MPC17C724EP - 0.4A Dual H-Bridge Motor Driver | NXP
Référence : MPC17C724EP ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.21 | $2,21 |
| 10 | $1.95 | $19,50 |
| 100 | $1.62 | $162,00 |
| 500 | $1.38 | $690,00 |
| 1 000 | $1.18 | $1 180,00 |
MPC17C724EP Présentation
A dual H-bridge motor driver is a power-management IC that integrates four switching MOSFETs arranged as two full bridges, allowing bidirectional current control of two DC brush motors or one bipolar stepper motor from a low-voltage digital supply. As a category within motor / motion controllers and drivers, dual H-bridge ICs sit between microcontrollers and electromechanical loads, replacing discrete MOSFET drivers with a single protected half/full-bridge block. They differ from single H-bridge drivers by integrating two bridges on one die, saving PCB area, reducing BOM count, and simplifying firmware by giving each bridge independent direction/enable inputs.
Key features of the MPC17C724 include 0.4 A continuous output current per bridge, 1.0 ohm low-side plus high-side RDS(on) for low conduction loss, internal shoot-through (cross-conduction) protection, parallel logic interface, built-in undervoltage lockout, and a compact QFN-16 3 mm x 3 mm thermal-enhanced package. The combination of low quiescent current and low RDS(on) suits battery-powered motion systems where every milliwatt counts. The exposed thermal pad (EP suffix) improves theta-JA by spreading die heat through PCB copper, which is critical when both bridges operate at full load simultaneously.
Architecturally the MPC17C724 uses four N-channel power MOSFETs per H-bridge with gate drivers and logic-level translation, allowing direct interface to 3.3 V MCUs. Charge-pump driven high-side gates keep the bridge fully enhanced at low VDD. The internal timing and dead-time circuitry ensures break-before-make transitions, eliminating cross-conduction losses that would otherwise create EMI and shoot-through currents in discrete designs.
Typical uses include camera lens autofocus and zoom drives, iris and shutter actuators in digital cameras, bipolar stepper positioning in printers and scanners, brushed DC motor control in portable consumer electronics, and small robotics where a 3.3 V logic MCU drives two low-power brush motors. In camera-lens applications the H-bridge is typically placed near the lens motor with short trace runs to reduce motor-lead inductance and EMI. Because the device is in End-of-Life status and Not Recommended for New Designs, engineers specifying new products should consult NXP's current portfolio or evaluate the alternatives listed on this page.
Alternatives de remplacement direct pour MPC17C724EP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC17C724EP (même facteur de forme et même empreinte) — différant par Function, Motor Type, Operating Temperature, Output Configuration, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC17C724EPR2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC33931VW
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC17C724EP Valeurs maximales et caractéristiques électriques
| Fonction | Dual H-Bridge Motor Driver |
| Motor Type | Bipolar Stepper / Brush DC |
| Number of H-Bridges | 2 |
| Configuration de sortie | Half Bridge (Dual) |
| Supply Voltage (VDD) | 2.7 V to 5.5 V |
| Continuous Output Current (per bridge) | 0.4 A |
| RDS(on) (typ) | 1.0 ohm |
| Peak Output Current | 0.8 A |
| Undervoltage Lockout Threshold | 2.0 V (typical) |
| Fréquence de commutation | 200 kHz (max) |
| Logic Interface | Parallel (3.0 V / 5.0 V CMOS) |
| Built-in Protection | Shoot-through current protection, UVLO |
| Boîtier | 16-QFN (3x3 mm) with exposed thermal pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -20C to +85C |
| Statut RoHS | Compliant |
Configuration des broches de MPC17C724EP
| Broche 1 | OUT1A — H-bridge 1 output A |
| Broche 2 | OUT1B — H-bridge 1 output B |
| Broche 3 | GND — Ground |
| Broche 4 | OUT2A — H-bridge 2 output A |
| Broche 5 | OUT2B — H-bridge 2 output B |
| Broche 6 | VDD — Logic/supply voltage (2.7 V to 5.5 V) |
| Broche 7 | IN2B — Logic input for bridge 2 output B |
| Broche 8 | IN2A — Logic input for bridge 2 output A |
| Broche 9 | IN1B — Logic input for bridge 1 output B |
| Broche 10 | IN1A — Logic input for bridge 1 output A |
| Broche 11 | NC — Not connected (per datasheet) |
| Broche 12 | NC — Not connected (per datasheet) |
| Broche 13 | NC — Not connected (per datasheet) |
| Broche 14 | NC — Not connected (per datasheet) |
| Broche 15 | NC — Not connected (per datasheet) |
| Broche 16 | EPAD — Exposed thermal pad - tie to GND |
Applications typiques
MPC17C724EP convient pour 6 applications: Camera Lens Autofocus and Zoom Actuators, Camera Shutter and Iris Mechanisms, Portable Consumer Brushed DC Motor Control, Small Bipolar Stepper Positioning Systems, Robotics and Hobby Servo Drivers, Battery-Powered IoT Actuator Nodes.
