MPC8313CZQAGDC - 400MHz PowerQUICC II Pro MPU, 516-BGA | NXP
Référence : MPC8313CZQAGDC ✓ ActifMPC8313CZQAGDC Présentation
What is an MPU (Microprocessor Unit)? An MPU is a CPU-centric processor that requires external memory and peripherals, distinguishing it from a microcontroller (MCU) that integrates memory and I/O on-chip. The MPC8313CZQAGDC belongs to the broader hierarchy of MPU -> embedded processor -> application-specific SoC -> semiconductor IC. PowerQUICC II Pro devices integrate a PowerPC core with a Communication Processor Module (CPM) for high-bandwidth I/O offload, targeting routers, switches, and industrial gateways where deterministic networking is mandatory.
Key features include DDR1/DDR2 memory controller support, integrated Gigabit Ethernet MAC, USB 2.0 (full-speed), PCI 2.3 interface, and dual I2C. The 400MHz core delivers approximately 600 MIPS while the CPM offloads packet processing, frame management, and serial protocol handling. The device supports the QUICC Engine for HDLC, ATM, and Ethernet bridging typical of telecom infrastructure.
The MPC8313CZQAGDC uses a superscalar PowerPC core with dual-issue execution, 16KB instruction cache and 16KB data cache, MMU for full virtual memory support, and dedicated CPM peripherals connected via on-chip bus. The 0.09-micron process reduces core power versus prior 0.13-micron designs while preserving the legacy PowerQUICC software ecosystem, enabling easy migration from MPC8247/MPC8250 designs.
Typical applications include industrial routers, residential gateways, networked print servers, factory automation controllers, and low-end wireless base stations. The integrated GbE and PCI make it a single-chip control-plane solution for branch-office networking and embedded NAS appliances. AEC-Q100 grade is not offered - the part targets industrial and commercial systems.
When designing with this device, allocate a 4-layer PCB with continuous ground and power planes to manage the 516-ball BGA fan-out. Decouple the 1.8V, 2.5V, and 3.3V rails independently and follow NXP hardware design guidelines for DDR2 trace-length matching. Boot configuration pins must be pulled correctly before RESET deassertion.
This page synthesizes distributor pricing, cross-brand drop-in equivalents, and practical design notes not consolidated in the manufacturer datasheet, helping procurement and engineering teams evaluate the MPC8313CZQAGDC against available alternatives.
Alternatives de remplacement direct pour MPC8313CZQAGDC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
MPC8313ECZQAGDC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313CVRAGDC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313EZQAGDC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313CZQAGDC Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC II Pro MPC83xx |
| Core Processor | PowerPC e300c3 |
| Architecture | RISC 32-bit, dual-issue superscalar |
| Core Speed | 400 MHz |
| Number of Cores | 1 |
| Process Technology | 0.09-micron CMOS |
| Operating Voltage | 1.8V / 2.5V / 3.3V |
| Boîtier | 516-BGA (TEPBGA, 27x27 mm, exposed pad) |
| Memory Controller | DDR1 / DDR2 (32-bit) |
| Ethernet | Integrated Gigabit Ethernet MAC (RGMII) |
| USB | USB 2.0 Full-Speed |
| PCI | PCI 2.3 interface |
| Serial | 2x I2C, 2x UART, SPI |
| Température de fonctionnement | -40C to +105C (industrial extended) |
| Type de montage | Surface Mount |
| Tray Quantity | Tray |
Guide de configuration des broches du MPC8313CZQAGDC 516-bga (tepbga, 27x27 mm, exposed pad)
Configuration des broches du MPC8313CZQAGDC (boîtier 516-bga (tepbga, 27x27 mm, exposed pad)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8313CZQAGDC.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8313CZQAGDC convient pour 6 applications: Industrial Ethernet Router, Residential Gateway / xDSL Modem-Router, Network Attached Storage (NAS) Controller, Industrial Automation Controller, Print Server / Imaging Appliance, Low-Density Wireless Base Station.
Industrial Ethernet Router
The MPC8313CZQAGDC's integrated Gigabit Ethernet MAC with RGMII plus CPM-driven serial offload make it ideal for industrial-managed-switch and router designs. At 400MHz the e300c3 sustains wire-speed routing table lookups while the QUICC Engine handles HDLC/serial framing for backhaul links, eliminating an external frame processor. The -40C to +105C rating and 516-TEPBGA exposed pad support fanless enclosure designs used on factory floors, with NXP's Linux BSP+U-Boot enabling standard routing software stacks like Quagga or Bird without proprietary firmware.
Recommandé
Residential Gateway / xDSL Modem-Router
The MPC8313CZQAGDC anchors single-chip home gateway designs combining IPsec VPN, NAT, and QoS on the e300c3 plus PPPoE/ATM AAL offload in the CPM. DDR2 support keeps BOM low versus designs requiring external memory controllers, and the integrated GbE MAC feeds an external RGMII PHY for WAN-side connectivity. The QUICC Engine accelerates DSL framing, offloading the 400MHz CPU so it can sustain full routing throughput on the LAN side - this is exactly the workload NXP targets with the PowerQUICC II Pro marketing for ISP-supplied gateways.
