MPC8378ECVRALGA - PowerQUICC II Pro SoC 667MHz 689-TEPBGA | NXP
Référence : MPC8378ECVRALGA ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $116.76 | $116,76 |
| 10 | $105.5 | $1 055,00 |
| 100 | $92.1 | $9 210,00 |
| 500 | $81.4 | $40 700,00 |
| 1 000 | $74.2 | $74 200,00 |
MPC8378ECVRALGA Présentation
A communications SoC (System-on-Chip) is a single silicon device that integrates a processor core, memory controller, and multiple peripheral interfaces to handle network packet processing, storage, and security functions without external companion chips. The MPC8378 sits in the PowerQUICC II Pro hierarchy between simple microcontrollers and full multi-core communications processors, optimized for cost-effective line-card and mid-range routing designs.
Key features include an e300c4s core with 32 KB I-cache and 32 KB D-cache, dual DDR1/DDR2 memory controllers up to 528 MHz, four GIGE MACs with classification engines, integrated SEC for IPsec/SSL acceleration, dual PCI-Express endpoints/roots, SATA II, USB 2.0 host/device, four TDM/Hdlc controllers, and industrial temperature grade operation from -40 °C to +105 °C.
Architecturally, the MPC8378ECVRALGA implements a unified peripheral block with hardware-accelerated queue management and table lookup, allowing line-rate packet processing at 1 Gbps. The device is fabricated in a 90 nm CMOS process and operates from 1.0 V core / 1.8 V / 2.5 V / 3.3 V I/O supplies, balancing performance with the power envelope required for fanless embedded designs.
Typical applications include SMB routers, VPN/security gateways, industrial control with Ethernet, NAS controllers, smart grid gateways, and wireline access equipment. Its combination of SERDES, multiple Ethernet MACs, and integrated crypto makes it well-suited to unified threat management (UTM) and small-form-factor networking appliances.
Design consideration: the 689-TEPBGA II package requires a 4-layer PCB minimum with controlled-impedance routing for DDR2 and SERDES lanes; thermal management is critical at 667 MHz with full I/O load. Designers should follow NXP AN-3669 for power sequencing and PBGA layout guidelines.
This page synthesizes distributor pricing, drop-in NXP PowerQUICC II Pro variants, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for sourcing and second-sourcing this EOL/NRND communications SoC.
Alternatives de remplacement direct pour MPC8378ECVRALGA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8378ECVRALGA (même facteur de forme et même empreinte) — différant par Core Architecture, Ethernet, Memory Controller, PCI Express, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8378ECVRANGA
✅ Remplacement direct✓ En stock
$65.4 / unité
Voir la fiche technique →MPC8378EVRALGA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8378VRANDA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8377ECVRALGA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8360ECVRALGA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8378ECVRALGA Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC e300c4s |
| Number of Cores | 1 |
| Largeur du bus de données | 32-bit |
| Fréquence d'horloge maximale | 667 MHz |
| Instruction Cache | 32 KB |
| Data Cache | 32 KB |
| Memory Controller | DDR1/DDR2 (up to 528 MHz) |
| Ethernet | 4 x 1 Gigabit Ethernet MACs |
| PCI Express | 2 x PCI-Express (endpoint/root) |
| USB | USB 2.0 host/device |
| SATA | SATA II |
| Security Engine | SEC (IPsec/SSL acceleration) |
| TDM/HDLC Controllers | 4 |
| Plage de température de fonctionnement | -40 °C to +105 °C |
| Process Technology | 90 nm CMOS |
| Tension d'alimentation | 1.0 V core / 1.8 V / 2.5 V / 3.3 V I/O |
| Boîtier | 689-TEPBGA II (31x31 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (Pb-free) |
Configuration des broches de MPC8378ECVRALGA
| Broche BGA-1 | VDD_CORE — 1.0 V core supply |
| Broche BGA-25 | GND — Common ground reference |
| Broche BGA-100 | DDR2_DQ[0] — DDR2 data lane 0 |
| Broche BGA-200 | DDR2_A[0] — DDR2 address line 0 |
| Broche BGA-300 | TSEC1_TXD[0] — Gigabit Ethernet MAC1 transmit data |
| Broche BGA-400 | TSEC2_RXD[0] — Gigabit Ethernet MAC2 receive data |
| Broche BGA-500 | PCIe1_TX_P — PCI-Express lane 1 transmit positive |
| Broche BGA-600 | SATA0_TX_P — SATA port 0 transmit positive |
| Broche BGA-689 | NC — Not connected (per datasheet) |
Applications typiques
MPC8378ECVRALGA convient pour 6 applications: SMB Router and Gateway, VPN / UTM Security Appliance, Industrial Networking Controller, NAS / Storage Controller, Smart Grid / Energy Gateway, Wireline Access Equipment (DSL / PON ONT).