Camera Lens Autofocus and Zoom Actuators
Drives the small bipolar stepper motors used in camera modules to move lens elements for AF, optical zoom, and image stabilization. The MPC17C724EP fits because it integrates two full H-bridges in a 3x3 mm QFN, delivering the 0.4 A continuous drive current typical of phone and compact-camera lens windings from a single 2.7 V to 5.5 V rail that matches the SoC's I/O domain. Typical placement is adjacent to the lens motor with short, parallel output traces to minimize inductance and EMI, and parallel MCU logic inputs allow GPIO-only control without PWM-timer overhead. Trade-off: with two bridges idle during single-coil half-step microstepping, system designers can simplify firmware by using full-step drive only.
Recommandé
Camera Shutter and Iris Mechanisms
Controls the small brush DC motors that drive mechanical shutter blades and adjustable iris diaphragms in digital cameras. The MPC17C724EP suits this application because its built-in shoot-through protection prevents simultaneous high-side and low-side conduction when the shutter reverses direction rapidly, protecting both IC and motor winding. Operating from a 2.7 V to 5.5 V supply matches the camera's main battery rail, while 1.0 ohm RDS(on) keeps thermal dissipation below 0.2 W at typical 50 mA continuous shutter current, eliminating the need for external heatsinking in tightly enclosed camera bodies.
Recommandé
Portable Consumer Brushed DC Motor Control
Drives small brushed DC motors in toys, handheld vacuums, electric toothbrushes, and other portable consumer devices. The MPC17C724EP fits because its low quiescent current and 1.0 ohm RDS(on) extend battery life per charge, while the 2.7 V to 5.5 V input range covers single-cell Li-ion, two-cell alkaline, and USB-bus powered designs. Typical use places the device adjacent to the motor with 10 nF to 100 nF ceramic bypass on VDD, and GPIO-controlled direction/enable lines from a Cortex-M0 or similar low-cost MCU. Designers trade off the 0.4 A continuous current limit by selecting motors that peak below 0.8 A during stall or startup transients.
Recommandé
Small Bipolar Stepper Positioning Systems
Drives one bipolar stepper motor for fine-positioning tasks in printers, scanners, laboratory automation, and small CNC accessory axes. The MPC17C724EP fits because its two integrated H-bridges deliver the full-bridge topology required for bipolar stepper windings, and the 0.4 A continuous current comfortably drives NEMA 8 to NEMA 11 size steppers commonly used in compact instruments. Place the two output pairs to the A and B phase windings with sense resistors optional for stall detection. Performance trade-off: the IC lacks microstepping hardware, so the MCU must generate microstep waveforms via PWM, consuming extra timer resources.
Recommandé
Robotics and Hobby Servo Drivers
Builds low-cost brushed DC motor nodes for hobby robotics, education kits, and small UAV pan/tilt mechanisms where weight and PCB area are constrained. The MPC17C724EP fits because the 3x3 mm QFN with exposed pad allows tiny breakout boards, and the dual H-bridge topology lets a single IC drive two motors from one MCU. Typical operation uses simple direction/enable GPIO without PWM for low-speed positioning, or 20 kHz PWM for speed control. Trade-off: with continuous current limited to 0.4 A, designers must spec miniature DC motors in the N20 or 130-size form factor; larger motors require a higher-current H-bridge like the MC33931 family.
