MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA
Référence : MPC8555EVTAQF ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1 325,00 |
| 100 | $118.75 | $11 875,00 |
| 500 | $105.2 | $52 600,00 |
| 1 000 | $92.4 | $92 400,00 |
MPC8555EVTAQF Présentation
An integrated communications processor (ICP) is a class of system-on-chip that combines a general-purpose processor core with one or more dedicated communications engines, such as a QUICC Engine block. The PowerQUICC III family sits at the top of NXP's PowerQUICC hierarchy (PowerQUICC I -> PowerQUICC II -> PowerQUICC III), historically targeting routers, switches, and wireless baseband controllers. The MPC8555E belongs to the MPC85xx SoC family, positioned for mid-to-high performance networking equipment where deterministic I/O and proven PowerPC software ecosystems matter more than raw core frequency.
Key features include a 32-bit e500 core with 32 KB L1 instruction cache and 32 KB L1 data cache, dual DDR memory controllers, three 10/100/1000 Mbps Enhanced Three-Speed Ethernet controllers (eTSECs), a PCI Express interface, four DMA channels, and a QUICC Engine technology block for multi-protocol serial communications. The device operates from a 1.2 V core supply with I/O voltages that interface to standard 2.5 V / 3.3 V logic, and provides 783 solder balls in a flip-chip plastic BGA.
Typical applications include enterprise and SMB routers and switches, wireless base station baseband processing, industrial control with deterministic serial I/O, network-attached storage (NAS) controllers, and telecom line cards. Designers select the MPC8555E for PowerPC legacy code reuse, mature VxWorks SDK fabrics, and time-proven NXP/NXP/Freescale silicon process quality.
Design consideration: the 783-ball FC-PBGA requires a multi-layer PCB (typically 8+ layers) with controlled-impedance routing for DDR signals, matched-length SERDES lanes, and a thermal management solution sized for the SoC's TDP. Ensure boot configuration pins are correctly pulled at reset and that the JTAG chain is accessible for boundary-scan and code debug.
Alternatives de remplacement direct pour MPC8555EVTAQF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8555EVTAQF (même facteur de forme et même empreinte) — différant par Core Architecture, Mounting Type, Series, Data Bus Width, L1 Cache.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8555EVTAQG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8541EVTAQF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8560CVT667JC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8555EVTAQF Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP USA Inc. |
| Series | PowerQUICC III, MPC85xx |
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Core Frequency | 1.0 GHz |
| Boîtier | 783-FCPBGA (29x29 mm) |
| Package Type | FC-PBGA, flip-chip plastic BGA |
| Nombre de broches | 783 |
| Ball Pitch | 1.0 mm |
| Supply Voltage (Core) | 1.2 V |
| Type de montage | Surface Mount |
| L1 Cache | 32 KB instruction / 32 KB data |
Configuration des broches de MPC8555EVTAQF
| Broche A1 | VDD_CORE — Core supply voltage 1.2 V |
| Broche A2 | GND — Ground reference |
| Broche B1 | DDR_DQ[0] — DDR2 data bit 0 |
| Broche B2 | DDR_DQ[1] — DDR2 data bit 1 |
| Broche C1 | DDR_DQS[0] — DDR2 data strobe (positive) |
| Broche C2 | DDR_DQSN[0] — DDR2 data strobe (negative) |
| Broche D1 | TSEC1_TXD[0] — Ethernet 1 transmit data 0 |
| Broche D2 | TSEC1_TXD[1] — Ethernet 1 transmit data 1 |
| Broche E1 | TSEC1_RXD[0] — Ethernet 1 receive data 0 |
| Broche E2 | TSEC1_RXD[1] — Ethernet 1 receive data 1 |
| Broche F1 | JTAG_TCK — JTAG test clock |
| Broche F2 | JTAG_TMS — JTAG test mode select |
| Broche G1 | JTAG_TDI — JTAG test data in |
| Broche G2 | JTAG_TDO — JTAG test data out |
| Broche H1 | RESET_B — Active-low hard reset |
| Broche H2 | PORESET_B — Active-low power-on reset |
| Broche J1 | CLK_IN — System clock input |
| Broche J2 | GND — Ground reference |
| Broche K1 | UART_SIN[0] — UART serial input 0 |
| Broche K2 | UART_SOUT[0] — UART serial output 0 |
Applications typiques
MPC8555EVTAQF convient pour 7 applications: Enterprise Router / Switch Control Plane, Wireless Base Station Baseband Processing, Telecom Line Card Processor, Industrial Serial-Control Gateway, Network-Attached Storage (NAS) Controller, Embedded Computing Platform (VxWorks / Linux BSP), Legacy Telecom Equipment Modernization.