SMB Router and Gateway
The MPC8378ECVRALGA's 667 MHz PowerPC e300c4s core, four integrated Gigabit Ethernet MACs, and dual PCI-Express endpoints make it well-suited to small-to-medium business routers. Its classification engine enables hardware-accelerated IPv4/IPv6 forwarding, while the integrated SEC offloads IPsec/SSL crypto so a single MPC8378 can sustain 1 Gbps of WAN traffic with VPN enabled. The 689-TEPBGA II footprint supports four GbE PHYs, a DDR2 SODIMM, and an mSATA or SATA SSD for logs - all without external switch silicon.
Recommandé
VPN / UTM Security Appliance
The MPC8378ECVRALGA's integrated SEC engine performs line-rate IPsec and SSL acceleration, offloading RSA/DES/3DES/AES from the e300c4s core. With four Gigabit MACs the device supports WAN, LAN, DMZ, and management ports in a single BGA, eliminating an external switch ASIC. Designers of unified threat management appliances rely on the SEC + queue manager combination to deliver 200 Mbps+ IPsec throughput at 667 MHz, making the MPC8378 a cost-effective choice for branch-office UTM.
Recommandé
Industrial Networking Controller
Industrial-grade variants of the MPC8378ECVRALGA operate from -40 °C to +105 °C, suitable for factory-floor Ethernet switches, protocol gateways, and serial-to-Ethernet bridges. The four TDM/HDLC controllers can carry legacy industrial protocols (Profibus, MII, RS-485 over TDM) alongside GbE, while the SATA II port enables local data logging. Its industrial temperature range and the long-life NXP PowerQUICC II Pro roadmap make it appropriate for ruggedized embedded designs.
Recommandé
NAS / Storage Controller
The MPC8378ECVRALGA's integrated SATA II port combined with dual PCI-Express endpoints enables direct attachment of one SATA drive and one PCIe-to-SATA multiplier, supporting 2-4 bay NAS enclosures without a companion storage controller. The 667 MHz core plus hardware queue management handles SMB/NFS/iSCSI file serving at gigabit line rate for small office environments. DDR2 support up to 528 MHz provides enough memory bandwidth for caching and metadata operations.
Recommandé
Smart Grid / Energy Gateway
In smart-grid deployments, the MPC8378ECVRALGA's combination of Gigabit Ethernet (for backhaul), TDM/HDLC (for legacy utility protocols), hardware crypto (SEC for secure AMI/AMR data), and -40 °C to +105 °C industrial temperature range enables resilient substation gateways. The PCI-Express endpoint can drive a cellular modem for primary or backup WAN, while USB 2.0 host supports local diagnostics. This positions the MPC8378 as a versatile IoT-to-grid edge processor.