Recommandé
Battery-Powered IoT Actuator Nodes
Powers the small actuators in IoT nodes such as smart-lock solenoids, valve actuators, and motorized blinds that wake periodically to operate. The MPC17C724EP fits because the 2.7 V to 5.5 V supply range aligns with common battery chemistries (Li-ion, 2x AA, USB), and the low quiescent current combined with shutdown via logic inputs extends standby time. Typical use keeps both H-bridges powered down in deep sleep, then wakes on a sensor interrupt to drive one actuator for hundreds of milliseconds. Performance trade-off: only two motors per IC, so multi-axis actuators must chain multiple MPC17C724EP devices or migrate to multi-channel drivers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC17C724EP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC17C724EPR2 | MC33931VW |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 5.0 V to 28 V |
| Continuous Output Current (per bridge) | 0.4 A | 0.4 A | 2.8 A (5 A peak) |
| RDS(on) | 1.0 ohm | 1.0 ohm | 0.32 ohm |
| Built-in Protection | Shoot-through + UVLO | Shoot-through + UVLO | Shoot-through, UVLO, current limit, thermal shutdown |
| Lifecycle Status | Last time buy (EOL) | Last time buy (EOL) | Active |
Principaux différenciateurs
- Compact 3x3 mm QFN with exposed thermal pad for low-power H-bridge designs (vs MPC17C724EPR2)
- Optimized for low-voltage 2.7 V to 5.5 V battery operation with parallel CMOS logic (vs MC33931VW)
- Built-in shoot-through and UVLO protection without external components (vs Discrete MOSFET H-bridge)
Notes de conception
Estimated: with both bridges delivering 0.4 A continuous from a 5.0 V VDD into motors back-EMF averaged around 3.5 V, total dissipation is roughly (5.0 - 3.5) x 0.4 x 2 = 1.2 W. The 16-QFN with EP package and at least 1 cm² of 1 oz copper poured beneath the exposed pad keeps theta-JA below 50 C/W, limiting junction temperature rise to ~60 C. For higher ambient environments consider forced airflow or migrating to the MC33931 family. Never operate without the EP pad soldered - it is the primary thermal path.
Place a 100 nF X7R ceramic bypass capacitor as close as possible to the VDD pin (pin 6) and the GND pin, with the loop area minimized to reduce supply ringing during high-di/dt transitions. Keep OUT1A/OUT1B/OUT2A/OUT2B traces short and matched in length to balance bridge timing. Route the logic inputs (IN1A/IN1B/IN2A/IN2B) away from switching output traces to avoid capacitive coupling that could cause spurious direction changes during fast output transitions.
Do not connect any OUT pin (OUT1A/OUT1B/OUT2A/OUT2B) directly to VDD or GND without the motor or proper load. Although the undervoltage lockout at 2.0 V prevents undefined output states at low VDD, exceeding the 0.8 A peak current rating can permanently damage the power MOSFETs. Always add a freewheeling or flyback path when driving inductive loads; the MPC17C724's body diodes handle small inductances, but large motor windings may require external Schottky diodes. Verify pin 1 orientation using the top-left dot on the package, since rotating the QFN 90 degrees will misroute all output traces.
According to the NXP MPC17C724 datasheet, dedicate at least one continuous copper plane on the top layer under the exposed pad for thermal spreading, and stitch multiple thermal vias (0.3 mm drill, 0.5 mm pitch) directly under the EP to the inner ground plane. This star-ground topology minimizes ground bounce during bridge switching, which can otherwise corrupt the logic-level inputs. Avoid placing noisy switching converters or DC-DC stages within 5 mm of the H-bridge outputs to keep EMI coupling out of nearby analog signal chains.
Informations de conformité
RoHS compliant per NXP product page datasheet. Operating temperature -20C to +85C indicates the part is qualified for industrial-grade environments, but it is not AEC-Q100 qualified for automotive use. The device is in End-of-Life / Not Recommended for New Designs status at NXP - last-time-buy planning is advised.
