MPC8306CVMADDCA - PowerQUICC II Pro 266MHz SoC | NXP Semiconductors
Référence : MPC8306CVMADDCA ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.8 | $3 180,00 |
| 500 | $28.4 | $14 200,00 |
| 1 000 | $25.95 | $25 950,00 |
MPC8306CVMADDCA Présentation
A PowerQUICC processor is a communications-centric system-on-chip (SoC) that combines a Power Architecture CPU with one or more protocol engines, originally designed by Freescale (now NXP) to offload networking, telecom and industrial control workloads from the main CPU. The PowerQUICC family sits at the intersection of microcontrollers (MCUs) and high-performance application processors, evolving into the QorIQ and Layerscape families for newer designs. Understanding this hierarchy helps engineers recognize that the MPC8306 is positioned for cost-sensitive, low-power embedded networking where deterministic protocol handling matters more than raw compute throughput.
Key features of the MPC8306CVMADDCA include a 266 MHz e300c3 core with 16 KB instruction / 16 KB data L1 cache, a 32-bit DDR1/DDR2 memory controller with ECC, two 10/100 Ethernet controllers with QoS and classification, two USB 2.0 full-speed controllers (host/device/OTG), dual CAN 2.0B controllers, four UART, dual I2C, SPI, and a local bus controller. Security is supported via integrated SEC 2.0 with DES/3DES/AES/SHA accelerators and a true random number generator.
The MPC8306 architecture uses a 32-bit PowerPC superscalar core paired with QUICC Engine technology, which historically handled ATM, HDLC, TDM and Ethernet protocol termination in earlier PowerQUICC generations. On the MPC8306, the QUICC Engine focuses on HDLC, TDM, and Ethernet offload, while the e300c3 core runs control-plane software such as Linux or VxWorks. The device integrates DDR2 memory controller logic that supports up to 256 MB of DDR2 with ECC, eliminating the need for an external memory controller chip.
Typical applications include industrial Ethernet gateways, smart grid substation controllers, factory automation PLCs, protocol converters (HDLC/Ethernet/CAN), networked printers, and low-end WiMAX/3G base station control cards. The integrated IEEE 1588 v2 time stamping on the MPC8306 makes it well suited for precision timing over Ethernet in telecom and power-utility networks.
When designing with this device, note that the package is a 369-ball PBGA (19x19 mm, 1 mm pitch) which requires a 6-layer PCB minimum for signal integrity and a clean thermal copper pour under the exposed die area. The 0.95 V to 1.05 V core voltage requires careful sequencing with respect to the 3.3 V I/O supply. Also confirm that your firmware target supports the e300c3 core architecture before committing to the MPC8306 over an ARM-based alternative.
This page synthesizes distributor stock, drop-in pin-compatible alternatives, parameter comparison and design notes that go beyond the manufacturer datasheet, helping embedded engineers evaluate the MPC8306 for cost-sensitive communications designs.
Alternatives de remplacement direct pour MPC8306CVMADDCA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8306CVMADDCA (même facteur de forme et même empreinte) — différant par Manufacturer, Memory Controller, Package, Series, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8306SVMADDCA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8306VMADDCA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8306SCVMADDCA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8308CVMADD
✅ Remplacement direct✓ En stock
$17.6 / unité
Voir la fiche technique →MPC8306CVMADDA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8306CVMADDCA Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Series | MPC830x PowerQUICC II Pro |
| Core Architecture | Power Architecture (e300c3) |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Fréquence d'horloge maximale | 266 MHz |
| Core Supply Voltage | 0.95 V to 1.05 V |
| I/O Supply Voltage | 3.3 V |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Memory Controller | DDR1/DDR2 with ECC, up to 256 MB |
| Ethernet | 2x 10/100 (R/MII) with QoS, IEEE 1588 v2 |
| USB | 2x USB 2.0 Full-Speed (Host/Device/OTG) |
| CAN | 2x CAN 2.0B |
| UART | 4x |
| Other Peripherals | I2C x2, SPI, Local Bus, HDLC/TDM |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA, RNG) |
| Boîtier | 369-PBGA (19x19 mm) |
| Température de fonctionnement | -40C to +105C (extended) |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Lead Free / RoHS | Lead Free / RoHS Compliant |
| Lifecycle | Last Time Buy (EOL announced) |
Guide de configuration des broches du MPC8306CVMADDCA 369-pbga (19x19 mm)
Configuration des broches du MPC8306CVMADDCA (boîtier 369-pbga (19x19 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8306CVMADDCA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8306CVMADDCA convient pour 6 applications: Industrial Ethernet Gateway, Smart Grid Substation Controller, Factory Automation PLC, Telecom Protocol Converter, Networked Printer / Multifunction Device Controller, Low-End Wireless Base Station Control Card.
