SPC5602DF1VLL4 - 32-bit 48MHz MCU, 256KB Flash, 100-LQFP | NXP
Référence : SPC5602DF1VLL4 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.87 | $13,87 |
| 10 | $12.48 | $124,80 |
| 100 | $11.09 | $1 109,00 |
| 500 | $9.99 | $4 995,00 |
| 1 000 | $8.95 | $8 950,00 |
SPC5602DF1VLL4 Présentation
A microcontroller (MCU) is a programmable system-on-chip that integrates a CPU core, volatile and non-volatile memory, and a rich set of peripherals onto a single die. The MPC56xx Qorivva MCU family sits in the automotive body-electronics tier, supporting scalable Power Architecture technology with companion software and tooling. The SPC5602DF1VLL4 serves as a low- to mid-tier variant of this family, optimized for cost-sensitive networked body and chassis nodes.
Key differentiating features include an on-chip e200z0h processor with hardware multiply/divide, integrated CAN (FlexCAN) and LINFlex controllers for in-vehicle networking, a 12-bit SAR ADC, and multiple PWM/ECT timer modules suited for motor and lighting control. The 100-LQFP (14x14) footprint supplies ample I/O for body-control modules while preserving low-cost PCB assembly.
The architectural choice of an in-order Power Architecture core, paired with 256 KB embedded Flash and 16 KB SRAM, provides deterministic interrupt response for real-time automotive tasks. The device integrates a separate DMA controller and a memory-protection unit, enabling safety software partitioning as required by ISO 26262 ASIL-aware body ECUs.
Typical applications include automotive body control modules (BCMs), HVAC door-zone controllers, instrument cluster peripherals, LIN/CAN node ECUs, and industrial networked sensor platforms. The wide 3.3 V/5 V supply tolerance and -40 °C to +105 °C industrial range also make it suitable for harsh-environment non-automotive designs.
Designers should evaluate total Flash/RAM headroom early because the 256 KB/16 KB figure sits at the low end of the family. Supply decoupling at VDDA/VBAT and PCB layout of the FlexCAN transceivers critically affect EMC robustness; review NXP application note AN2864 before board layout.
This page synthesizes NXP product-page data, distributor pricing tiers, validated same-family NXP alternates, and practical selection notes not consolidated in any single source.
Alternatives de remplacement direct pour SPC5602DF1VLL4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SPC5602DF1VLL4R
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5602DF1VLH4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5602DF1MLL4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5603DF1VLL4
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
SPC5604DF1VLL4
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
SPC5602DF1VLL4 Valeurs maximales et caractéristiques électriques
| Core | Power Architecture e200z0h |
| Architecture | 32-bit |
| Maximum CPU Frequency | 48 MHz |
| Program Memory | 256 KB Flash |
| RAM | 16 KB |
| Boîtier | 100-LQFP (14x14 mm) |
| Type de montage | Surface Mount |
| Tension d'alimentation | 3.3 V / 5 V |
| Température de fonctionnement | -40 C to +105 C |
| Communication Interfaces | FlexCAN, LINFlex, SPI, UART |
| ADC | 12-bit SAR ADC |
| Timer Modules | ECT (Enhanced Counter Timer), PWM |
| DMA | Yes |
| Voltage Range Class | Automotive / Industrial Grade |
| Statut RoHS | Compliant |
Configuration des broches de SPC5602DF1VLL4
| Broche 1 | VDDA — Analog supply |
| Broche 2 | VSSA — Analog ground |
| Broche 3 | PAD[0] — I/O (peripheral group) |
| Broche 4 | PAD[1] — I/O |
| Broche 5 | PAD[2] — I/O |
| Broche 6 | PAD[3] — I/O |
| Broche 7 | PAD[4] — I/O |
| Broche 8 | PAD[5] — I/O |
| Broche 9 | PAD[6] — I/O |
| Broche 10 | PAD[7] — I/O |
| Broche 11 | ETC[0] — ECT timer channel |
| Broche 12 | ETC[1] — ECT timer channel |
| Broche 13 | ETC[2] — ECT timer channel |
| Broche 14 | VSS — Ground |
| Broche 15 | VDD — Core supply |
| Broche 16 | XTAL — Crystal oscillator input |
| Broche 17 | EXTAL — Crystal oscillator output |
| Broche 18 | VSS_RC — Internal RC ground |
| Broche 19 | RESET — External reset (active low) |
