MPC8347EVRAGDB - PowerQUICC II Pro e300 SoC 400MHz 620-HBGA | NXP
Référence : MPC8347EVRAGDB ⚠ Dernier achatMPC8347EVRAGDB Présentation
What is a PowerQUICC II Pro processor? It is a member of NXP's (formerly Freescale) PowerQUICC family of communications processors that combine a Power Architecture CPU core with integrated networking and peripheral interfaces. The hypernym chain is: SoC -> communications processor -> embedded MPU -> microprocessor -> integrated circuit. PowerQUICC II Pro is the third-generation extension of the PowerQUICC II line, designed for mid-range networking, storage, and industrial control applications where deterministic peripheral integration matters more than raw core throughput.
Key features include: 400 MHz e300 core with 32-bit Power Architecture ISA; integrated DDR1/DDR2 memory controller with ECC; dual 10/100/1000 Mbps Ethernet MACs (GMII/RGMII/TBI); dual PCI interfaces (PCI 2.3); USB 2.0 Hi-Speed (480 Mbps) host/device/OTG; integrated security engine (SEC 2.0) for DES/3DES/AES/SHA; four UARTs, I2C, SPI, and local bus controller. The 620-HBGA package exposes all peripherals and memory interfaces, targeting industrial temperature grade (0C to 105C).
Technically, the MPC8347EVRAGDB uses a 0.13 micron process with three supply rails (1.8V core, 2.5V DDR reference, 3.3V I/O), and includes a 32 KB instruction / 32 KB data L1 cache plus a unified 256 KB L2 cache. The integrated security engine offloads crypto from the CPU, and the QUICC Engine technology enables programmable protocol termination. The 620-HBGA package has a 1 mm pitch on a 29x29 mm body, requiring a 6+ layer PCB with 0.5 oz copper and controlled-impedance routing for the high-speed interfaces.
Typical applications include: industrial Ethernet switches and routers, secure VPN gateways, networked storage controllers (NAS/iSCSI), factory automation controllers, and PCI-based peripheral cards. The combination of dual GbE, dual PCI, and USB makes it suitable for line cards where multiple interface standards must coexist.
A key design consideration: this part is marked End-of-Life by NXP per the product page, so second-source validation and lifetime-buys should be evaluated before new designs. Use NXP's PowerQUICC II Pro BSDL and IBIS models for signal-integrity simulation on the 620-ball BGA.
This page synthesizes distributor stock, drop-in compatible variants from the same MPC83xx family, and practical design notes that complement the manufacturer hardware specification document.
Alternatives de remplacement direct pour MPC8347EVRAGDB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8347EVRAGDB (même facteur de forme et même empreinte) — différant par Ethernet, Operating Temperature, Package, USB, Core Architecture.
MPC8347VRAGDB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8347ECVRAGDB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8347CVVAGDB
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8347CZUAJD
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8343ECVRAGDB
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →MPC8347EVRAGDB Valeurs maximales et caractéristiques électriques
| Core Architecture | Power Architecture e300 (32-bit) |
| Core Frequency | 400 MHz |
| Core Count | 1 |
| Instruction Set | 32-bit Power Architecture |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | 256 KB unified |
| Process Technology | 0.13 micron CMOS |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet | Dual 10/100/1000 Mbps (GMII/RGMII/TBI) |
| PCI | Dual PCI 2.3 interfaces |
| USB | USB 2.0 Hi-Speed (480 Mbps), host/device/OTG |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA-1/MD-5) |
| Serial I/O | 4x UART, 2x I2C, SPI |
| Supply Voltages | 1.8 V core / 2.5 V DDR / 3.3 V I/O |
| Boîtier | 620-HBGA (29x29 mm, 1 mm pitch) |
| Température de fonctionnement | 0C to +105C (industrial) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Product Family | PowerQUICC II Pro (MPC83xx) |
| Statut du cycle de vie | End of Life (Last Time Buy) |
Guide de configuration des broches du MPC8347EVRAGDB 620-hbga (29x29 mm, 1 mm pitch)
Configuration des broches du MPC8347EVRAGDB (boîtier 620-hbga (29x29 mm, 1 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8347EVRAGDB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8347EVRAGDB convient pour 6 applications: Industrial Ethernet Switch / Router, Secure VPN Gateway / Firewall Appliance, Networked Storage Controller (NAS / iSCSI), Industrial Automation Controller, PCI-Based Peripheral Card, Wireless Base Station Edge Router.
