MPC8313CZQAFFB - PowerQUICC II Pro MPU, 333MHz, 516-TEPBGA | NXP
Référence : MPC8313CZQAFFB ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $23.81 | $23,81 |
| 10 | $21.43 | $214,30 |
| 100 | $19.04 | $1 904,00 |
| 500 | $17.5 | $8 750,00 |
| 1 000 | $16.19 | $16 190,00 |
MPC8313CZQAFFB Présentation
An MPU (Microprocessor Unit) is a system-on-chip that integrates one or more processor cores, cache, memory controllers, and peripheral interfaces into a single device. The PowerQUICC II Pro family belongs to the broader PowerPC/e300 hierarchy and is positioned between general-purpose microcontrollers and high-performance application processors, providing deterministic performance for communications and storage infrastructure. The MPC8313 specifically targets cost-sensitive designs where the integrated QUICC Engine RISC communications accelerator offloads protocol processing from the host core.
Key features of the MPC8313CZQAFFB include the e300c3 core with 16 KB instruction and 8 KB data L1 caches, a 32-bit DDR1/DDR2 memory controller supporting up to 333 MHz operation, dual 10/100/1000 Mbps Ethernet controllers with SGMII and TBI interfaces, a PCI Express interface, USB 2.0 with PHY, local bus, and DUART. Security accelerators and the encryption block are intentionally omitted in the 'C' (non-E) part number suffix, reducing BOM cost versus the 'E' variants.
Architecturally, the MPC8313 uses a hierarchical bus structure connecting the e300c3 core to L2 cache, the system bus, and the QUICC Engine subsystem. The QUICC Engine RISC controller handles serial protocols including HDLC, ATM, and Ethernet, allowing the host CPU to focus on application and control-plane processing. This hardware-based protocol offload yields deterministic throughput without consuming host MIPS.
Typical applications include industrial control gateways, low-density routers and switches, network-attached storage controllers, factory automation nodes, and print/image processing controllers where the device's combination of Ethernet, PCI Express, and DDR2 memory support reduces overall system BOM. The 27 x 27 mm 516-ball TEPBGA package requires multilayer PCB design with controlled-impedance routing and proper thermal management under sustained load.
When designing with the MPC8313CZQAFFB, verify that the power supply rails (1.0 V core, 1.8 V/2.5 V DDR, 3.3 V I/O) are sequenced correctly per the hardware specification and that the thermal solution can dissipate the typical 2 W to 4 W power envelope in the target enclosure. The non-encryption variant is recommended for cost-sensitive designs that do not require IPSec or other cryptographic acceleration.
This page synthesizes distributor pricing, drop-in Rev 2.1 same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour MPC8313CZQAFFB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8313CZQAFFB (même facteur de forme et même empreinte) — différant par Memory Controller, Manufacturer, Ethernet, Series, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8313EZQAFFB
✅ Remplacement direct✓ En stock
$36.9 / unité
Voir la fiche technique →KMPC8313EVRAFFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313CVRADDC
✅ Remplacement direct✓ En stock
$19.95 / unité
Voir la fiche technique →MPC8377VRANGA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313CVRAFFC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313CZQAFFB Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP USA Inc. |
| Series | PowerQUICC II Pro (MPC83xx) |
| Core Architecture | PowerPC e300c3 |
| Core Count | 1 |
| Largeur du bus de données | 32-Bit |
| Fréquence d'horloge maximale | 333 MHz |
| Process Technology | 0.09 um CMOS |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 8 KB |
| Operating Voltage | 1.8 V / 2.5 V / 3.3 V |
| Memory Controller | DDR1/DDR2 up to 333 MHz |
| Ethernet | Dual 10/100/1000 Mbps (SGMII/TBI) |
| PCI Express | 1 lane |
| USB | USB 2.0 with integrated PHY |
| Encryption Accelerator | Not included (Rev 2.1 W/O ENCR) |
| Boîtier | 516-TEPBGA (27 x 27 mm) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant (lead-free TEPBGA) |
Configuration des broches de MPC8313CZQAFFB
| Broche A1 | VCC_CORE — Core supply voltage (1.0 V nominal) |
| Broche B5 | GND — Common ground reference |
| Broche C12 | DDR2_DQ[0] — DDR2 memory data bit 0 |
| Broche D18 | DDR2_A[15] — DDR2 memory address line |
| Broche AB1 | ETH0_SGMII_TX — Ethernet 0 SGMII transmit (high-speed) |
| Broche AB25 | ETH1_TBI_D[7] — Ethernet 1 TBI data bit 7 (high-speed) |
| Broche AC14 | PCIe_TX_P — PCI Express transmit (high-speed differential) |
| Broche AD24 | USB_DP — USB 2.0 data plus (high-speed) |
| Broche AE2 | UART0_TXD — DUART channel 0 transmit |
| Broche AF10 | LB_AD[0] — Local bus address/data bit 0 |
| Broche AF19 | JTAG_TCK — JTAG test clock |
| Broche AG3 | PORESET — Power-on reset input |
Applications typiques
MPC8313CZQAFFB convient pour 6 applications: Industrial Ethernet Gateway, Low-Density Network Router and Switch, Network-Attached Storage Controller, Print and Image Processing Controller, Factory Automation and Motor Control, Embedded Linux Appliance.
