MPC8323EVRAFDC - 333MHz PowerQUICC II Pro MPU | NXP | BGA-516
Référence : MPC8323EVRAFDC ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.75 | $48,75 |
| 10 | $44.2 | $442,00 |
| 100 | $39.85 | $3 985,00 |
| 500 | $36.4 | $18 200,00 |
| 1 000 | $33.1 | $33 100,00 |
MPC8323EVRAFDC Présentation
An MPU (Microprocessor Unit) is a System-on-Chip (SoC) class processor that integrates a CPU core, memory controller, and a rich peripheral set on a single die. Within the broader taxonomy, an MPU sits above a microcontroller (MCU) in integration depth and above a discrete CPU in functional completeness, and is typically classified as an embedded processor or communications processor when paired with protocol engines like the QE block here.
Key features of the MPC8323EVRAFDC include the PowerPC e300c2 core with 16 KB I-cache and 16 KB D-cache, a DDR1/DDR2 SDRAM memory controller with ECC, two 10/100/1000 Mbps Ethernet MACs (GMII/RGMII/TBI), a USB 2.0 Full/High-Speed controller, a 32-bit PCI 2.3 interface, the QUICC Engine supporting UTOPIA-L2 / POS-PHY / TDM / HDLC / ATM / Ethernet, an integrated Security Engine (SEC 2.0) for DES/3DES/AES/SHA/RSA, and a 0 to 105 °C commercial operating temperature range. The 'DC' suffix indicates a 27x27 mm FPBGA package, while 'R' indicates tape-and-reel packaging.
Architecturally, the device uses a 16-bit DDR memory controller bus, separate address and data buses, and the QE block that offloads protocol processing from the e300c2 core to dedicated RISC engines. This dual-core approach (e300c2 + QE RISC) is what enables the MPC8323E to sustain wire-speed packet processing on multiple T1/E1 channels or a UTOPIA bus while leaving the host CPU free for control-plane software.
Typical applications include industrial routers and gateways, wired and wireless access concentrators, VoIP and IP-PBX systems, DSLAM line cards, industrial control and automation equipment, and secure communications appliances. Designers select the MPC8323E for cost-effective multi-channel TDM aggregation, IPsec/SSL acceleration via the SEC engine, and PCI-based expansion to legacy telecom backplanes.
When designing with this device, ensure the 27x27 mm FPBGA PCB footprint has adequate via-in-pad or via-array escape routing and at least four PCB layers with dedicated power planes. The DDR controller requires matched-impedance trace lengths and 50-ohm controlled impedance for USB 2.0 High-Speed signaling, both of which are essential for reliable operation at industrial temperature extremes.
This page synthesizes distributor pricing, package details, and application guidance for the MPC8323EVRAFDC, drawing on manufacturer datasheets and authorized distributor listings rather than relying solely on the manufacturer brief.
Alternatives de remplacement direct pour MPC8323EVRAFDC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8323EVRAFDC (même facteur de forme et même empreinte) — différant par Memory Controller, Operating Temperature, Package, RoHS Status, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8323CVRAFDC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8323EZQAFDC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8323EZQAFDCA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8321EVRAFDCA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8323EZQAFFC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8323EVRAFDC Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC e300c2 |
| Number of Cores | 1 |
| Largeur du bus de données | 32-bit |
| Maximum Core Frequency | 333 MHz |
| Series | MPC83xx (PowerQUICC II Pro) |
| Boîtier | 516-FPBGA (27x27 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 °C to +105 °C |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Memory Controller | DDR1/DDR2 SDRAM with ECC |
| QUICC Engine (QE) | Yes (UTOPIA-L2, POS-PHY, TDM, HDLC, ATM) |
| Security Engine (SEC) | Yes (SEC 2.0: DES/3DES/AES/SHA/RSA) |
| Ethernet MACs | 2x 10/100/1000 Mbps (GMII/RGMII/TBI) |
| USB Controller | USB 2.0 Full/High-Speed |
| PCI Interface | PCI 2.3, 32-bit |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du MPC8323EVRAFDC 516-fpbga (27x27 mm)
Configuration des broches du MPC8323EVRAFDC (boîtier 516-fpbga (27x27 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8323EVRAFDC.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8323EVRAFDC convient pour 6 applications: Industrial Router and Gateway, VoIP and IP-PBX System, DSLAM Line Card and Access Concentrator, Industrial Control and Automation Equipment, Wireless Access Point / Controller, Secure Communications Appliance.
