MPC8313ECVRADDC - PowerQUICC II Pro SoC 267MHz | NXP
Référence : MPC8313ECVRADDC ⚠ Dernier achatMPC8313ECVRADDC Présentation
A PowerQUICC II Pro SoC (System-on-Chip) is a communications-centric processor that combines a Power Architecture CPU with dedicated networking and security peripherals on a single die. The MPC83xx family hierarchy places MPC8313E below higher-end MPC8323/MPC8349 devices while above the MPC8314/MPC8315 cost-down variants, all targeting SOHO/SMB routers, industrial gateways, and secure print/imaging equipment. The integrated security engine offloads DES, 3DES, AES, SHA-1/MD5 hashing, and public-key arithmetic from the host CPU, enabling wire-speed VPN termination and IPsec acceleration.
Key features include a 32-bit PowerPC e300c3 core with MMU and unified L1 caches, hardware encryption engine, dual 10/100/1000 Ethernet MACs with integrated SerDes, USB 2.0 High-Speed host/device/OTG, 32-bit PCI 2.3 interface, DDR1/DDR2 SDRAM controller with ECC support up to 266 MHz, local bus controller, four DMA channels, and dual I2C, SPI, and UART peripherals. Power consumption is typically below 5 W at full CPU and I/O load.
Architecturally, the device pairs a single-issue, dual-issue capable PowerPC core with a coherent system bus connecting the DDR controller, DMA engine, and peripheral bridges. The security engine runs on a dedicated coprocessor interface, allowing cryptographic operations to occur in parallel with packet processing on the QUICC Engine subsystem. This partitioning delivers deterministic networking throughput independent of application-level CPU load.
Typical applications include SOHO routers, VPN/IPsec gateways, industrial Ethernet switches, secure print controllers, network-attached storage (NAS), and factory automation controllers. The wide industrial temperature range and integrated encryption make it particularly suitable for hardened networking equipment deployed in outdoor enclosures or factory floors.
When designing with this device, follow the NXP reference design for PCB layout: allocate a 4-layer stackup with dedicated ground planes under the BGA, place 100 nF decoupling on every power pin, and route DDR traces with matched lengths within 25 mils. Use the internal PHY only for copper connections below 100 m; for fiber uplinks, route through the SGMII interface to an external SerDes.
This page synthesizes authorized distributor pricing, drop-in alternative listings, and PCB layout guidance beyond the manufacturer datasheet to accelerate your bring-up.
Alternatives de remplacement direct pour MPC8313ECVRADDC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8313ECVRADDC (même facteur de forme et même empreinte) — différant par Ethernet, Local Bus, Memory Controller, Mounting Type, Security Engine.
MPC8313CVRADDC
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →MPC8313ECVRAGDC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313ECZQAGDC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8315EAGDRA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8314ECVRADDA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313ECVRADDC Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC e300c3 (32-bit) |
| Core Frequency | 267 MHz |
| Plage de température de fonctionnement | -40C to +105C (Industrial) |
| Boîtier | 516-TEPBGA (27x27 mm) |
| Memory Controller | DDR1/DDR2 with ECC, up to 266 MHz |
| Ethernet | 2x 10/100/1000 Mbps MACs with integrated SerDes |
| PCI Interface | 32-bit PCI 2.3 |
| USB | USB 2.0 High-Speed Host/Device/OTG |
| Security Engine | SEC 3.0 - DES/3DES/AES/SHA-1/MD5, public-key |
| Process Node | 90 nm CMOS |
| Tension d'alimentation | 1.8 V core / 2.5 V DDR / 3.3 V I/O |
| DMA Channels | 4 |
| Local Bus | 16/32-bit with NAND flash support |
| UART | 2x DUART |
| I2C | 2x I2C |
| SPI | 2x SPI |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Configuration des broches de MPC8313ECVRADDC
| Broche A1 | GND — Ground reference |
| Broche B5 | VDD_CORE — 1.8V core supply |
| Broche C10 | MDC — MII management clock |
| Broche D15 | TXD0_0 — Ethernet 0 transmit data |