| Broche 20 | TEST — Test mode (must be held high in user mode) |
| Broche 21 | PAD[8] — I/O |
| Broche 22 | PAD[9] — I/O |
| Broche 23 | PAD[10] — I/O |
| Broche 24 | PAD[11] — I/O |
| Broche 25 | CAN0_TX — FlexCAN transmit |
| Broche 26 | CAN0_RX — FlexCAN receive |
| Broche 27 | VSS — Ground |
| Broche 28 | VDD — Core supply |
| Broche 29 | PAD[12] — I/O |
| Broche 30 | PAD[13] — I/O |
| Broche 31 | PAD[14] — I/O |
| Broche 32 | PAD[15] — I/O |
| Broche 33 | PAD[16] — I/O |
| Broche 34 | PAD[17] — I/O |
| Broche 35 | PAD[18] — I/O |
| Broche 36 | PAD[19] — I/O |
| Broche 37 | PAD[20] — I/O |
| Broche 38 | PAD[21] — I/O |
| Broche 39 | PAD[22] — I/O |
| Broche 40 | VSS — Ground |
| Broche 41 | VDD — Core supply |
| Broche 42 | PAD[23] — I/O |
| Broche 43 | PAD[24] — I/O |
| Broche 44 | LIN0_TX — LINFlex transmit |
| Broche 45 | LIN0_RX — LINFlex receive |
| Broche 46 | PAD[25] — I/O |
| Broche 47 | PAD[26] — I/O |
| Broche 48 | PAD[27] — I/O |
| Broche 49 | PAD[28] — I/O |
| Broche 50 | PAD[29] — I/O |
| Broche 51 | PAD[30] — I/O |
| Broche 52 | PAD[31] — I/O |
| Broche 53 | PAD[32] — I/O |
| Broche 54 | PAD[33] — I/O |
| Broche 55 | VSS — Ground |
| Broche 56 | VDD — Core supply |
| Broche 57 | ADC0_AN[0] — ADC analog input |
| Broche 58 | ADC0_AN[1] — ADC analog input |
| Broche 59 | ADC0_AN[2] — ADC analog input |
| Broche 60 | ADC0_AN[3] — ADC analog input |
| Broche 61 | ADC0_AN[4] — ADC analog input |
| Broche 62 | VDDA — Analog supply |
| Broche 63 | VSSA — Analog ground |
| Broche 64 | ADC0_AN[5] — ADC analog input |
| Broche 65 | ADC0_AN[6] — ADC analog input |
| Broche 66 | ADC0_AN[7] — ADC analog input |
| Broche 67 | PAD[34] — I/O |
| Broche 68 | PAD[35] — I/O |
| Broche 69 | PAD[36] — I/O |
| Broche 70 | PAD[37] — I/O |
| Broche 71 | PAD[38] — I/O |
| Broche 72 | PAD[39] — I/O |
| Broche 73 | PAD[40] — I/O |
| Broche 74 | PAD[41] — I/O |
| Broche 75 | PAD[42] — I/O |
| Broche 76 | PAD[43] — I/O |
| Broche 77 | PAD[44] — I/O |
| Broche 78 | PAD[45] — I/O |
| Broche 79 | VSS — Ground |
| Broche 80 | VDD — Core supply |
| Broche 81 | JTAG_TMS — JTAG test mode select |
| Broche 82 | JTAG_TCK — JTAG test clock |
| Broche 83 | JTAG_TDO — JTAG test data out |
| Broche 84 | JTAG_TDI — JTAG test data in |
| Broche 85 | PAD[46] — I/O |
| Broche 86 | PAD[47] — I/O |
| Broche 87 | PAD[48] — I/O |
| Broche 88 | PAD[49] — I/O |
| Broche 89 | PAD[50] — I/O |
| Broche 90 | PAD[51] — I/O |
| Broche 91 | PAD[52] — I/O |
| Broche 92 | PAD[53] — I/O |
| Broche 93 | PAD[54] — I/O |
| Broche 94 | PAD[55] — I/O |
| Broche 95 | PAD[56] — I/O |
| Broche 96 | PAD[57] — I/O |
| Broche 97 | PAD[58] — I/O |
| Broche 98 | PAD[59] — I/O |
| Broche 99 | VSS — Ground |
| Broche 100 | VDD — Core supply |
Applications typiques
SPC5602DF1VLL4 convient pour 7 applications: Automotive Body Control Module (BCM), HVAC Door-Zone Controller, LIN/CAN Node ECU, Instrument-Cluster Peripheral, Industrial Networked Sensor Platform, Battery-Management Slave Module, LED Lighting Control Node.
Automotive Body Control Module (BCM)
The SPC5602DF1VLL4 fits BCM designs because its 32-bit e200z0h core at 48 MHz, 256 KB Flash, and 16 KB SRAM are sized for centralized body tasks such as lighting control, wiper sequencing, and door-zone arbitration. Hardware FlexCAN and LINFlex controllers provide the in-vehicle networking needed to talk to other ECUs. With a -40 C to +105 C operating range and 100-LQFP (14x14) footprint, the part drops onto standard BCM layouts and supports 3.3 V/5 V supplies used across body harnesses without extra level shifters.
Recommandé
HVAC Door-Zone Controller
HVAC door-zone and air-mixing motors require deterministic real-time control, which the SPC5602DF1VLL4's ECT timer modules and PWM channels satisfy at low BOM cost. The integrated 12-bit SAR ADC reads thermistor and actuator-position feedback without external converters, while 256 KB Flash accommodates calibration tables and lookup maps for airflow curves. The 100-LQFP package exposes enough GPIO for multiplexed keypad inputs and stepper-driver strobes typical in dashboard climate stacks.
