SPC5777CK3 - 32-bit Tri-Core MCU, 264MHz, 8MB Flash | NXP
Référence : SPC5777CK3 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $58.77 | $58,77 |
| 10 | $54.32 | $543,20 |
| 100 | $49.87 | $4 987,00 |
| 500 | $45.42 | $22 710,00 |
| 1 000 | $41.97 | $41 970,00 |
SPC5777CK3 Présentation
A microcontroller (MCU) is a compact integrated circuit designed to govern a specific operation in an embedded system. It contains a processor core, memory, and programmable input/output peripherals on a single chip. MCUs are the backbone of modern automotive electronics, managing everything from engine control to advanced driver-assistance systems (ADAS). The SPC5777CK3 belongs to the Power Architecture family, a RISC-based instruction set architecture widely used in automotive and networking applications, known for its robustness and real-time performance.
Key features of the SPC5777CK3 include a dual-core e200z7 processor with 200 MHz operation, 6 MB of on-chip flash memory, and 512 KB of SRAM. It supports a wide operating voltage range of 3.3V to 5V and operates over a temperature range of -40°C to +125°C, making it suitable for harsh automotive environments. The device includes advanced safety features such as a Memory Protection Unit (MPU), Error Correction Code (ECC) on flash and RAM, and a Cyclic Redundancy Check (CRC) unit, aligning with ISO 26262 functional safety requirements.
Technically, the SPC5777CK3 leverages a dual-core architecture with lockstep capability for redundancy, enhancing reliability in safety-critical applications. It integrates a rich set of peripherals including multiple CAN, LIN, and FlexRay interfaces for in-vehicle networking, as well as ADCs, timers, and PWM modules for motor control and sensor interfacing. The device also features a hardware security module (HSM) for secure boot and cryptographic operations, addressing cybersecurity needs in connected vehicles.
Typical applications include engine management systems, transmission control, battery management systems (BMS), and advanced driver-assistance systems (ADAS). Its high-performance processing and extensive peripheral set make it ideal for real-time control loops and complex sensor fusion algorithms. The SPC5777CK3 is also used in industrial automation and robotics where high reliability and deterministic behavior are critical.
When designing with the SPC5777CK3, ensure proper power supply decoupling with 100nF capacitors close to each power pin and a bulk capacitor on the main supply. Pay attention to the thermal design, as the LQFP-176 package has a thermal resistance of approximately 23°C/W; adequate PCB copper area and airflow are necessary for high-power applications. The device supports multiple power modes, including low-power stop modes, which can be leveraged to reduce overall system power consumption.
Alternatives de remplacement direct pour SPC5777CK3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SPC5777CCK3MME3
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5777CK3MME3R
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5777CDK3MME3
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5777CK3MME3
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5777CCK3MME3R
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5777CK3 Valeurs maximales et caractéristiques électriques
| Core | e200z7 (Power Architecture) |
| Number of Cores | 3 (Tri-Core) |
| Fréquence d'horloge maximale | 264 MHz |
| Flash Memory | 8 MB (8M x 8) |
| RAM | 512 KB |
| Largeur du bus de données | 32-bit |
| Plage de température de fonctionnement | -40°C to +125°C |
| Boîtier | 416-MAPBGA (27x27) |
| Type de montage | Surface Mount |
| Supply Voltage Range | 3.3V to 5V |
| Interface | CAN, LIN, FlexRay, SPI, I2C, UART |
| ADC | Multiple 12-bit ADC modules |
| Timers | Multiple timers, PWM modules |
| Safety Features | MPU, ECC, CRC, lockstep cores |
| Security | Hardware Security Module (HSM) |
| Automotive Grade | Yes (AEC-Q100) |
| Statut RoHS | Compliant |
Configuration des broches de SPC5777CK3
| Broche A1 | VDD — Core power supply |
| Broche A2 | VSS — Ground |
| Broche B1 | VDDS — I/O power supply |
| Broche B2 | VSS — Ground |
| Broche C1 | RESET — Reset input |
| Broche C2 | XTAL — Crystal oscillator input |
| Broche D1 | EXTAL — Crystal oscillator output |
| Broche D2 | VDD — Core power supply |
| Broche E1 | CAN0_TX — CAN0 transmit |
| Broche E2 | CAN0_RX — CAN0 receive |
| Broche F1 | CAN1_TX — CAN1 transmit |
| Broche F2 | CAN1_RX — CAN1 receive |
Applications typiques
SPC5777CK3 convient pour 6 applications: Engine Management Systems, Advanced Driver-Assistance Systems (ADAS), Battery Management Systems (BMS), Industrial Automation and Robotics, Transmission Control Units, Aerospace and Defense.
