MPC8536AVTATHA - PowerQUICC III 1.25GHz SoC MPU | NXP
Référence : MPC8536AVTATHA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $185.5 | $185,50 |
| 10 | $172.4 | $1 724,00 |
| 100 | $159.95 | $15 995,00 |
| 500 | $148 | $74 000,00 |
| 1 000 | $138.5 | $138 500,00 |
MPC8536AVTATHA Présentation
A PowerQUICC III microprocessor is a Power Architecture SoC that integrates a PowerPC e500 core with system controllers, communication peripherals, and security engines, occupying a tier above standalone MPU cores in the broader embedded processor hierarchy (PowerPC e500 MPU -> PowerQUICC III SoC -> embedded processor -> communications SoC). The MPC8536 specifically belongs to NXP's mid-range PowerQUICC III line, balancing raw GHz-class compute with rich connectivity for routers, switches, networked printers, industrial controls, and secure network appliances.
Key differentiating features include a 32-bit Power Architecture e500 core with dual-issue superscalar execution, hardware-accelerated encryption (SEC 3.0 engine, on the 'E' variant - this 'non-E' part has the engine disabled/bypassed), and integrated gigabit Ethernet MACs with QoS support. The MPC8536AVTATHA variant supports operating temperatures of 0 to 90 °C (commercial grade), distinguishing it from -40 to 125 °C industrial-grade siblings. On-chip flexibility includes up to four GbE ports, dual SATA controllers, USB 2.0, and PCIe x4 / PCI 2.3 interfaces, simplifying BOM count for storage and networking subsystems.
The architecture pairs the e500 core with a 256-bit internal data path to L2 cache and dedicated fabric paths to per-controller logic, allowing simultaneous wire-rate Ethernet and storage I/O without CPU stall. NXP's PowerQUICC III platform shares the same 783-ball FC-PBGA footprint across speed bins (e.g. MPC8536BVJATHA at 800 MHz, MPC8536AVTANGA at 1.0 GHz), enabling one PCB design to support multiple SKUs.
Typical applications include SMB/SME routers, managed industrial Ethernet switches, networked storage controllers, secure edge gateways, and protocol-conversion appliances. The wide I/O compatibility reduces level-shifters in mixed-voltage designs, ideal where DDR2/DDR3 memories coexist with 3.3 V legacy peripherals.
When designing in, ensure proper FC-PBGA PCB layout with matched-impedance SERDES traces and thermal vias to the 783-ball land pad for sustained 1.25 GHz operation. Use NXP-supplied DDR2/3 reference schematics to validate write-leveling and gate-training timing across temperature.
This page synthesizes current distributor pricing, same-package drop-in alternatives, and practical design notes for the MPC8536AVTATHA that go beyond the datasheet.
Alternatives de remplacement direct pour MPC8536AVTATHA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8536AVTATHA (même facteur de forme et même empreinte) — différant par Core Architecture, Operating Temperature, Ethernet, Memory Controller, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8536AVTANGA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8536AVJATHA
✅ Remplacement direct✓ En stock
$61 / unité
Voir la fiche technique →MPC8536BVJATHA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8536BVTATHA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8536BVTAKGA
✅ Remplacement direct✓ En stock
$125 / unité
Voir la fiche technique →MPC8536AVTATHA Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC e500 (Power Architecture 32-bit) |
| Number of Cores | 1 |
| Maximum Core Frequency | 1.25 GHz |
| Core Voltage | 1.5 V |
| I/O Voltages | 1.8 V / 2.5 V / 3.3 V |
| Boîtier | 783-ball FC-PBGA (29 mm x 29 mm) |
| Memory Controller | DDR2 / DDR3 (with ECC) |
| PCI / PCIe | PCI 2.3 + PCIe x4 |
| Ethernet | Up to 4x Gigabit Ethernet (SGMII / RGMII) |
| Storage | 2x SATA, SDHC |
| USB | USB 2.0 |
| Température de fonctionnement | 0 °C to +90 °C |
| Series | PowerQUICC III (MPC8536 'Non-E') |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Guide de configuration des broches du MPC8536AVTATHA 783-ball fc-pbga (29 mm x 29 mm)
Configuration des broches du MPC8536AVTATHA (boîtier 783-ball fc-pbga (29 mm x 29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8536AVTATHA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8536AVTATHA convient pour 6 applications: SMB/SME Branch Router and Firewall Appliance, Industrial Managed Ethernet Switch Control Plane, Networked Storage Controller (NAS / iSCSI Initiator), Secure Edge Gateway / Industrial IoT Gateway, Wireless Router / Access-Point Aggregator, Intelligent Medical Imaging Data Aggregator.
SMB/SME Branch Router and Firewall Appliance
The MPC8536AVTATHA is well matched to entry-level branch routers and firewall appliances that must sustain 1 Gbps-class throughput across multiple WAN/LAN ports. Its 1.25 GHz e500 core provides headroom for software-defined routing, OpenFlow datapath, and lightweight IPSec tunnels, while the four integrated GbE MACs deliver up to 4 gigabit ports out of the box, eliminating external MAC bridges. With PCI/PCIe x4 available for crypto accelerators or storage controllers, this SoC lets designers reduce both silicon BOM and PCB layers versus discrete CPU-plus-switch designs.
Recommandé
Industrial Managed Ethernet Switch Control Plane
In a managed industrial Ethernet switch, the MPC8536AVTATHA acts as the management CPU and L3 control-plane handler, freeing a wire-rate switch ASIC to do fast-path forwarding. The e500 core is fast enough to run SNMP, STP/RSTP, IGMP snooping, and web interfaces concurrently, while the integrated SATA enables an onboard log/event-storage disk for industrial auditing. The 0 to 90 °C operating window suits indoor cabinets and outdoor NEMA enclosures when paired with an industrial-grade sibling SKU.