Industrial Ethernet Switch / Router
The MPC8347EVRAGDB's dual 10/100/1000 Mbps Ethernet MACs (GMII/RGMII/TBI) directly drive two SFP/RJ45 ports without an external switch ASIC, and the QUICC Engine technology enables programmable protocol termination for VLAN, QoS, and ACL offload at line rate. Paired with a managed Layer-2 PHY and the integrated DDR1/DDR2 memory controller with ECC, the part handles 16-32 port managed switches at wire speed. The 400 MHz e300 core is reserved for routing table updates, SNMP, and CLI management tasks, leaving the QUICC Engine to do the heavy lifting. The 0C to +105C industrial temperature range suits outdoor cabinet installations. Compared to a discrete CPU + external switch solution, this integrated approach reduces PCB area by approximately 40% and BOM cost by approximately 30%.
Recommandé
Secure VPN Gateway / Firewall Appliance
The SEC 2.0 hardware crypto engine integrated into MPC8347EVRAGDB offloads AES, 3DES, SHA-1, and MD-5 from the e300 core, sustaining multi-hundred-Mbps IPsec/SSL throughput without CPU bottlenecks. The dual GbE MACs provide a clear WAN/LAN separation, while dual PCI slots accept off-the-shelf crypto accelerator cards (such as Cavium Nitrox or HiFN) when FIPS 140-2 certification is required. The DDR1/DDR2 controller with ECC protects against single-bit errors in key tables, and the USB 2.0 Hi-Speed port serves as a console or 3G/4G modem backup link. The 620-HBGA package with exposed thermal pad supports the 7-9 W typical dissipation under full crypto load with a moderate heatsink or 4 square inches of copper pour.
Recommandé
Networked Storage Controller (NAS / iSCSI)
The MPC8347EVRAGDB's combination of dual GbE (for bonding/teaming or MPIO), dual PCI (for SAS/SATA controller expansion such as LSI 1068e or AMCC 580), and 32-bit Power Architecture core makes it ideal for entry-level iSCSI or NAS controllers supporting 4-8 disk drives. The DDR1/DDR2 memory controller holds ZFS/inode metadata with ECC protection against silent data corruption, a common requirement for SOHO RAID systems. The QUICC Engine handles iSCSI TCP/IP and iSER protocol termination, freeing the e300 core for filesystem management. The Hi-Speed USB port provides a backup tape or removable media target. Storage OEMs typically pair this SoC with a Marvell 88SX6081 or LSI 1068e SAS controller on PCI.
Recommandé
Industrial Automation Controller
In factory automation, the MPC8347EVRAGDB acts as a programmable logic controller (PLC) or motion controller with dual GbE for EtherCAT/Master-Slave TCP/IP, dual PCI for fieldbus cards (Profibus, CANopen via PXI mezzanines), and 4 UARTs for legacy RS-485 device integration. The e300 core at 400 MHz executes deterministic real-time control loops, while the QUICC Engine offloads industrial protocol framing. The 0C to +105C operating range suits factory floor enclosures and outdoor control cabinets. The integrated DDR2 controller with ECC eliminates the need for external memory protection circuits required in industrial safety systems (IEC 61508 SIL 2). Compact 620-HBGA packaging enables PC/104-Plus form factor PLCs.
Recommandé
PCI-Based Peripheral Card
The MPC8347EVRAGDB's dual PCI 2.3 interfaces allow it to operate as a PCI host on a peripheral card, controlling downstream PCI devices such as DSP boards, FPGA co-processors, or specialized accelerator ASICs. The e300 core loads firmware into the attached accelerator and supervises data movement through DMA. This is a common pattern in DSP cluster cards for radar/sonar signal processing. The integrated DDR2 memory controller provides a shared buffer pool for the accelerator's working data. The USB 2.0 port can serve as a debug console or auxiliary data path. The 620-HBGA package supports the airflow typical of 6U CompactPCI or PICMG carrier cards.
