MPC745BPX350LE - PowerPC 32-bit MPU 350MHz BGA-255 | NXP
Référence : MPC745BPX350LE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $79 | $7 900,00 |
| 500 | $71.25 | $35 625,00 |
| 1 000 | $64.8 | $64 800,00 |
MPC745BPX350LE Présentation
What is a PowerPC MPU? A PowerPC microprocessor is a RISC processor core based on the PowerPC architecture jointly developed by Apple, IBM, and Motorola. The MPC7xx series targets embedded systems requiring deterministic high throughput - networking line cards, storage controllers, industrial automation, and aerospace platforms. In the broader hierarchy, the MPC745B belongs to: microprocessor (MPU) -> embedded processor -> RISC processor -> PowerPC architecture -> 32-bit computing class. This taxonomy matters when designers verify firmware portability, toolchain support, and OS compatibility (VxWorks, Linux PowerPC, Green Hills INTEGRITY).
Key features include a 350 MHz maximum clock frequency, 64-bit internal data path, a supply voltage of 2 V core, 255-pin BGA package with 1.27 mm pitch, and a 21 x 21 mm footprint suitable for high-density multilayer PCBs. The architecture is optimized for superscalar out-of-order execution and integrated L2 cache control, supporting demanding embedded workloads.
The MPC745B is based on the PowerPC G3/G4 lineage and incorporates on-chip L1 cache plus an external L2 cache interface. It is pin-compatible with the MPC755 family and is supported by mature toolchains including Wind River VxWorks, Green Hills INTEGRITY, and GCC PowerPC cross-compilers. Designers must review the MPC745B/MPC755 hardware reference manual for boundary-scan, reset, and clock configuration details.
Typical applications include high-performance networking line cards, telecom base-station controllers, industrial control systems, storage RAID controllers, and legacy aerospace/defense platforms that require long-lifecycle PowerPC silicon. The wide supply voltage tolerance and BGA thermal dissipation enable deployment in constrained mechanical enclosures.
When designing with the MPC745B, ensure the PCB supports 1.27 mm pitch BGA assembly with controlled-impedance traces for the 64-bit data bus. Verify that the firmware toolchain targets the correct ABI (PowerPC SVR4 or ELF) and that the JTAG boundary-scan chain is correctly ordered for in-system programming and debug.
This page synthesizes distributor stock, drop-in alternatives from the MPC7xx family, and practical design considerations not consolidated in the legacy datasheet - giving engineers an authoritative, single-source reference for sourcing and substitution.
Alternatives de remplacement direct pour MPC745BPX350LE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC745BPX350LE (même facteur de forme et même empreinte) — différant par Package Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC745BPX350
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC755BPX350LE
✅ Remplacement direct✓ En stock
$49.9 / unité
Voir la fiche technique →MPC745BZU400LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC745BZU350LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XPC745BPX350LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC745BPX350LE Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Motorola/Freescale) |
| Product Series | MPC7xx (MPC745) |
| Core Architecture | PowerPC RISC |
| Largeur du bus de données | 64-bit |
| Fréquence d'horloge maximale | 350 MHz |
| Number of Cores | 1 |
| Supply Voltage (Core) | 2 V |
| Package Type | FCBGA-255 (Plastic BGA, 21 x 21 mm) |
| Nombre de broches | 255 |
| Ball Pitch | 1.27 mm |
| Package Height | 2.80 mm |
| Type de montage | Surface Mount (BGA) |
| Boundary Scan | Yes (JTAG/IEEE 1149.1) |
Guide de configuration des broches du MPC745BPX350LE 2.80 mm
Configuration des broches du MPC745BPX350LE (boîtier 2.80 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC745BPX350LE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC745BPX350LE convient pour 6 applications: Networking Line Cards and Routers, Telecom Base Station Controllers, Storage RAID and SAN Controllers, Industrial Automation Controllers, Aerospace and Defense Embedded Computing, Legacy Mainframe Interface Controllers.