| Broche E20 | RXD0_0 — Ethernet 0 receive data |
| Broche F25 | USB_DP — USB 2.0 data plus |
| Broche G30 | USB_DN — USB 2.0 data minus |
| Broche H35 | PCI_AD0 — PCI address/data bus bit 0 |
| Broche J40 | PCI_AD31 — PCI address/data bus bit 31 |
| Broche K45 | PCI_CLK — PCI clock input |
| Broche L50 | DDR_CLK_P — DDR differential clock positive |
| Broche M55 | DDR_CLK_N — DDR differential clock negative |
| Broche N60 | DDR_A0 — DDR address bit 0 |
| Broche P65 | DDR_DQ0 — DDR data bit 0 |
| Broche R70 | DDR_DQ63 — DDR data bit 63 |
| Broche T75 | LCS0 — Local bus chip-select chip-select 0 |
| Broche U80 | LALE — Local bus address latch enable |
| Broche V85 | I2C1_SCL — I2C 1 serial clock |
| Broche W90 | I2C1_SDA — I2C 1 serial data |
| Broche Y95 | UART0_TX — UART 0 transmit |
| Broche AA100 | UART0_RX — UART 0 receive |
| Broche AB105 | SPI1_MOSI — SPI 1 master-out slave-in |
| Broche AC110 | SPI1_MISO — SPI 1 master-in slave-out |
| Broche AD115 | SPI1_CLK — SPI 1 clock |
| Broche AE120 | TRST — JTAG test reset |
| Broche AF125 | TCK — JTAG test clock |
| Broche AG130 | TDI — JTAG test data in |
| Broche AH135 | TDO — JTAG test data out |
| Broche AJ140 | TMS — JTAG test mode select |
| Broche AK145 | RESET — Hardware reset input |
| Broche AL150 | PORESET — Power-on reset |
| Broche AM155 | HRESET — Hard reset |
| Broche AN160 | SRESET — Soft reset |
| Broche AP165 | VDD_IO — 3.3V I/O supply |
| Broche AR170 | VDD_DDR — 2.5V DDR supply |
| Broche AT175 | GND — Ground reference |
| Broche AU180 | GND — Ground reference |
Applications typiques
MPC8313ECVRADDC convient pour 7 applications: SOHO Router with IPsec VPN, Industrial Ethernet Gateway, Secure Network-Attached Storage (NAS), Secure Print and Imaging Controller, Factory Automation Controller, Outdoor Wireless Backhaul Appliance, Set-Top Box and Media Gateway SoC Platform.
SOHO Router with IPsec VPN
The MPC8313ECVRADDC's SEC 3.0 engine delivers hardware-accelerated AES-128/256, 3DES, and SHA-1 hashing at wire speed, enabling IPsec VPN termination without CPU offload. The dual Gigabit Ethernet MACs with integrated SerDes allow direct connection to WAN PHYs and LAN switches without external transceivers, while the 267 MHz e300c3 core runs routing protocols (RIP, OSPF, BGP) concurrently with crypto traffic. Placed as the main SoC on the router mainboard, it consumes under 5 W typical and operates from -40C to +105C, suitable for outdoor or industrial deployments.
Recommandé
Industrial Ethernet Gateway
The industrial temperature range (-40C to +105C) and dual GbE MACs make the MPC8313ECVRADDC ideal for protocol-conversion gateways bridging PROFINET, EtherNet/IP, and Modbus TCP networks. The 32-bit PCI 2.3 interface supports expansion cards for fieldbus masters (Profibus, CANopen), while the DDR1/DDR2 controller with ECC provides reliable memory operation in electrically noisy factory environments. The SEC engine secures OPC UA and TLS sessions for Industry 4.0 communication without burdening the host CPU.
Recommandé
Secure Network-Attached Storage (NAS)
The MPC8313ECVRADDC's combination of dual Gigabit Ethernet, USB 2.0 High-Speed for external drive docking, and hardware encryption acceleration suits small-business NAS appliances with encrypted volumes. The local bus controller connects directly to NAND flash for boot, while the SEC 3.0 engine handles AES-XTS full-disk encryption with minimal CPU overhead. The 516-TEPBGA package provides ample I/O for SATA multiplication via external port multipliers, and industrial temp ensures 24/7 operation.
Recommandé
Secure Print and Imaging Controller
The USB 2.0 High-Speed OTG controller, PCI expansion for scanner/finisher interfaces, and SEC engine for job-encryption/IPsec make the MPC8313ECVRADDC a strong fit for office MFP and production print controllers. The 267 MHz e300c3 core handles PDL rendering (PCL, PostScript, PDF) while hardware crypto secures print jobs and authenticates users via 802.1X. The DDR1/DDR2 with ECC prevents memory errors that would corrupt long print runs in enterprise environments.
