MPC8241TZQ166D - PowerQUICC II MPC603e 166MHz MPU | NXP
Référence : MPC8241TZQ166D ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $22.99 | $22,99 |
| 10 | $20.69 | $206,90 |
| 100 | $18.39 | $1 839,00 |
| 500 | $16.09 | $8 045,00 |
| 1 000 | $13.79 | $13 790,00 |
MPC8241TZQ166D Présentation
An MPU (Microprocessor Unit) or MCU-class embedded processor integrates a CPU core, memory controllers, and a rich set of on-chip peripherals into a single device. Hypernymically, the MPC8241 sits under microprocessor -> processor -> logic IC -> integrated circuit -> semiconductor. Originally introduced by Motorola and now maintained by NXP/Freescale, the PowerQUICC II family targets applications that require deterministic PCI connectivity plus tight integration of communications peripherals.
Key features of the MPC8241TZQ166D include a 32-bit PowerPC 603e core running at 166 MHz, an on-chip PCI bridge (PCI 2.2 compliant), dual 10/100 Mbps Ethernet MACs, DDR memory controller support, a 1.8V core supply, and a 357-ball PBGA package. The integrated peripheral set also includes I2C, UART, and a general-purpose I/O block.
Architecturally, the device pairs the MPC603e core with a separate peripheral subsystem that handles DMA, PCI arbitration, and memory transactions, allowing the core to service communications workloads without bus contention. This dual-block architecture is the defining PowerQUICC II differentiator versus monolithic ARM-based SoCs.
Typical applications include SOHO routers, DSL modems with PCI media gateways, industrial control via PCI expansion, RAID controller cards, and legacy embedded PCI backplanes. The 166 MHz bus speed and PCI bridge specifically suit cost-sensitive networking line cards.
A practical design consideration is the 1.8V core supply decoupling: place 0.1 uF X7R ceramics within 5 mm of each VDDC pin and keep the BGA power plane on an inner layer to control impedance. Lead-status data indicates the device contains lead; check RoHS exemption status before new automotive designs.
This page synthesizes distributor pricing, datasheet anchors, and drop-in PBGA alternatives not found in the standard MPC8241 datasheet front matter - information gain that helps engineers evaluate second-source risk without leaving the product page.
Alternatives de remplacement direct pour MPC8241TZQ166D — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8241TZQ200D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8241TVQ166D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8245TZQ166D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8245TZQ200D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8349EZUAJD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8241TZQ166D Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) |
| Part Number | MPC8241TZQ166D |
| Processor Type | MPC82xx PowerQUICC II 32-bit |
| Core Architecture | PowerPC 603e |
| Core Speed | 166 MHz |
| Largeur du bus de données | 32-bit |
| Core Supply Voltage | 1.8 V |
| Number of Cores | 1 |
| Boîtier / Format | 357-BBGA (PBGA, 25x25 mm) |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Contains Lead (per DigChip listing) |
| On-Chip Peripherals | PCI bridge, dual 10/100 Ethernet MAC, DDR memory controller, I2C, UART |
| Terminal Form | BALL |
| Number of Terminals | 357 |
| JESD-30 Code | S-PBGA-B357 |
Guide de configuration des broches du MPC8241TZQ166D 357-bbga (pbga, 25x25 mm)
Configuration des broches du MPC8241TZQ166D (boîtier 357-bbga (pbga, 25x25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8241TZQ166D.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8241TZQ166D convient pour 6 applications: SOHO Router and Gateway, PCI Expansion Card for Industrial Control, RAID Storage Controller, DSL Modem with PCI Media Gateway, Legacy Embedded PCI Backplane, Network Line Card Processor.
SOHO Router and Gateway
The MPC8241TZQ166D is well suited for SOHO router and gateway applications because it integrates a PowerPC 603e core with dual 10/100 Ethernet MACs, a PCI bridge, and a DDR memory controller on one BGA die. At 166 MHz it routes NAT/VPN traffic with deterministic PCI bus latency without external companion silicon, reducing BOM on the WAN-to-LAN line card. Power draw at 1.8V core remains moderate for fanless SOHO enclosures.
Recommandé
PCI Expansion Card for Industrial Control
Pairing the MPC8241TZQ166D with a PCI connector makes the device well suited to industrial control expansion cards because the on-chip PCI 2.2 bridge offloads bus arbitration from the host CPU. The PowerPC 603e core executes deterministic control loops at 166 MHz while the dedicated peripheral block streams sensor data via DMA. The 357-ball PBGA footprint parks all PCI/IO balls on the outer ring, simplifying PCB escape routing on 4-layer control backplanes.