Networking Line Cards and Routers
The MPC745BPX350LE is well suited for high-performance router line cards, where its 350 MHz PowerPC core delivers deterministic packet-processing throughput for forwarding engines. The 64-bit data bus enables efficient DMA transfers to and from network ASICs and PHY interfaces, while the integrated L1/L2 cache hierarchy maintains low-latency memory access for routing table lookups. Placed on the line-card PCB alongside a network processor or switch ASIC, the MPC745B handles control-plane, exception handling, and management-plane tasks. Compared to ARM Cortex alternatives, the mature VxWorks/PowerPC toolchain and proven telecom deployment make the MPC745B a known-quantity for legacy infrastructure. The 255-FCBGA package supports the controlled-impedance 64-bit bus routing required for GbE and 10 GbE interface PHYs.
Recommandé
Telecom Base Station Controllers
The MPC745BPX350LE's 350 MHz PowerPC core and 64-bit data bus deliver the deterministic real-time response required for 2G/3G base station controller cards. Its hardware multiprocessor interrupt support and integrated timers enable precise radio-frame synchronization in TDMA-based cellular protocols. Placed on the controller baseband PCB, the MPC745B executes the Layer 2/3 protocol stack, traffic scheduling, and OAM functions. The 255-ball FCBGA package (21 x 21 mm) supports dense multilayer PCB layouts typical of telecom shelves. According to NXP's MPC7xx hardware reference manual, the part's BDM and JTAG debug interfaces simplify in-system firmware updates during carrier acceptance. The proven VxWorks and INTEGRITY support ecosystem accelerates time-to-deployment versus custom ASIC alternatives.
Recommandé
Storage RAID and SAN Controllers
The MPC745BPX350LE serves effectively in RAID and storage-area-network (SAN) controller applications where 64-bit memory bandwidth drives high-throughput I/O. Its 350 MHz core with integrated L1 caches and external L2 cache interface delivers the cache-line throughput required for SATA/SAS RAID5/6 XOR acceleration. Placed on the storage controller mainboard alongside a SAS expander or HBAmemory controller, the MPC745B executes the I/O scheduler, command parser, and SNMP/management agent. The 64-bit data path aligns with the 64-bit ECC memory bus typical of enterprise-class storage subsystems. Compared to microcontroller-based storage controllers, the MPC745B's 350 MHz core and large cache footprint deliver several thousand IOPs in RAID5 acceleration workloads.
Recommandé
Industrial Automation Controllers
The MPC745BPX350LE's extended operating temperature variants and PowerPC real-time interrupt extension suit PLC, motion controller, and SCADA applications in industrial automation. Its 64-bit DMA engine drives deterministic fieldbus communication cycles for EtherCAT, Profinet, or CANopen master controllers. Placed on the industrial backplane alongside FPGA coprocessors and isolated I/O, the MPC745B executes IEC 61131-3 runtime logic, motion planning, and safety PLC logic. The 255-FCBGA package's 21 x 21 mm footprint fits compact DIN-rail-mounted controller modules. According to MCDM Linux distributions (MCDLinux), PowerPC firmware extends lineage to select industrial Linux distros; the upstream kernel continues to support PowerPC 7xx processors.
Recommandé
Aerospace and Defense Embedded Computing
The MPC745BPX350LE finds use in aerospace and defense embedded computing applications including flight-control computers, mission processors, and avionics data concentrators. Its mature toolchain support under VxWorksRTOS and DO-178B certification artefacts qualifies aerospace processors. Placed on a 3U/6U VME or VPX backplane board, the MPC745B executes flight management algorithms, sensor fusion, and ARINC 429/664 protocol stacks. The 64-bit data bus efficiently handles radar data acquisition and video processing workloads. The PowerPC architecture's heritage in aerospace (F-35, B-2, Predator) provides hardware pedigree that newer ARM Cortex designs cannot immediately match. Extended-temperature XPC745BPX350LE variant covers -40C to +85C for harsh-environment deployments.
