MPC8543ECPXAQGB - PowerQUICC III 1GHz e500 MPU, 783-FCBGA
Référence : MPC8543ECPXAQGB ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2 565,00 |
| 100 | $228 | $22 800,00 |
| 250 | $199.5 | $49 875,00 |
| 500 | $178.75 | $89 375,00 |
MPC8543ECPXAQGB Présentation
A microprocessor (MPU) is a single-chip CPU that integrates core, cache, memory controller, and peripheral interfaces, and the MPC8543E belongs to the PowerQUICC III family of communications processors aimed at networking, telecom, and embedded-control infrastructure. PowerQUICC III devices traditionally combine a PowerPC-class core with high-bandwidth system interfaces (PCI/PCI-X, local bus, Gigabit Ethernet, DDR memory) for routers, switches, line cards, and similar networking equipment. Within the broader taxonomy, MPC85xx devices sit between general-purpose embedded CPUs (e.g., PowerQUICC II) and dedicated communications ASICs.
Key features include a 1.0 GHz e500 core with MMU and double-precision FPU, integrated DDR/DDR2 memory controller, three 10/100/1000 Mbps enhanced TSEC Ethernet controllers, dual PCI/PCI-X interfaces, and a 32-bit local bus. The device supports hardware cryptography acceleration for DES, 3DES, AES, and public-key algorithms, plus the RapidIO technology used for chip-to-chip interconnect in chassis-based systems. Power management is handled via the 1.8V / 2.5V / 3.3V supply domains documented in the datasheet.
The e500 core implements the Book-E Power Architecture instruction set, including signal-processing extensions and a memory management unit suited to deeply embedded Linux, VxWorks, or proprietary RTOS environments. The integrated DDR/DDR2 controller with write-buffer reduces external chip count, while the TSEC blocks support jumbo frames, TCP/IP acceleration offload, and quality-of-service queues for carrier-grade Ethernet.
Typical applications include enterprise routers and switches, telecom line cards, industrial control planes, network-attached storage controllers, and secure VPN gateways. The on-chip crypto engine makes the part well suited to IPsec/SSL accelerator designs where AES and public-key math are needed at line rate.
When designing with this device, allocate generous PCB area for the 29x29 mm FCBGA, route DDR signals with matched impedance and length matching, and provide a multi-layer power distribution network for the 1.8V/2.5V/3.3V rails. Designers should reference the NXP MPC8548E hardware specifications document for recommended decoupling, thermal management, and JTAG/COP debug access.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MPC8543ECPXAQGB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesMPC8543ECPXAQGB Valeurs maximales et caractéristiques électriques
| Series | PowerQUICC III |
| Core Processor | PowerPC e500 |
| Core Architecture | 32-bit Power Architecture Book-E |
| Core Count | 1 |
| Maximum Core Frequency | 1.0 GHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 256 KB backside |
| Ethernet Controllers | 3 x TSEC (10/100/1000 Mbps) |
| PCI Interfaces | 2 x PCI / PCI-X |
| Memory Controller | DDR / DDR2 SDRAM |
| Local Bus | 32-bit |
| Tension d'alimentation | 1.8 V / 2.5 V / 3.3 V |
| Température de fonctionnement | -40C to +105C (industrial) |
| Boîtier | 783-FCBGA (29 x 29 mm) |
| Type de montage | Surface Mount |
| Process Technology | 0.09 um CMOS |
| Niveau MSL | 3 |
| Lead Free / RoHS | Compliant |
Guide de configuration des broches du MPC8543ECPXAQGB 783-fcbga (29 x 29 mm)
Configuration des broches du MPC8543ECPXAQGB (boîtier 783-fcbga (29 x 29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8543ECPXAQGB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8543ECPXAQGB convient pour 6 applications: Enterprise Routers and Switches, Telecom Line Cards, Network-Attached Storage Controllers, Industrial Control and Automation, Secure VPN Gateways, Embedded Computing and Test Instrumentation.
Enterprise Routers and Switches
The MPC8543ECPXAQGB fits enterprise routers and managed L2/L3 switches because it integrates three 10/100/1000 TSEC Ethernet MACs and a DDR/DDR2 controller for high-throughput packet processing. At 1 GHz the e500 core offers ample headroom for routing-table lookup, ACL filtering, and QoS queue management. Designers route the three TSEC MACs to RJ-45 or SGMII PHYs, while PCI/PCI-X slots accept add-on crypto or RAID cards. Compared with a discrete CPU + ASIC design, the MPC8543E reduces BOM cost and PCB area while keeping firmware compatible with PowerPC Linux/VxWorks toolchains.
Recommandé
Telecom Line Cards
The MPC8543ECPXAQGB is widely used in carrier-grade telecom line cards where the integrated DES/3DES/AES hardware crypto engine accelerates IPsec, SSL, and MACsec at line rate. Its three TSEC ports handle multiple GbE uplinks while PCI-X connects to framer or DSP coprocessors. The device operates from -40C to +105C, suitable for NEBS-compliant chassis. The 1 GHz e500 core executes control-plane stacks (e.g., vxWorks or eCos) while DMA channels keep the data plane fed. RapidIO links multiple MPC8543E line cards within a chassis backplane.
Recommandé
Network-Attached Storage Controllers
In NAS and SAN controller designs the MPC8543ECPXAQGB provides the central intelligence with three TSEC GbE ports for iSCSI or NFS traffic, plus PCI-X for SAS/SATA controller chips. The 256 KB L2 backside cache accelerates filesystem metadata operations while DDR2 memory delivers the bandwidth needed for streaming reads/writes. Hardware AES acceleration secures SMB3 or iSCSI CHAP authentication. A 32-bit local bus connects legacy NOR boot flash and LED status indicators; designers can implement RAID-1 or RAID-5 entirely in the e500 core for small form-factor appliances.