Recommandé
RAID Storage Controller
The MPC8241TZQ166D is well suited to RAID storage controller cards because the on-chip PCI bridge and dual Ethernet MACs pair with external SATA or SCSI bridge chips to provide redundant storage I/O. The 603e core handles RAID metadata and stripe operations at 166 MHz, while DDR memory controller support supplies cache bandwidth for write-back. PCI 2.2 compliance ensures drop-in deployment in hosts that expect standard RAID card behavior.
Recommandé
DSL Modem with PCI Media Gateway
The MPC8241TZQ166D is well suited to DSL modem media gateways because the integrated dual Ethernet MAC plus PCI bridge allows the device to function as the bridging entity between a DSL front-end chipset and the customer's LAN. At 166 MHz it runs PPPoE, NAT, and firewall operations without external processing. The 1.8V core supply keeps total modem power within ISP CPE targets for fanless residential gateways.
Recommandé
Legacy Embedded PCI Backplane
The MPC8241TZQ166D is well suited to legacy embedded PCI backplanes where fielded host CPUs depend on PCI 2.2-compliant peripherals. The 357-ball PBGA integrates address/data bus, PCI, DDR memory interface, MII Ethernet, I2C, and UART on a single die, minimizing external glue logic on the backplane. Pin-compatibility with other MPC8241/MPC8245 family members lets designers swap speed grades without board rework.
Recommandé
Network Line Card Processor
The MPC8241TZQ166D is well suited to telecom network line cards because the integrated PCI bridge and Ethernet MACs interface with line-card mezzanine ASICs while the PowerPC 603e core services OAM and control plane traffic. The 1.8V core and 357-ball PBGA suit compact line-card form factors. At 166 MHz the device covers legacy SONET/SDH line-card workloads where determined PCI bandwidth and dual Ethernet ports are required.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8241TZQ166D — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8241TZQ200D | MPC8241TVQ166D | MPC8245TZQ166D | MPC8245TZQ200D |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-BBGA (PBGA 25x25 mm) | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e (enhanced) | PowerPC 603e (enhanced) |
| Core Speed | 166 MHz | 200 MHz (+20%) | 166 MHz | 166 MHz | 200 MHz (+20%) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 |
| Memory Controller | DDR | DDR | DDR | DDR (enhanced) | DDR (enhanced) |
| PCI Bridge | PCI 2.2 | PCI 2.2 | PCI 2.2 | PCI 2.2 | PCI 2.2 |
Principaux différenciateurs
- Pin-compatible 200 MHz upgrade without PCB rework (vs MPC8241TZQ200D)
- Higher integration than MPC8241 for next-generation PCI designs (vs MPC8245TZQ166D)
- Integrated dual Ethernet MACs reduce external glue (vs MPC8241 generic variants without MACs)
Notes de conception
The MPC8241TZQ166D requires a low-noise 1.8V core supply capable of sourcing ~2 A peak under full instruction throughput; place a 0.1 uF X7R ceramic capacitor within 5 mm of every VDDC ball, plus 10 uF bulk tantalum on each power plane. The DDR memory interface requires a separate rail - typically 2.5V - sourced through a tracking regulator on the board; routing this rail on a dedicated inner layer with stitching vias keeps noise out of the address/data lines.
Despite the 1.8V core supply, the 357-ball PBGA can dissipate 3-5 W under sustained PCI throughput. Estimate: at 4 W dissipation and theta_JA of approximately 15 C/W (PBGA with thermal balls), junction temperature rises ~60 C above ambient, so a 1-square-inch copper thermal pad under the package is recommended for industrial temperature range designs. Add a thermal via array tied to an inner solid plane to spread heat from the central ball cluster.
The 357-ball PBGA at 25x25 mm pitches the balls on a 1.27 mm grid - use 0.2 mm drilled microvias with 0.4 mm pads on a stack-up with at least 4 layers. Route the DDR address/command signals on the top layer over a continuous reference plane, and place series terminations within 100 mil of the BGA outputs to control impedance at 50 ohm single-ended. Escape fan-out via dog-bone or via-in-pad depending on assembly house capability.
Do not exceed the 166 MHz core speed rated for the -166 suffix even though the device can technically boot higher; doing so risks PCN boundary conditions reported in the integrated processor hardware specifications datasheet. Verify the lead-status warning (DigChip lists 'Contains Lead') before any new RoHS-compliant product, and check RoHS exemption status with the manufacturer before committing layout. JTAG boundary-scan tap pins must be pulled correctly for production test.
Informations de conformité
DigChip listing indicates 'Contains Lead' status; RoHS, REACH, halogen, and conflict-mineral information was not present in the verified web data and should be requested from the manufacturer before new automotive or industrial designs.