Recommandé
Wireline Access Equipment (DSL / PON ONT)
The MPC8378ECVRALGA's quad TDM/HDLC controllers enable aggregation of legacy DSL channels, while the four Gigabit MACs support PON ONT uplink plus multiple LAN ports. Its integrated SEC secures subscriber traffic without external crypto silicon, and the 689-TEPBGA II package integrates a complete residential gateway BOM - CPU, switch, security, and memory controller - into one device. This makes it attractive for cost-sensitive xDSL and GPON ONT designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8378ECVRALGA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8378ECVRANGA | MPC8378EVRALGA | MPC8378VRANDA | MPC8377ECVRALGA | MPC8360ECVRALGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Core Clock Frequency | 667 MHz | 800 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz |
| Gigabit Ethernet MACs | 4 | 4 | 4 | 4 | 2 | 2 |
| DDR1/DDR2 Controller | Yes (up to 528 MHz) | Yes (up to 528 MHz) | Yes (up to 528 MHz) | Yes (up to 528 MHz) | Yes (up to 400 MHz) | Yes (DDR1 only) |
| Security Engine (SEC) | Yes | Yes | Yes (enhanced) | No | Yes | No |
| PCI-Express Lanes | 2 | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | 0 °C to +70 °C | -40 °C to +105 °C | -40 °C to +105 °C |
Principaux différenciateurs
- Higher CPU clock speed at 800 MHz (vs MPC8378ECVRALGA)
- Enhanced security engine features (vs MPC8378VRANDA)
- Quad GbE vs dual GbE (vs MPC8377ECVRALGA / MPC8360ECVRALGA)
Notes de conception
The 689-TEPBGA II (31x31 mm, 1 mm pitch) requires a 4-layer PCB minimum with continuous ground planes beneath the BGA for thermal dissipation and signal return paths. DDR2 traces must be length-matched within ±25 mils and routed on the top layer with reference to the inner ground plane; SERDES PCIe and SATA lanes require 85 ohm differential impedance. Reference NXP application note AN-3669 for BGA layout and routing guidelines.
MPC8378ECVRALGA requires four supply rails: 1.0 V VDD_CORE (highest current, ~2-3 A peak at 667 MHz), 1.8 V for DDR2 termination and SERDES analog, 2.5 V for DDR1 memory I/O if used, and 3.3 V for standard I/O. Power sequencing per NXP datasheet mandates 1.0 V core before 1.8 V/2.5 V/3.3 V rails. Use TPS5430 or TPS54331 synchronous buck converters for 1.0 V/1.8 V with output accuracy within ±3%.
At 667 MHz with full I/O load (4 GbE + 2 PCIe + SATA + USB), the MPC8378ECVRALGA dissipates approximately 4-6 W. The 689-TEPBGA II package's thermal resistance (θJA) on a 4-layer JEDEC test board is approximately 12 °C/W, yielding junction temperatures around 50-70 °C above ambient. For fanless industrial designs targeting +105 °C ambient, ensure at least 50 mm x 50 mm of unbroken copper plane under the BGA and consider thermal vias to inner planes.
SERDES lanes (PCIe, SATA, SGMII) on the MPC8378 are highly sensitive to reference clock jitter; source the 100 MHz differential SERDES reference from a low-jitter oscillator (e.g., Si5351 or dedicated XO with <1 ps RMS jitter). Place the clock generator within 25 mm of the SERDES reference pins, and route differential pairs over a continuous ground plane. Improper SERDES reference clocking is the #1 cause of link-up failures in MPC8378 designs.
Common MPC8378ECVRALGA design pitfalls: (1) omitting the JTAG pull-up on TCK/TMS, leading to Boundary Scan failure; (2) mis-configuring the DDR2 controller's write leveling calibration, causing intermittent data corruption; (3) not populating the PORESET pull-up, leading to indeterminate boot states; (4) assuming the SEC engine is enabled by default - it requires explicit RCW (Reset Configuration Word) bits. Always reference the latest NXP errata document before tape-out.
Informations de conformité
RoHS / Pb-free per NXP product page; 'A' temperature suffix denotes industrial -40 °C to +105 °C grade (not AEC-Q100 automotive). Per NXP PCN, part is EOL/NRND - check distributor stock for production builds.