Recommandé
Industrial Control and Automation
Industrial control planes leverage the MPC8543ECPXAQGB for its extended -40C to +105C operation, deterministic interrupt latency, and triple Ethernet ports for redundant ring topologies. The e500 core runs real-time Linux or RTOS for PLC, SCADA, or motion-control hosts, while the 32-bit local bus connects FPGA coprocessors or legacy I/O cards. Hardware cryptography secures fieldbus communications. Compared with ARM Cortex-A SoCs, the PowerPC e500 delivers superior deterministic performance for hard real-time control loops.
Recommandé
Secure VPN Gateways
Secure VPN and SSL gateway appliances rely on the MPC8543ECPXAQGB's integrated AES-128/192/256, DES/3DES, and public-key crypto engines to sustain multi-gigabit IPsec tunnels. The three TSEC ports allow dedicated WAN, LAN, and DMZ segments with hardware-accelerated encryption offloaded from the e500 core. DDR2 memory holds large routing tables and IPsec SAD entries; PCI-X connects to hardware security modules or accelerator cards. Operating from 1.8V/2.5V/3.3V rails with industrial temperature screening, the part supports 24/7 carrier-grade VPN deployments.
Recommandé
Embedded Computing and Test Instrumentation
Engineers build custom VME/cPCI embedded computing platforms around the MPC8543ECPXAQGB for test instrumentation and signal-intelligence systems. The integrated PCI-X interface plugs into backplanes, while the three TSEC Ethernet ports enable multi-channel data acquisition uplink. The e500 core executes DSP-style signal-processing code using the Book-E signal-processing extensions and AltiVec-compatible instructions. DDR2 memory provides high-bandwidth sample buffers, and the 32-bit local bus connects legacy peripheral boards. Compared with general-purpose ARM SBCs, the MPC85xx delivers deterministic real-time performance and long-term NXP support.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8543ECPXAQGB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8543ECPXAQGD | MPC8543EVJAQGB | MPC8548PXAQGB | MPC8548EPXAQGB | MPC8543ECVJAQGD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Core Architecture | PowerPC e500 32-bit | PowerPC e500 32-bit | PowerPC e500 32-bit | PowerPC e500 32-bit | PowerPC e500 32-bit (enhanced crypto) | PowerPC e500 32-bit |
| Core Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.2-1.5 GHz | 1.2-1.5 GHz | 1.0 GHz |
| L2 Cache | 256 KB backside | 256 KB | 256 KB | 256-512 KB | 256-512 KB | 256 KB |
| TSEC Ethernet Ports | 3 | 3 | 3 | 3-4 | 3-4 | 3 |
| Memory Controller | DDR / DDR2 | DDR / DDR2 | DDR / DDR2 | DDR / DDR2 | DDR / DDR2 | DDR / DDR2 |
| Operating Temperature | -40C to +105C (extended industrial) | 0C to +105C (commercial) | -40C to +125C (extended) | -40C to +105C | -40C to +105C | -40C to +105C |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- Integrated triple Gigabit Ethernet with hardware crypto (vs MPC8535CVJAQGA)
- Mid-tier 1 GHz performance in the MPC85xx family (vs MPC8548PXAQGB)
- PowerQUICC III longevity with established firmware ecosystem (vs Generic ARM Cortex-A MPU)
Notes de conception
The 783-FCBGA at 0.8 mm ball pitch requires a 6-layer PCB minimum with 50 ohm controlled-impedance traces for DDR, TSEC, and PCI-X signals. Per NXP hardware specs, allocate a continuous ground plane under the BGA and route DDR signals with length matching to within 25 mils to maintain signal integrity. Use microvia-in-pad or via-on-pad technology if cost permits.
Estimated: at 1.0 GHz with full TSEC and PCI-X activity the MPC8543ECPXAQGB dissipates approximately 6-8 W. The 783-FCBGA exposes a thermal pad; design the PCB with at least 25 thermal vias under the die to spread heat to internal copper planes. For chassis-based telecom line cards, attach a heat spreader for NEBS thermal compliance.
The MPC8543ECPXAQGB requires three supply rails - 1.8V, 2.5V, and 3.3V - with specific power-up sequencing per the datasheet. Use NXP-recommended PMIC or discrete switching regulators with power-good signals tied to HRESET. Place 10 uF bulk plus 0.1 uF decoupling within 5 mm of each BGA supply ball group to minimize switching noise injection into the e500 core.
Do not assume all 783-FCBGA PowerQUICC III parts share the same ball map - pin compatibility varies between MPC8533/MPC8535/MPC8543/MPC8548. Per NXP product family documentation, always cross-check BSDL and IBIS models before substituting any variant. Misaligned ballouts cause DDR short-circuits or TSEC failures on first prototype spin.
DDR trace routing should keep the DDR clock, address, and command group length-matched within 50 mils; data byte lanes should match within 25 mils. TSEC GMII/MII/RGMII signals need source-series termination near the MPC8543E balls. PCI-X requires 50 ohm impedance with stubs kept under 250 mils to avoid reflections at 133 MHz.
Informations de conformité
RoHS and lead-free compliant per NXP product line documentation. AEC-Q100 not applicable - this is an industrial/telecom MPU, not an automotive-grade IC. Halogen-free status unknown from provided data.