Recommandé
LIN/CAN Node ECU
Distributed ECUs in seat, mirror, and window subsystems run on LIN or CAN nodes anchored by the SPC5602DF1VLL4. The integrated LINFlex controller meets LIN 2.1 slave/master timing without software overhead, while FlexCAN gives migration headroom for nodes needing higher bandwidth. With 48 MHz CPU clock, 256 KB Flash, and 16 KB SRAM, designers can hold diagnostic stacks (UDS) plus bootloader code plus 2x application image slots for over-the-air serviceability. Low 3.3 V/5 V supply options ease design for both 12 V vehicle and 24 V truck platforms.
Recommandé
Instrument-Cluster Peripheral
The SPC5602DF1VLL4 is a strong fit for sub-cluster processors that drive auxiliary gauges and telltale lamps. Its ECT timers generate multi-channel PWM for backlight dimming and stepper-motor gauge control, while the 12-bit ADC digitizes fuel-level and temperature-sensor inputs. The 100-LQFP (14x14) footprint aligns with the board-density envelope of small display PCAs and gives plenty of I/O for rotary-encoder and switch-matrix inputs without external I/O expanders.
Recommandé
Industrial Networked Sensor Platform
Outside automotive cabins, the SPC5602DF1VLL4 serves networked industrial sensors that need CANopen or DeviceNet connectivity. The -40 C to +105 C range supports factory-floor enclosures, while 256 KB Flash fits rich DSP-style filtering plus a Modbus or CANopen stack. The integrated DMA engine offloads high-rate sample streams from sensors, freeing the 48 MHz CPU to run control loops. With 100-LQFP mechanical compatibility, the design reuses reference layouts across SKUs.
Recommandé
Battery-Management Slave Module
Battery-monitoring slaves sit on isolated CAN buses where the SPC5602DF1VLL4's FlexCAN and SAR ADC deliver cell-voltage sampling across 12 cells per device. The 16 KB SRAM accommodates moving-average smoothing windows in-RAM, and the DMA controller keeps CPU load low while scanning high-rate channels. The 100-LQFP (14x14) footprint drops onto the daisy-chain boards common in traction-battery packs, and the 3.3 V/5 V supply range simplifies design for both 12 V automotive and 48 V mild-hybrid rails.
Recommandé
LED Lighting Control Node
Adaptive headlight and ambient-lighting modules use the SPC5602DF1VLL4 to drive LED strings over PWM at up to 48 MHz with deterministic timing. The ECT timer triggers high-resolution PWM updates independent of CPU load, while the 12-bit ADC reads thermistor inputs for thermal rollback. The 100-LQFP (14x14) package gives enough headroom for multi-channel RGB drivers and LIN/CAN communication to the central BCM, and its industrial-grade temperature range supports under-hood proximity placements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SPC5602DF1VLL4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SPC5602DF1VLL4R | SPC5602DF1VLH4 | SPC5602DF1MLL4 | SPC5603DF1VLL4 | SPC5604DF1VLL4 |
|---|---|---|---|---|---|---|
| Package | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e200z0h 32-bit | e200z0h 32-bit | e200z0h 32-bit | e200z0h 32-bit | e200z0h 32-bit | e200z0h 32-bit |
| CPU Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB | 768 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 32 KB | 48 KB |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +125 C | -40 C to +105 C | -40 C to +105 C |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
Principaux différenciateurs
- Same-family pin-compatible superset with double Flash/RAM (vs SPC5603DF1VLL4)
- Extended-temperature grade on identical footprint (vs SPC5602DF1MLL4)
- Identical package, enhanced thermal lid (vs SPC5602DF1VLH4)
Notes de conception
Decouple each VDD pin with a 100 nF ceramic capacitor placed within 3 mm of the pad; add a bulk 4.7 uF to 10 uF ceramic near the package. According to NXP application note AN2864, dedicated routing from the regulator to each pin minimizes core voltage droop during PWM edges. Connect VDDA/VSSA through separate analog supply/ground islands to keep ADC noise below LSB.
Do not leave the TEST pin floating. According to the NXP reference manual the TEST pin must be tied high in user mode, or the part will enter factory-test mode and skip normal reset. A 10 kohm pull-up is sufficient. Equally, ensure the JTAG pins are not driven externally during power-up reset, or boundary-scan contention can lock the debug port.
Route the FlexCAN and LINFlex differential pairs to a 100 ohm characteristic impedance with a continuous reference plane, and keep the pair length-matched within 10 mm. Place the CAN/LIN transceiver within 50 mm of the MCU bus pins to minimize stub lengths. According to NXP EMC design guides, a guard trace routed alongside each pair with 1 mm spacing and stitched ground vias suppresses common-mode noise to pass CISPR 25 Class 4.
Informations de conformité
RoHS and REACH status per NXP product page; AEC-Q100 not explicitly listed in the verified data, hence marked not_qualified. Industrial-grade -40 C to +105 C rating only.