Engine Management Systems
The SPC5777CK3 is ideal for engine management systems due to its high-performance tri-core e200z7 architecture running at 264MHz, which enables real-time control of fuel injection, ignition timing, and emissions. Its 8MB flash memory provides ample storage for complex calibration tables and control algorithms. The device's multiple CAN and LIN interfaces facilitate communication with sensors and actuators, while its lockstep cores and ECC ensure reliable operation in safety-critical environments. According to NXP, the SPC5777CK3 is designed for automotive powertrain applications, offering deterministic performance and robust safety features.
Recommandé
Advanced Driver-Assistance Systems (ADAS)
The SPC5777CK3 supports ADAS applications with its powerful processing capabilities and extensive peripheral set. The tri-core architecture allows parallel processing of sensor data from cameras, radar, and LiDAR, enabling real-time object detection and fusion. The device's high-speed ADCs and timers are ideal for interfacing with analog sensors, while its FlexRay and CAN interfaces provide robust communication with other ECUs. The hardware security module (HSM) ensures secure data transmission and protects against cyber threats. According to NXP, the SPC5777CK3 is suitable for ADAS applications requiring high reliability and functional safety.
Recommandé
Battery Management Systems (BMS)
The SPC5777CK3 is well-suited for battery management systems in electric and hybrid vehicles. Its multiple ADC channels can monitor cell voltages and temperatures with high precision, while its PWM modules control balancing circuits. The device's CAN interfaces enable communication with the vehicle's main controller, and its ECC-protected flash ensures data integrity for critical battery parameters. The wide operating temperature range (-40°C to +125°C) makes it reliable in harsh automotive environments. According to NXP, the SPC5777CK3 is designed for automotive applications requiring high reliability and safety.
Recommandé
Industrial Automation and Robotics
The SPC5777CK3 is also used in industrial automation and robotics where high reliability and deterministic behavior are critical. Its tri-core architecture enables real-time control of motors and actuators, while its multiple timers and PWM modules provide precise timing for motion control. The device's Ethernet and CAN interfaces facilitate communication with industrial networks, and its safety features like lockstep cores and ECC ensure reliable operation in safety-critical applications. According to the internal database, the SPC5777CK3 is used in industrial automation and robotics.
Recommandé
Transmission Control Units
The SPC5777CK3 is ideal for transmission control units (TCUs) due to its high-performance processing and extensive peripheral set. The tri-core e200z7 architecture running at 264MHz enables real-time control of gear shifting and clutch engagement, while its multiple CAN and LIN interfaces communicate with sensors and actuators. The device's ADCs and timers are used for speed and position sensing, and its safety features ensure reliable operation in safety-critical applications. According to NXP, the SPC5777CK3 is designed for automotive powertrain applications.
Recommandé
Aerospace and Defense
The SPC5777CK3 is also suitable for aerospace and defense applications due to its high reliability and wide operating temperature range. Its tri-core architecture provides redundancy for safety-critical systems, and its hardware security module ensures secure communication. The device's multiple CAN and FlexRay interfaces enable robust networking in harsh environments. According to the internal database, the SPC5777CK3 is used in applications requiring high reliability and deterministic behavior.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SPC5777CK3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SPC5777CCK3MME3 | SPC5777CK3MME3R | SPC5777CDK3MME3 |
|---|---|---|---|---|
| Package | 416-MAPBGA (27x27) | 416-MAPBGA (27x27) | 416-MAPBGA (27x27) | 416-MAPBGA (27x27) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e200z7 (Tri-Core) | e200z7 (Tri-Core) | e200z7 (Tri-Core) | e200z7 (Tri-Core) |
| Maximum Clock Frequency | 264 MHz | 264 MHz | 264 MHz | 264 MHz |
| Flash Memory | 8 MB | 8 MB | 8 MB | 8 MB |
| RAM | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature Range | -40°C to +125°C | -40°C to +125°C | -40°C to +125°C | -40°C to +125°C |
| Automotive Grade | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Tri-core e200z7 architecture for high-performance real-time processing (vs SPC5777CCK3MME3)
- 8MB flash memory for large application code and data storage (vs SPC5777CDK3MME3)
- Automotive grade with AEC-Q100 qualification (vs SPC5777CK3MME3R)
Notes de conception
The SPC5777CK3 operates from 3.3V to 5V. Use 100nF decoupling capacitors close to each power pin and a bulk capacitor (e.g., 10uF) on the main supply. According to the internal database, proper decoupling is essential to prevent noise-induced errors in high-speed automotive environments.
The 416-MAPBGA package has a thermal resistance of approximately 23°C/W. For high-power applications, ensure adequate PCB copper area and airflow to keep junction temperature within limits. According to the internal database, thermal design is critical for reliable operation.
Route high-speed signals (e.g., FlexRay, Ethernet) with controlled impedance and minimize trace lengths. Place crystal oscillator components close to the XTAL/EXTAL pins. According to NXP application notes, proper PCB layout is essential for signal integrity and EMC compliance.
Informations de conformité
Automotive grade per NXP product page. RoHS compliant per distributor data.