Industrial Ethernet Gateway
The MPC8306CVMADDCA's dual 10/100 Ethernet controllers with QoS classification make it a strong fit for industrial protocol gateways that bridge EtherNet/IP, PROFINET, Modbus TCP, and serial fieldbuses. The e300c3 core at 266 MHz runs a Linux-based protocol stack while the integrated QUICC Engine offloads HDLC/TDM framing in parallel. Its 0.95 V to 1.05 V core supply plus 3.3 V I/O allow direct connection to standard 3.3 V PHY devices without level shifters, and the extended -40C to +105C temperature grade covers outdoor cabinet and factory-floor deployments.
Recommandé
Smart Grid Substation Controller
Substation controllers require deterministic timing and reliable communications, both delivered by the MPC8306CVMADDCA's IEEE 1588 v2 hardware time stamping and HDLC/TDM QUICC Engine offload. The 266 MHz e300c3 core runs IEC 61850 stack and SCADA protocols with low latency, while the integrated SEC 2.0 crypto engine accelerates authentication and TLS for grid cybersecurity compliance. Its 369-PBGA package provides a rugged surface-mount footprint rated for -40C to +105C operation in unconditioned outdoor cabinets.
Recommandé
Factory Automation PLC
Programmable logic controllers with integrated networking benefit from the MPC8306CVMADDCA's combination of dual CAN 2.0B for field I/O, dual Ethernet for uplink, and DDR2 controller with ECC for deterministic memory access. The 266 MHz Power Architecture core runs Codesys or custom ladder-logic firmware, while the QUICC Engine handles deterministic HDLC and TDM links to legacy industrial networks. Designers gain a single-chip PLC controller with no external memory controller required, simplifying PCB design in 4 to 6 layer stack-ups.
Recommandé
Telecom Protocol Converter
Legacy TDM and HDLC networks are bridged to modern IP/MPLS backhaul by devices built around the MPC8306CVMADDCA, whose QUICC Engine is purpose-built for HDLC and TDM termination. The e300c3 core runs the IP routing stack while the engine handles DS0/E1 framing without CPU intervention, achieving deterministic latency required for circuit emulation services. The two USB 2.0 ports, four UARTs, and dual I2C/SPI provide abundant connectivity for management interfaces and configuration storage.
Recommandé
Networked Printer / Multifunction Device Controller
Office printers and multifunction devices need an embedded processor with rich connectivity, and the MPC8306CVMADDCA delivers dual Ethernet, USB host/device, plus UART/I2C/SPI for scanner and display subsystems. The 266 MHz e300c3 core runs PostScript/PDF rasterization and IPP/LPD printing stacks under embedded Linux, with DDR2 controller supporting up to 256 MB of RAM for image buffers. The integrated SEC engine handles IPsec/TLS for secure print release workflows in enterprise environments.