Recommandé
Network Attached Storage (NAS) Controller
The MPC8313CZQAGDC's PCI 2.3 interface plus DDR2 controller pair naturally with RAID controller ASICs to build low-cost 4-bay NAS appliances. The e300c3 runs the NAS OS (Linux with Samba/NFS) and the GbE MAC sustains wire-speed file transfers for SOHO users. NXP provides board support packages with DMA-engine mappings that leverage the integrated PCI bus mastering, removing CPU overhead during multi-client reads. Exposed-pad TEPBGA 27x27mm simplifies thermal management in compact consumer NAS chassis without forced-air cooling.
Recommandé
Industrial Automation Controller
Factory automation platforms use the MPC8313CZQAGDC as a deterministic network gateway - EtherCAT master via the external ESC plus Modbus/TCP on the GbE MAC - while the e300c3 runs the PLC logic under VxWorks. The CPM's serial offload drives RS-485 fieldbus channels for legacy motor controllers. The -40C to +105C operating window is critical for cabinet-mounted industrial PCs; the industrial qualification and exposed thermal pad enable deployment near stepper drivers without separate heatsinking. NXP design references include EtherCAT slave reference code for the e300c3.
Recommandé
Print Server / Imaging Appliance
Office print servers and imaging appliances benefit from the MPC8313CZQAGDC's combination of USB 2.0 host for direct printer attachment, GbE MAC for LAN connectivity, and PCI for scanner/finisher expansion cards. The 400MHz e300c3 runs the PostScript/PDF interpreter stack while the CPM handles high-speed DMA between scanner and memory without CPU intervention. NXP's Linux BSP supports common printer driver frameworks (CUPS, Gutenprint), enabling OEMs to drop the chip into existing peripheral reference designs. Industrial temp rating suits printer-engine bay environments.
Recommandé
Low-Density Wireless Base Station
The MPC8313CZQAGDC targets small-cell and picocell base stations where it acts as the baseband controller, handling L2/L3 protocol stacks while external DSPs/FGPAs manage RF. The integrated QUICC Engine accelerates ATM/AAL2 framing common in 3G backhaul, and dual GbE ports (via PCI-attached external MAC plus internal GbE) provide separate paths for backhaul and O&M. The 0.09-micron process keeps power below 5W at 400MHz, enabling fanless small-cell enclosures. NXP's SmartDSP OS support and PowerPC toolchain reduce development time for protocol-stack teams.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8313CZQAGDC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8313ECZQAGDC | MPC8313CVRAGDC | MPC8313EZQAGDC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same |
| Core Speed | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Operating Temperature | -40C to +105C (industrial) | -40C to +105C (industrial) | -40C to +85C (commercial) | -40C to +105C (industrial) |
| Silicon Revision | Original (Rev 2.x) | E-revision (Rev 3.x) with errata fix | Original revision | E-revision (Rev 3.x) with errata fix |
| Ethernet MAC | 1x GbE RGMII | 1x GbE RGMII | 1x GbE RGMII | 1x GbE RGMII |
| Memory Controller | DDR1/DDR2 32-bit | DDR1/DDR2 32-bit | DDR1/DDR2 32-bit | DDR1/DDR2 32-bit |
| PCI | PCI 2.3 | PCI 2.3 | PCI 2.3 | PCI 2.3 |
Principaux différenciateurs
- Only MPC8313 family member with corrected silicon + industrial temperature (vs MPC8313CVRAGDC)
- E-revision provides errata fixes at no cost or footprint penalty (vs MPC8313ECZQAGDC)
- Quad-rated industrial temp + GbE integrated eliminates external PHY/MAC bridge chip (vs MPC8377VRANGA)
Notes de conception
The 516-ball TEPBGA at 1.0mm ball pitch requires a 4-layer stack-up with 0.4mm via-in-pad or dogbone fan-out. Per NXP hardware design guidelines, dedicate a continuous ground plane directly beneath the exposed thermal pad to dissipate the 5-7W core power and connect the thermal pad with at least 25 thermal vias (0.3mm drilled, plated shut). Trace length matching to within +/-50 mils is required for DDR2 address/command lanes.
The MPC8313CZQAGDC requires three independent supply rails: 1.8V (core), 2.5V (DDR2 termination tracking), and 3.3V (I/O). Each rail needs a dedicated bulk capacitor (22uF tantalum) plus 0.1uF ceramic bypass per power pin pair, placed within 5mm of the BGA balls. Power sequencing mandates 3.3V ramp first, then 2.5V, then 1.8V - reversed sequencing risks latch-up.
Boot configuration pins (cfg_reset_source, cfg_clk_source, cfg_boot_location) must be pulled correctly via 4.7k resistors BEFORE RESET deassertion; misconfiguration causes silent no-boot faults. The DDR2 calibration sequence relies on the e300c3 firmware reading SPD EEPROM - design the I2C bus with a 2.2k pull-up and never reuse it for any other device to avoid bus arbitration conflicts during boot.
Estimated: at 400MHz with full GbE+PCI activity, junction temperature rise = (P_dissipated) x (theta_JA). With P_dissipated approx 5W and TEPBGA theta_JA around 15-18 C/W (with 25 thermal vias), junction temperature rises 75-90C above 25C ambient. The exposed pad MUST be soldered to the thermal land and the thermal pad MUST be electrically tied to GND for ground-reference and EMI performance.
Informations de conformité
RoHS compliant per NXP PowerQUICC II Pro family documentation. Lead-free BGA balls. Industrial -40C to +105C rating. Not AEC-Q100 qualified (target application is industrial/networking, not automotive). REACH SVHC declarations available on request. Halogen-free status not specified in available data - set to 'unknown' pending datasheet confirmation.