Recommandé
Wireless Base Station Edge Router
In 2G/3G wireless infrastructure edge routers, the MPC8347EVRAGDB handles GTP/PDP tunneling with its QUICC Engine and SEC 2.0 encrypts backhaul traffic to the operator's core network. The dual GbE uplinks, USB 2.0 for local management, and 4 UARTs for console/diagnostic access fit the typical picocell or femtocell controller bill of materials. The 400 MHz e300 is sufficient for control-plane handling when the QUICC Engine carries the data-plane GTP tunnel termination. The DDR2 controller with ECC supports neighbor-cell databases and subscriber session tables. The 620-HBGA package is designed for fanless conduction-cooled enclosures in outdoor base station cabinets, supported by the 0C to +105C operating range.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8347EVRAGDB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8347VRAGDB | MPC8347ECVRAGDB | MPC8343ECVRAGDB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 620-HBGA (29x29 mm) | 620-HBGA (29x29 mm) - same | 620-HBGA (29x29 mm) - same | 620-HBGA (29x29 mm) - same |
| Core Frequency | 400 MHz | 400 MHz | higher speed grade | 400 MHz |
| Security Engine (SEC 2.0) | Yes (AES/3DES/SHA-1/MD-5) | No | Yes | Yes |
| Ethernet MACs | Dual 10/100/1000 | Dual 10/100/1000 | Dual 10/100/1000 | Single 10/100/1000 |
| PCI Interfaces | Dual PCI 2.3 | Dual PCI 2.3 | Dual PCI 2.3 | Single PCI 2.3 |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Lifecycle Status | End of Life (Last Time Buy) | End of Life | End of Life | End of Life |
| Core Architecture | e300 Power Architecture (32-bit) | e300 Power Architecture (32-bit) | e300 Power Architecture (32-bit) | e300 Power Architecture (32-bit) |
Principaux différenciateurs
- Integrated hardware crypto engine (SEC 2.0) (vs MPC8347VRAGDB)
- Dual Gigabit Ethernet MACs versus single (vs MPC8343ECVRAGDB)
- DDR1/DDR2 memory controller with ECC (vs External memory controller + ECC chip)
Notes de conception
Estimated: at VIN = 3.3 V I/O rail and a typical MPC8347EVRAGDB core power of approximately 5 W to 7 W under full GbE + crypto load, the 620-HBGA package with theta_JA around 12 C/W (4-layer PCB, still air) results in a junction temperature rise of approximately 60 C to 84 C. The 620-HBGA has an exposed thermal pad that MUST be soldered to a 25 mm x 25 mm minimum copper pour on the top layer; add thermal vias (0.3 mm pitch, 1 oz copper plating) to inner ground planes. For sealed enclosures, design for at least 4 square inches of additional copper and consider a clip-on heatsink. Do not exceed 105 C junction.
Use a 6-layer or 8-layer PCB stackup with dedicated power planes for the three rails (1.8 V core, 2.5 V DDR reference, 3.3 V I/O). Place 10 uF bulk + 0.1 uF + 1 nF ceramic decoupling within 5 mm of every power pin. DDR2 signals require 50 ohm single-ended controlled impedance (60 ohm differential for DQS). Route GMII/RGMII signals with 100 ohm differential and length-matching to within 100 mil. Use the NXP IBIS models (MPC8347EA_IBIS) for signal-integrity simulation. Exposed thermal pad requires 0.2 mm diameter micro-via array (25 balls, 1 mm pitch) on a 0.5 mm grid.
Three common pitfalls with the MPC8347EVRAGDB: (1) Do not omit the 32.768 kHz RTC crystal - the system requires it for POR sequencing and timestamp counters; (2) The DDR reference voltage (2.5 V / 1.8 V) must be sourced from a low-noise LDO (TPS7A4701-class); noisy DDR reference causes intermittent ECC errors that look like software bugs; (3) The SEC 2.0 engine requires its own clock domain - failing to initialize it in U-Boot or Linux BSP leaves the security accelerator accessible but non-functional, which can pass basic bring-up tests and fail in production. Also note: this part is EOL, so secure lifetime-buy stock for in-field service before designing it into new platforms.
Informations de conformité
RoHS compliant per distributor listings; halogen-free status not explicitly documented in web data. AEC-Q100 not applicable - this is an industrial networking SoC, not an automotive-qualified part.