Industrial Router and Gateway
The MPC8323EVRAFDC is well suited for industrial router and gateway designs because its 333 MHz e300c2 core and integrated QUICC Engine sustain wire-speed multi-channel TDM/IP bridging while leaving headroom for routing-table lookups, NAT, and QoS policy enforcement. The dual Gigabit Ethernet MACs handle WAN aggregation without an external switch, while the USB 2.0 High-Speed port supports cellular modem or Wi-Fi dongle attachment. Placing the MPU on a 4-layer PCB with dedicated GND and 3.3V/1.8V/1.2V power planes ensures stable operation across the 0 to 105 °C industrial range, and the SEC 2.0 engine offloads IPsec/SSL handshakes to a hardware engine rather than software loops.
Recommandé
VoIP and IP-PBX System
For VoIP and IP-PBX systems, the MPC8323EVRAFDC's QUICC Engine handles T1/E1 TDM channelization and HDLC framing at wire speed while the e300c2 core runs the SIP/RTP stack, codec handling (G.711/G.729), and echo cancellation. The SEC 2.0 engine accelerates SRTP/AES encryption for secure voice without taxing the host core. The PCI 2.3 interface connects to DSP daughter cards for additional voice-processing channels, while the 16-bit DDR2 controller with ECC supports the high-bandwidth packet buffers required for hundreds of simultaneous calls. Designers should provision 50-ohm controlled-impedance routing on the USB 2.0 lines to support the operator's provisioning interface.
Recommandé
DSLAM Line Card and Access Concentrator
The MPC8323EVRAFDC fits DSLAM line cards and access concentrators because its UTOPIA-L2 interface connects to multi-channel DSL PHY framer chips, and the QUICC Engine terminates ATM and HDLC traffic at line rate. The dual Gigabit Ethernet MACs aggregate upstream traffic to the central-office switch, while the PCI 2.3 interface backplanes into the DSLAM chassis controller. The 0 to 105 °C temperature range tolerates the warm central-office cabinet, and the SEC engine provides per-subscriber authentication acceleration. Compared to a discrete CPU plus framer approach, the integrated QE block reduces BOM cost and PCB area for typical 24-48 port line cards.
Recommandé
Industrial Control and Automation Equipment
In industrial automation, the MPC8323EVRAFDC serves as the main control and communication processor for programmable logic controllers (PLCs), SCADA gateways, and protocol-conversion bridges. Its 333 MHz e300c2 core runs deterministic real-time control loops, while the QE block handles serial fieldbus protocols such as Modbus RTU over TDM or HDLC-framed Profibus. The DDR2 controller and ECC memory support reliable long-term operation in factory environments with electrical noise. The 0 to 105 °C range covers most factory-floor cabinets, and the SEC engine secures remote-management tunnels to the operations center.
Recommandé
Wireless Access Point / Controller
For wireless access points and lightweight WLAN controllers, the MPC8323EVRAFDC's USB 2.0 High-Speed port connects to 802.11n Wi-Fi adapters, while the dual Gigabit Ethernet MACs backhaul to the wired network. The e300c2 core runs the WLAN control plane, including 802.1X/EAP authentication acceleration through the SEC 2.0 engine. The QUICC Engine handles legacy serial control links (T1/E1 backhaul) where the AP also serves as a small-cell gateway. Board designers should reserve at least 4-layer stack-up and ground flooding under the BGA to control EMI from the 333 MHz core and USB 2.0 clocks.