Industrial Ethernet Gateway
The MPC8313CZQAFFB's dual Gigabit Ethernet controllers with SGMII/TBI interfaces and integrated QUICC Engine make it a strong fit for industrial Ethernet gateways bridging fieldbus protocols to enterprise networks. At 333 MHz the e300c3 core handles Modbus/TCP, EtherNet/IP, or PROFINET routing layers while the QUICC Engine RISC subsystem offloads deterministic serial protocol processing, freeing host MIPS for application logic. The PCI Express lane supports Wi-Fi 6 or 5G module expansion for wireless backhaul, while DDR2 memory up to 1 GB provides headroom for protocol translation tables and local buffering.
Recommandé
Low-Density Network Router and Switch
Targeted at SMB routers, VPN concentrators, and small business switches, the MPC8313CZQAFFB delivers line-rate forwarding on both Gigabit Ethernet ports while leaving the e300c3 host core available for routing tables, ACL processing, and web management. The QUICC Engine handles HDLC, PPP, and ATM termination without host intervention, ideal for legacy WAN connectivity in branch office routers. The USB 2.0 host port supports external storage for logging or firmware update, and the local bus interface accommodates boot NOR flash and a hardware encryption daughter-card option.
Recommandé
Network-Attached Storage Controller
The MPC8313CZQAFFB powers entry-level NAS controllers and SOHO storage appliances where the dual Gigabit Ethernet ports enable link aggregation for higher throughput and the DDR2 controller supports up to 1 GB of system memory for RAID metadata caching. The PCI Express lane accommodates SATA or SAS controller silicon for disk attachment, while the local bus provides boot flash and EEPROM connectivity. The 333 MHz core efficiently runs lightweight NAS firmware stacks such as embedded Linux with SMB/CIFS and NFS daemons without taxing the host CPU.
Recommandé
Print and Image Processing Controller
Office printers, multifunction devices, and image-processing controllers leverage the MPC8313CZQAFFB's PCI Express lane for scanner/fax front-end connectivity, USB 2.0 host port for direct-print thumb drives, and dual Ethernet for office network and embedded service interfaces. The 333 MHz e300c3 core executes PostScript, PCL, and PDF rasterization in real time, while DDR2 memory holds page buffers during print-job rendering. The DUART and GPIO provide legacy control for stepper motors, paper-feed sensors, and operator panel interfaces.
Recommandé
Factory Automation and Motor Control
The MPC8313CZQAFFB is well suited to factory automation nodes where its combination of dual Ethernet (for ring-redundant industrial topologies), PCI Express (for machine-vision or motion-controller cards), and USB (for HMI touchscreen panels) simplifies board design. The QUICC Engine's deterministic serial protocol handling supports legacy industrial fieldbus such as Profibus or CANopen bridges when paired with external transceivers. The non-encryption variant keeps BOM cost low for cost-sensitive industrial nodes that do not require cryptographic authentication.
