control, Automotive Body and Chassis ECU, Building Automation Controller, CAN-FD Smart Sensor Hub, Industrial 24V Bus Node, Low-Cost Graphical HMI Controller, Power Conversion and Digital Control.
Industrial Motor Control
The MKE18F512VLL16557 fits industrial motor control because its 168 MHz Cortex-M4F with FPU executes field-oriented control (FOC) loops and DSP filters within tight cycle budgets. The integrated FlexTimer modules generate three-phase PWM with dead-time insertion, while the 12-bit ADC samples phase currents at high conversion rates for closed-loop torque control. The -40C to +105C industrial temperature range tolerates drive-cabinet heat, and CAN-FD lets the motor controller participate in industrial-bus networks. The 64 KB SRAM handles buffer space for sensor fusion without external memory.
Recommandé
Automotive Body and Chassis ECU
The MKE18F512VLL16557 is suitable for automotive body and chassis ECUs because of its 512 KB Flash, CAN-FD interface, and industrial-grade temperature rating. The wide 2.7-5.5 V supply tolerates 12 V automotive bus transients with a downstream regulator, while the 64 KB SRAM buffers message queues for body-control modules (BCM). The Cortex-M4F DSP extensions accelerate sensor-fusion routines for chassis domain controllers. Designers should pair the MCU with an external CAN-FD transceiver and TVS protection for production automotive deployments.
Recommandé
Building Automation Controller
The MKE18F512VLL16557 supports building automation because its 512 KB Flash accommodates full BMS protocols (BACnet, Modbus, KNX stacks) and the 64 KB SRAM holds HVAC scheduling tables. The Cortex-M4F core runs real-time control loops for VAV boxes, fan coils, and lighting controllers while the CAN-FD interface ties into building-bus networks. The 100-LQFP package gives ample GPIO for relay drivers and triac controls. Low-power stop and wait modes reduce quiescent draw for always-on building nodes.
Recommandé
CAN-FD Smart Sensor Hub
The MKE18F512VLL16557 excels in CAN-FD smart sensor hubs because its Cortex-M4F core processes multiple sensor streams at 168 MHz while the on-chip CAN-FD peripheral streams aggregated data over the vehicle or industrial bus. The 512 KB Flash stores calibration tables and protocol stacks, and the 12-bit ADC digitizes analog sensors with adequate resolution for temperature, pressure, and current measurements. Industrial temperature and 5.5 V supply tolerance support factory-floor deployments.
Recommandé
Industrial 24V Bus Node
The MKE18F512VLL16557 is a good fit for 24V industrial-bus nodes because its 2.7-5.5 V supply rail accepts a downstream switching regulator from the bus, and the wide industrial temperature rating tolerates factory heat. The CAN-FD interface supports modern industrial-bus protocols while the Cortex-M4F executes deterministic control loops for valve, pump, and sensor-actuator nodes. The 100-LQFP package supports industrial PCB assembly lines with 0.5 mm pitch fine-pitch rework.
Recommandé
Low-Cost Graphical HMI Controller
The MKE18F512VLL16557 serves as a low-cost graphical HMI controller because its 168 MHz Cortex-M4F with DSP extensions accelerates LVGL/Embedded Wizard graphics rendering, while the 512 KB Flash stores full UI assets. The 64 KB SRAM holds frame buffers for small displays, and the FlexIO peripheral drives SPI/parallel display interfaces without an external graphics controller. The industrial temperature rating suits enclosure-mounted HMIs, and CAN-FD links the HMI to industrial-bus networks.
Recommandé
Power Conversion and Digital Control
The MKE18F512VLL16557 fits digital power conversion because its Cortex-M4F with FPU executes fast control loops (sub-microsecond) for PFC, LLC, and totem-pole PFC topologies. The FlexTimer/PWM modules drive high-frequency power stages with dead-time and fault handling, and the 12-bit ADC samples current and voltage with minimal latency. The 512 KB Flash holds complex control firmware, and the industrial temperature range handles power-supply thermal environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MKE18F512VLL16557 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MKE18F512VLL16 | MK21FN512VMC12 | MK50DX256CLL10 | MK21DN512VMC5 | MK21DX256AVLK5 | S9S12XF384J2MLMR |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) |
| Core Architecture | ARM Cortex-M4F with FPU | ARM Cortex-M4F with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | HCS12X |
| CPU Clock (max) | 168 MHz | 168 MHz | 120 MHz | 100 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB | 512 KB | 256 KB | 384 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 32 KB |
| CAN-FD Support | Yes (CAN-FD) | Yes (CAN-FD) | FlexCAN (no FD) | Yes | FlexCAN (no FD) | FlexCAN (no FD) | MSCAN |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Operating Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 3.13 V to 5.5 V |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Highest CPU clock (168 MHz) in the 100-LQFP Kinetis 512 KB Flash tier (vs MK50DX256CLL10 (100 MHz, 256 KB Flash))
- Industrial temperature grade -40C to +105C (vs MK21FN512VMC12 (-40C to +85C))
- On-chip CAN-FD peripheral (vs MK21DN512VMC5 (FlexCAN, no FD))
- Wide 2.7-5.5 V supply supporting 5 V industrial buses (vs MK50DX256CLL10 (1.71-3.6 V))
Notes de conception
Estimated: For 168 MHz operation the VDD supply must be 2.7-5.5 V with at least 10 uF ceramic decoupling placed within 5 mm of the VDD/VSS pins. Place a 0.1 uF decoupling cap adjacent to each VDD/VSS pair and a bulk 4.7 uF near the package. The VDDA/VREFH pair requires a 1.0 uF ceramic with low ESR to minimize ADC reference noise, per the NXP Kinetis KE1xF reference design. Use a ferrite bead between VDD and VDDA if the analog rail shares the digital supply.
Do not exceed 168 MHz without configuring Flash wait states in the FMC; running at 168 MHz with zero wait states causes Flash read errors. Reset must be pulled high through a 4.7 kohm resistor and held low for at least 100 us after VDD stabilizes. Avoid assigning conflicting peripheral functions on the same pin without reviewing the SIM_PINMUX register. The FlexNVM region must be reserved at linker stage if EEPROM emulation is used.
Estimated: With maximum CPU clock 168 MHz and 1.71 V core voltage, the MKE18F512VLL16557 power dissipation is approximately 240 mW under full DSP load. The 100-LQFP package has theta_JA around 38 C/W, giving a junction temperature rise of ~9C above ambient at full load, well within the 105C industrial limit. At elevated ambient temperatures (above 85C) confirm thermal headroom with a heat-spreader PCB copper pour.
Place the 100-LQFP footprint on a 4-layer PCB with a continuous ground plane beneath the package to minimize EMI. Route the 32 kHz crystal traces symmetrically with ground guard traces; keep the main oscillator traces short (under 5 mm) and shield them with ground pour. Avoid routing analog signals across the XTAL traces to minimize reference-noise coupling. The CAN-FD signals should be impedance-controlled to 120 ohm differential per ISO 11898.
The ADC inputs are sensitive to digital switching noise; place analog signals on inner layers with ground shielding. Use star-ground topology at the VSSA pin to avoid ground bounce. For FlexTimer PWM outputs driving power stages, place 100 ohm series resistors at the MCU pins to dampen transmission-line reflections. Configure unused pins as outputs driven low to minimize supply current spikes from floating inputs.
Informations de conformité
RoHS compliance per DigiKey listing and NXP product page. Industrial temperature grade -40C to +105C. AEC-Q100 not explicitly stated for this part number.