Recommandé
Secure Communications Appliance
The MPC8323EVRAFDC is well matched to secure communications appliances such as VPN concentrators, encrypted WAN optimizers, and tactical-radio gateways. The SEC 2.0 engine offloads DES/3DES/AES/SHA/RSA primitives, sustaining hundreds of IPsec tunnels at line rate without the e300c2 host core intervention. The QUICC Engine terminates TDM and serial crypto-bearing links, while the dual Gigabit Ethernet MACs aggregate plaintext and ciphertext traffic. The 0 to 105 °C range supports deployment in vehicle-mounted and outdoor cabinets. The integrated DDR2 with ECC reduces soft-error risk for long-uptime crypto applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8323EVRAFDC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8323CVRAFDC | MPC8323EZQAFDC | MPC8323EZQAFDCA | MPC8321EVRAFDCA | MPC8323EZQAFFC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-FPBGA (27x27) | 516-FPBGA (27x27) - same | 516-FPBGA (27x27) - same | 516-FPBGA (27x27) - same | 516-FPBGA (27x27) - same | 516-FPBGA (27x27) - same |
| Core | e300c2 | e300c2 | e300c2 | e300c2 | e300c2 | e300c2 |
| QUICC Engine | Yes | No | Yes | Yes | Yes | Yes |
| Security Engine (SEC) | Yes (SEC 2.0) | No | Yes | Yes | Yes | Yes |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Integrated QUICC Engine for wire-speed protocol offload (vs MPC8323CVRAFDC)
- Security Engine (SEC 2.0) for hardware-accelerated cryptography (vs MPC8323EZQAFFC (different QE variant))
- 333 MHz e300c2 core with ECC-enabled DDR2 controller (vs MPC8321EVRAFDCA)
Notes de conception
The 516-FPBGA 27x27 mm package requires a 4-layer (preferably 6-layer) PCB stack-up with via-in-pad or staggered microvia escape routing under the BGA. Assign one continuous ground plane on the layer directly beneath the BGA, and isolate high-speed DDR, PCI, and GMII signals on dedicated inner layers with reference-ground stitching vias every 2-3 mm to control impedance and crosstalk. Power-plane islands for 1.2V (core), 1.8V (DDR2), 2.5V (DDR1), and 3.3V (I/O) must be decoupled with 0.1 µF and 10 µF ceramic capacitors placed within 5 mm of the BGA.
At 333 MHz with both Ethernet MACs and the QUICC Engine active, junction temperature rises approximately 15-20 °C above ambient in the 516-FPBGA package under typical 1.2V core load. Place at least 1 square inch of unbroken copper pour on the top layer connected to the BGA's thermal balls, and add thermal vias (0.3 mm pitch, 0.2 mm drill) under the center thermal array. A small clip-on heatsink may be required if the application runs at the upper end of the 0 to 105 °C range inside a sealed enclosure.
DDR2 traces must be length-matched to within ±25 mils for the byte lanes and within ±50 mils between byte groups, with 50-ohm single-ended impedance to ground. GMII/RGMII traces to the Ethernet PHY require 50-ohm controlled impedance with no more than two connector vias in the path. The USB 2.0 DP/DM differential pair needs 90-ohm differential impedance, common-mode choke, and ESD protection array near the connector. Always series-terminate the PCI bus at the MPU end to suppress ringing on the 66 MHz clock edge.
Do not assume that all MPC8323-family part suffixes share the same QE microcode package - the 'ZQ', 'VR', and 'RA' suffixes denote different QE configurations and may require updated U-Boot firmware or NXP-provided header files. Before board bring-up, verify the QE configuration register values against the silicon revision reported by the boot ROM. Incorrect QE initialization is the most common cause of 'no TDM activity' debug sessions on MPC8323E hardware.
Informations de conformité
RoHS-compliant per NXP product page. The MPC8323E family is not AEC-Q100 qualified; it targets commercial and industrial telecom applications rather than automotive.