Recommandé
Embedded Linux Appliance
For OEM appliances running embedded Linux, the MPC8313CZQAFFB provides a stable, well-supported PowerPC platform with NXP's official LTIB and Yocto BSPs. Designers can host SSH, web servers, SNMP agents, and custom applications in the 1 GB DDR2 memory space while keeping the dual Ethernet ports as dedicated management/data interfaces. The USB 2.0 host port supports Wi-Fi or cellular modems, and the local bus accommodates industrial-grade NOR flash for reliable boot. The 333 MHz performance is sufficient for lightweight gateway and appliance workloads.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8313CZQAFFB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8313EZQAFFB | KMPC8313EVRAFFB | MPC8313CVRADDC | MPC8377VRANGA |
|---|---|---|---|---|---|
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA - same family | 516-TEPBGA - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Maximum Clock Frequency | 333 MHz | 333 MHz | 333 MHz | 266 MHz | 400 MHz |
| Encryption Accelerator | Not included (C variant) | SEC 2.0+ included (E variant) | SEC 2.0+ included (E variant) | Not included | Not included in this suffix |
| Core Architecture | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c4 |
| DDR Memory Support | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 266 MHz | DDR1/DDR2 up to 400 MHz |
| Gigabit Ethernet Ports | 2 | 2 | 2 | 2 | 2 |
| USB Interface | USB 2.0 with PHY | USB 2.0 with PHY | USB 2.0 with PHY | USB 2.0 with PHY | USB 2.0 with PHY |
| PCI Express | 1 lane Gen 1 | 1 lane Gen 1 | 1 lane Gen 1 | 1 lane Gen 1 | 2 lanes Gen 1 |
Principaux différenciateurs
- Lowest-cost Rev 2.1 variant in the same 516-TEPBGA footprint (vs MPC8313EZQAFFB)
- Industry-standard 333 MHz PowerPC e300c3 with mature Linux BSP support (vs MPC8377VRANGA)
- Integrated dual Gigabit Ethernet with QUICC Engine protocol offload (vs MPC8313CVRADDC)
Notes de conception
Estimated: the MPC8313CZQAFFB requires three independent supply domains - approximately 1.0 V for the core (VCC_CORE) and DDR2 I/O at 1.8 V, plus 3.3 V for general-purpose I/O and analog. Power sequencing must follow the order specified in the NXP hardware specification: 3.3 V first, then DDR voltage, then core voltage, with a maximum 200 ms delay between rails to prevent latch-up. Designers should use a multi-rail PMIC such as NXP's MMPF0200 or a discrete buck/linear regulator network with proper soft-start timing.
Estimated: typical power dissipation under sustained 333 MHz load is in the 2 W to 4 W range, depending on whether DDR and Ethernet interfaces are active. The 516-TEPBGA package relies on thermal balls on the bottom surface for heat conduction into the inner PCB ground plane. Designers should allocate at least 6 square inches of 4-layer 1 oz copper inner plane and consider a small clip-on heatsink if the enclosure is fanless with restricted airflow above 70 C ambient.
The 516-ball TEPBGA requires a multilayer PCB with microvia (laser-drilled) technology to fan out the inner rows of balls to break out signal traces. DDR2 routing requires 50-ohm single-ended controlled impedance with matched-length byte lanes within 25 mil tolerance. PCI Express and SGMII differential pairs require 100-ohm differential impedance and intra-pair length matching under 5 mil. Use the NXP reference schematic and layout checklist from the hardware specification as a starting point.
Do not confuse the 'C' (no encryption) suffix with the 'E' (encryption enabled) suffix when ordering. Mixing these variants in production causes inventory confusion and may force a software rewrite if encryption drivers were assumed. Also verify the silicon revision - Rev 2.1 (this part) and Rev 2.0 have minor errata differences; consult the latest NXP errata document before locking the firmware. Finally, ensure PORESET timing complies with the minimum 32 ms assertion window before code execution begins.
Informations de conformité
RoHS and REACH compliant per NXP product environmental compliance information; lead-free TEPBGA package. AEC-Q100 not applicable for this commercial-grade MPU. Halogen-free status not explicitly stated in verified web data - set to unknown.