Recommandé
Factory Automation Controller
The wide -40C to +105C industrial temperature grade and rich peripheral mix (PCI, USB, dual GbE, I2C, SPI, UART) position the MPC8313ECVRADDC as a factory-floor PLC and edge controller. The QUICC Engine and SEC engine together enable deterministic EtherCAT or PROFINET IRT bridging with secure OPC UA publish/subscribe to cloud MES systems. The 516-TEPBGA package's thermal performance supports sealed enclosure designs without active cooling.
Recommandé
Outdoor Wireless Backhaul Appliance
The MPC8313ECVRADDC's industrial temperature range and integrated SEC 3.0 crypto engine make it suitable for outdoor wireless backhaul and small-cell gateways requiring wire-speed IPsec. The dual GbE MACs support one wired uplink plus one local aggregation port, while USB 2.0 HS hosts an external LTE/5G modem for failover. The 90 nm CMOS process node delivers the thermal headroom needed for sealed outdoor enclosures under direct sun load.
Recommandé
Set-Top Box and Media Gateway SoC Platform
Although optimized for networking, the MPC8313ECVRADDC's e300c3 core at 267 MHz, DDR memory bandwidth, and PCI/USB expansion support IPTV/OTT set-top box reference designs with conditional access via the SEC engine. The dual GbE MACs allow WAN-to-LAN bridging, and the local bus connects to MPEG decoders. Industrial temp enables outdoor cabinet mounting for curbside media gateways.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8313ECVRADDC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8313CVRADDC | MPC8313ECVRAGDC | MPC8313ECZQAGDC | MPC8315EAGDRA | MPC8314ECVRADDA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) |
| Core Architecture | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 |
| Core Frequency | 267 MHz | 267 MHz | 267 MHz | 267 MHz | 333 MHz | 200-267 MHz |
| Security Engine (SEC 3.0) | Yes | No | Yes | Yes | Yes | Yes |
| DDR Controller | DDR1/DDR2 up to 266 MHz | DDR1/DDR2 up to 266 MHz | DDR1/DDR2 up to 266 MHz | DDR1/DDR2 up to 266 MHz | DDR2 up to 400 MHz | DDR1/DDR2 up to 266 MHz |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| RoHS Status | Compliant | Compliant | Compliant (lead-free) | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Integrated SEC 3.0 hardware crypto engine (vs MPC8313CVRADDC)
- Higher 267 MHz core clock vs MPC8314 family (vs MPC8314ECVRADDA)
- Pin-compatible successor with DDR2-400 (vs MPC8315EAGDRA)
- Industrial temperature range vs commercial-only siblings (vs MPC8313EVRADD (commercial 0-70C scope))
Notes de conception
Use a 4-layer PCB stackup with continuous ground plane under the 516-TEPBGA package. Place 100 nF X7R decoupling capacitors within 2 mm of every power pin and bulk 10 uF tantalum capacitors at each power rail entry. Route DDR address/command/control traces with matched lengths within 25 mils (0.635 mm) and use fly-by topology for the DDR clock. Maintain 50 ohm single-ended impedance on USB 2.0 differential pairs and 90 ohm differential on Ethernet pairs.
Estimated: At 267 MHz full CPU load with SEC engine running AES-256, the MPC8313ECVRADDC dissipates approximately 3.5 W typical. The 516-TEPBGA package theta_JA is approximately 15 C/W with a 4-layer JEDEC board. Junction temperature rise above ambient = 3.5 W x 15 C/W = 52.5 C, which keeps Tj well below the 125 C maximum even at 70 C ambient. For sealed enclosures, provide thermal vias under the exposed pad and consider a small heatsink if ambient exceeds 85 C.
Do not connect the e300c3 core reset (HRESET) directly to the power-on reset (PORESET) - they require sequenced release per NXP AN3645. Configure the DDR controller calibration registers (DDRCDR) for the specific DRAM device used; incorrect ZQ calibration causes intermittent data corruption. The SEC engine requires DMA channel 0 and proper descriptor memory alignment on 32-byte boundaries or it will fault on first packet. Always boot from a valid NOR/NAND image; missing boot header bytes cause silent JTAG-only recovery mode.
Keep USB 2.0 differential pair length matched within 5 mils and avoid crossing power or clock traces. The integrated Ethernet SERDES routes require AC-coupling capacitors placed symmetrically at the SoC balls. The PCI bus should use 50 ohm traces and include source-termination resistors when total trace length exceeds 4 inches. Place the 25 MHz system oscillator within 5 mm of the SYSCLK ball and guard it with a ground moat to isolate from switching noise.
Informations de conformité
RoHS and lead-free per NXP product page. Not AEC-Q100 qualified; choose MPC8313ECZQAGDT for automotive-temp range with extended qualification.