Recommandé
Low-End Wireless Base Station Control Card
Small-cell and pico-cell base stations need a control-plane processor with deterministic serial links, and the MPC8306CVMADDCA's HDLC/TDM QUICC Engine plus dual CAN and dual Ethernet ports suit this role. The e300c3 core runs the PHY/transport stack while the engine handles backhaul TDM/HDLC between the baseband card and the network. Its compact 369-PBGA 19x19 mm package and extended temperature range fit small-cell enclosure thermal budgets while supporting outdoor-mounted radio units.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8306CVMADDCA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8306SVMADDCA | MPC8306VMADDCA | MPC8306SCVMADDCA | MPC8308CVMADD | MPC8306CVMADDA |
|---|---|---|---|---|---|---|
| Package | 369-PBGA (19x19 mm) | 369-PBGA (19x19 mm) - same | 369-PBGA (19x19 mm) - same | 369-PBGA (19x19 mm) - same | 369-PBGA (19x19 mm) - same | 369-PBGA (19x19 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core | e300c3 (single) | e300c3 (single) - same | e300c3 (single) - same | e300c3 (single) - same | e300c4 (dual) | e300c3 (single) - same |
| Clock Frequency | 266 MHz | 266 MHz - same | 266 MHz - same | 266 MHz - same | Up to 400 MHz | 266 MHz - same |
| IEEE 1588 v2 PTP | Yes | No | Yes - same | No | Yes | Yes - same |
| Memory Controller | DDR1/DDR2, ECC, up to 256 MB | DDR1/DDR2, ECC, up to 256 MB - same | DDR1/DDR2, ECC, up to 256 MB - same | DDR1/DDR2, ECC, up to 256 MB - same | DDR1/DDR2, ECC, up to 256 MB - same | DDR1/DDR2, ECC, up to 256 MB - same |
| Ethernet | 2x 10/100 (R/MII) | 2x 10/100 (R/MII) - same | 2x 10/100 (R/MII) - same | 2x 10/100 (R/MII) - same | Up to 3x 10/100/1000 | 2x 10/100 (R/MII) - same |
| Operating Temperature | -40C to +105C (extended) | -40C to +105C - same | -40C to +105C - same | -40C to +105C - same | 0C to +70C or -40C to +85C | 0C to +70C (standard) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | NRND / Last Time Buy | Last Time Buy |
Principaux différenciateurs
- IEEE 1588 v2 hardware time stamping on Ethernet (vs MPC8306SVMADDCA)
- Pin-compatible with the full MPC8306 family (vs MPC8308ZQAFD)
- Integrated SEC 2.0 crypto engine (vs External crypto companion IC)
Notes de conception
The MPC8306CVMADDCA requires two supplies: a 0.95 V to 1.05 V core rail (typically 1.0 V) capable of delivering up to ~800 mA, and a 3.3 V I/O rail. Sequence the core rail first, then I/O, per NXP's power-up requirements, to prevent latch-up. Use a low-noise LDO or DC-DC for the core rail; ripple above 50 mVpk-pk can cause intermittent reset. Decouple with 0.1 uF X7R ceramics at every VDDC pin and bulk 22 uF tantalum or polymer caps near the package.
Estimated: at 266 MHz full operation with both Ethernet ports active and the SEC engine running, the MPC8306CVMADDCA dissipates approximately 1.0 to 1.4 W. The 369-PBGA package's theta_JA is approximately 25 C/W on a 6-layer JEDEC test board, yielding a 25C to 35C junction rise above ambient. For -40C to +105C operation, ensure ambient does not exceed 70C to 80C at full load. Provide a continuous copper ground pour under the package for thermal spreading.
The 369-PBGA uses 1.0 mm ball pitch - microvia or sub-100 um trace/spacing is required for fanout escape. Use a minimum 6-layer stack-up with dedicated ground and power planes adjacent to the BGA. Match DDR2 trace lengths within +/- 25 mils for byte lanes and provide proper termination VTT at the midpoint of the address/command bus. Place the 25 MHz system reference oscillator within 200 mils of the XTAL pins with a guarded ground ring to minimize jitter.
Do not assume boot from NAND - the MPC8306 normally boots from a NOR flash or SPI EEPROM attached to the local bus or SPI controller. Configure the Reset Configuration Word via pull-ups/pull-downs on the RCW pins BEFORE power-up; misconfiguration here is the #1 cause of 'dead board' issues. Verify boot mode by reading the Boot Mode register over JTAG before debugging firmware. Also note that some MPC8306 hardware errata require software workarounds in the DDR2 controller initialization sequence - consult the NXP errata document.
Route Ethernet MII/RGMII traces with 50 ohm single-ended impedance and length-match within +/- 50 mils per pair. Keep PHY-to-MAC traces under 3 inches and isolate them from switching power and clock traces with a ground stitch fence. The QUICC Engine TDM/HDLC serial traces should be impedance-controlled (typically 75 ohm differential for E1/T1) per telecom standards. USB 2.0 full-speed differential pairs require 90 ohm differential impedance with common-mode chokes near the connector.
Informations de conformité
RoHS compliant and lead-free per NXP product page; not AEC-Q100 qualified (industrial extended-temp only, no automotive Q-grade); halogen-free status not explicitly listed in datasheet. Last Time Buy / EOL announced - plan migration.