Recommandé
Networked Storage Controller (NAS / iSCSI Initiator)
The MPC8536AVTATHA's dual SATA controllers and PCIe x4 make it a natural fit for entry-level NAS controllers and iSCSI initators where the CPU runs software RAID (e.g., mdadm, ZFS-on-Linux) and serves SMB/CIFS or iSCSI targets. The integrated DDR2/3 controller with ECC handles read-modify-write loads while keeping memory soft-error rates low in continuous-operation datacenters. With GbE plus PCI/PCIe for additional NIC ports, designers can build 2-to-4 bay NAS chassis without a dedicated NIC chip.
Recommandé
Secure Edge Gateway / Industrial IoT Gateway
In secure edge gateways for OT (operational technology) networks, the MPC8536AVTATHA serves dual roles: protocol translation (Modbus/TCP, PROFINET, EtherNet/IP) and outbound TLS-secured cloud uplinks. Although this non-E variant lacks the SEC 3.0 hardware acceleration, software AES via OpenSSL on the 1.25 GHz core still sustains typical MQTT-SN or HTTPS telemetry streams in the low-Mbps range; for higher cryptographic load, the N-variant is the recommended upgrade. The broad peripheral set lets designers place multiple industrial buses, USB radios, and GbE uplinks on one SoC.
Recommandé
Wireless Router / Access-Point Aggregator
MPC8536AVTATHA's USB 2.0 + PCIe combination enables pairing with 802.11ax Wi-Fi cards or 5G/LTE modems in a small-form-factor router platform. The DDR3 controller feeds high-bandwidth traffic cleanly to the Wi-Fi / cellular host queues, while the GbE MACs handle the wired back-haul. With the e500 core's modest thermal envelope, router designs can remain fan-less at 1.25 GHz - keeping acoustic noise low in office and home deployments.
Recommandé
Intelligent Medical Imaging Data Aggregator
For low-bandwidth medical imaging gateways (DICOM-bridge, PACS-edge aggregator, ultrasound connectivity hub), the MPC8536AVTATHA offers a low-cost route to GbE-attached storage and serial peripheral integration. The e500 runs a deterministic RTOS or Linux with medical-grade frame buffers, while USB 2.0 accommodates tethered acquisition probes. Designers should validate IEC 60601 EMI margins with the chosen FCC/CE-compatible chassis; the part itself operates 0 to 90 °C, but the enclosure solution determines overall medical-grade compliance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8536AVTATHA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8536AVTANGA | MPC8536AVJATHA | MPC8536BVJATHA | MPC8536BVTATHA | MPC8536BVTAKGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-ball FC-PBGA | 783-ball FC-PBGA (same) | 783-ball FC-PBGA (same) | 783-ball FC-PBGA (same) | 783-ball FC-PBGA (same) | 783-ball FC-PBGA (same) |
| Memory Controller | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 |
| Gigabit Ethernet Ports | Up to 4 | Up to 4 | Up to 4 | Up to 4 | Up to 4 | Up to 4 |
| SATA Controllers | 2 | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | 0 °C to +90 °C | 0 °C to +90 °C (commercial) | 0 °C to +90 °C (commercial) | 0 °C to +90 °C (commercial) | 0 °C to +90 °C (commercial) | -40 °C to +85 °C (extended industrial) |
Principaux différenciateurs
- 1.25 GHz top speed bin in a 783-ball FCBGA shared across the family (vs MPC8536AVJATHA)
- Drop-in compatible footprint, enabling design-time frequency scaling (vs MPC8536BVJATHA)
- Same-die hardware-crypto variant available pin-compatible (vs MPC8536AVTANGA)
Notes de conception
At 1.25 GHz core speed the MPC8536AVTATHA FC-PBGA exhibits noticeable self-heating under load; thermal vias under the 783-ball land pad and a 4-layer PCB with 2 oz copper inner-planes are strongly recommended. Estimate per NXP datasheet: a properly-designed FR4 board with thermal vias brings θJA below 10 °C/W, giving a steady-state junction rise of roughly 12.5 °C at full CPU load in a still-air enclosure - well within the 0 to 90 °C operating range.
Use impedance-controlled PCB stack-up for SERDES lanes (PCIe, SGMII, SATA) and the DDR2/3 address/data signals per NXP's PowerQUICC III design guidelines. Each DDR byte lane needs 100 Ω differential routing; SERDES needs 85 Ω differential. Place an isolated ground ring around the BGA and stitch with a 50-mil ground via fence at the board edge to mitigate EMI in the 2.5 GHz SERDES fundamentals.
The 783-ball FCBGA must be on the top surface only; avoid placing via-in-pad pads because the package is intended for direct land connections and BGA solder-joint reliability. Select 'AVTATHA' (this part) versus 'AVTANGA' based on whether the SEC 3.0 engine is required - mixing them in production lines is the most common source of debugging time when cryptodev kernel modules fail to initialise on a board that is supposed to use software fallback.
DDR3 write-leveling and gate-training margins are sensitive to round-trip delay on the bidirectional address/command bus; ensure matched trace lengths within ±25 mil for byte lanes. Use NXP's validated U-Boot tuning scripts to measure window margins during boot and log them for production quality control - field returns are most often traced to marginal DDR3 timing on a board that boots fine at room temperature but fails in cold racks.
Informations de conformité
RoHS and lead-free per NXP product environmental compliance documentation. AEC-Q100 not applicable (not an automotive-grade part). Industrial-temperature SKUs available in the same package for non-automotive harsh environments.