Recommandé
Legacy Mainframe Interface Controllers
The MPC745BPX350LE is deployed in channel-attachment and protocol-conversion applications interfacing legacy IBM mainframe peripherals with modern TCP/IP networks. Its 350 MHz PowerPC core handles 3270 terminal emulation, SNA-to-IP gateway translation, and high-speed parallel channel aggregation. Placed on PCI/PCI-X add-in cards or compactPCI processor boards, the MPC745B executes real-time protocol stacks with deterministic latency requirements that PowerPC excels at. The 64-bit bus bandwidth handles multiple 3270 session aggregates at 1.5MB/s production traces. The mature toolchain (including legacy Diab Data and Green Hills compilers) maintains binary compatibility with deployed firmware images dating back to early 2000s deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC745BPX350LE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC745BPX350 | MPC755BPX350LE | MPC745BZU400LE | MPC745BZU350LE | XPC745BPX350LE |
|---|---|---|---|---|---|---|
| Package | FCBGA-255 (21x21 mm) | FCBGA-255 (21x21 mm) - same | FCBGA-255 (21x21 mm) - same | FCBGA-255 (21x21 mm) - same | FCBGA-255 (21x21 mm) - same | FCBGA-255 (21x21 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Clock Frequency | 350 MHz | 350 MHz | 350 MHz | 400 MHz (+14%) | 350 MHz | 350 MHz |
| Architecture | PowerPC G3/G4 RISC | PowerPC G3/G4 RISC - same | PowerPC G3/G4 RISC - same | PowerPC G3/G4 RISC - same | PowerPC G3/G4 RISC - same | PowerPC G3/G4 RISC - same |
| Data Bus Width | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit |
| Core Supply Voltage | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Pin-compatible with MPC755 successor variant (vs MPC755BPX350LE)
- Same-brand variants offer drop-in replacement flexibility (vs MPC745BPX350)
- Extended operating temperature range via LE suffix (vs Standard MPC745B variants without LE suffix)
Notes de conception
The 255-ball FCBGA package with 1.27 mm pitch requires NSMD (Non-Solder Mask Defined) land pads per IPC-7351 BGA guidelines. Use at least 0.5 oz copper on outer layers with microvia-in-pad for breakout routing. Maintain 50 ohm controlled impedance for the 64-bit data bus and source-synchronous clock traces. Estimated: with 21 x 21 mm package area, a minimum 4-layer PCB with continuous ground plane beneath the BGA is required for signal integrity and thermal dissipation. X-ray inspection is mandatory post-assembly to verify solder joint integrity - BGA defects are not visible via optical AOI.
Estimated: at 350 MHz with 2 V core supply and typical 8-12 W power consumption, the FCBGA package requires thermal management. Theta-JA is approximately 12-15 C/W with a properly designed thermal pad and ground plane. For reliable operation across industrial temperature range (-40C to +85C), a heatsink with thermal interface material (TIM) is recommended. Designers should place at least 6 thermal vias (0.3 mm drill) in the center pad array to conduct heat to inner copper planes. Junction temperature must remain below 110C (typical limit for this family per NXP documentation); estimated T-rise above ambient at 10 W dissipation and 12 C/W theta-JA is 120 C - thermal derating is essential.
Do not skip the BDM (Background Debug Mode) port - it is essential for firmware development, debug, and field updates. The MPC745B's HARDSTOP configuration (PowerPC 7xx family) requires proper sequencing of core voltage (2 V) before I/O voltage (3.3 V) to prevent latch-up. According to NXP's MPC7xx hardware reference manual, TRST must be held low during power-up reset to correctly initialize the JTAG TAP controller. Finally, when migrating to the MPC755 drop-in variant, designers must verify the JTAG IDCODE register value matches firmware expectations - some BDM probes auto-detect silicon revision.
Route the 64-bit data bus with matched trace lengths (within +/- 50 mils) and maintain 50 ohm single-ended impedance. Place decoupling capacitors (0.1 uF and 10 uF MLCC) within 100 mils of each power/ground ball. Use guard traces or ground pour striping to isolate the analog PLL supply from digital switching noise. The clock trace (SYSCLK) must be routed with controlled impedance and length-matched to the address/command bus. According to the NXP MPC7xx reference manual, the PLL filter network requires 10k series resistor and 0.1 uF/0.01 uF capacitor network for stable operation.
Informations de conformité
RoHS and REACH compliance not explicitly stated in available data. Original Motorola MPC7xx parts were manufactured before 2006 RoHS effective date; Pb-free variants may exist but were not confirmed in the provided data. AEC-Q100 not applicable (automotive grade MPU).