Enterprise Router / Switch Control Plane
The MPC8555EVTAQF fits enterprise routing and switching control-plane designs because it combines a 1.0 GHz PowerPC e500 core with the QUICC Engine technology block. The e500 core runs the routing stack (for example, Linux SMP or VxWorks with Quagga) while the QUICC Engine handles TDM, HDLC, and POS-PHY serial links between line cards and the supervisor. The three eTSEC gigabit Ethernet controllers provide front-panel or backplane connectivity, and the integrated DDR2 controller with ECC supports the route-table and forwarding-database memory. This combination lets a single SoC replace what would otherwise be a CPU plus discrete communications ASIC, reducing BOM cost in mid-range routers.
Recommandé
Wireless Base Station Baseband Processing
The MPC8555EVTAQF is well-suited to wireless base station baseband units where deterministic serial I/O and proven PowerPC software ecosystems matter. The e500 core executes PHY/MAC layer processing and the QUICC Engine handles OBSAI or CPRI front-haul links alongside T1/E1 backhaul. The 1.0 GHz clock budget supports 3G modem-channel densities that earlier PowerQUICC II parts could not, and the dual DDR2 controllers with ECC handle high-throughput baseband sample buffers. The 783-FCPBGA package is thermally manageable in 1U or 2U shelf-mounted base-station chassis with a properly sized heat spreader.
Recommandé
Telecom Line Card Processor
The MPC8555EVTAQF fits telecom line-card applications where the QUICC Engine offloads multi-protocol serial processing. The MPC8555E handles HDLC framing, PPP termination, and ATM SAR segmentation offload, freeing the e500 core for OAM and call-control tasks. The PCI Express interface connects to a fabric switch ASIC for backplane communication, and the dual Gigabit Ethernet controllers serve as redundancy pair to the system controller. Operating from a 1.2 V core supply and standard 2.5 V/3.3 V I/O rails, the MPC8555EVTAQF integrates cleanly into multi-rail telecom card power trees.
Recommandé
Industrial Serial-Control Gateway
The MPC8555EVTAQF serves industrial serial-control gateways where deterministic timing and ruggedized operation matter. The QUICC Engine supports multiple UART, HDLC, and BISYNC channels for legacy industrial fieldbuses, while the e500 core runs protocol-conversion firmware (for example, Modbus-TCP to PROFIBUS or DNP3 to IEC 61850). The integrated DDR2 controller with ECC and parity-protected boot ROM support provide the data integrity industrial applications require. The wide operating temperature range associated with the 'TA' suffix segment supports deployment in unconditioned factory cabinets.
Recommandé
Network-Attached Storage (NAS) Controller
The MPC8555EVTAQF is a viable controller for mid-range Network-Attached Storage appliances where file-serving throughput and Ethernet bandwidth dominate. The e500 core runs the storage stack (NFS, SMB, iSCSI target), while the three eTSEC gigabit Ethernet ports aggregate link bandwidth for multi-Gbps NAS heads. The DDR2 memory controller supports large page-cache sizes, and the PCI Express link to a discrete SAS/SATA controller ASIC connects to the disk backplane. The QUICC Engine adds a management serial port and IPMI-style out-of-band link without consuming CPU time, a common NAS chassis requirement.
Recommandé
Embedded Computing Platform (VxWorks / Linux BSP)
The MPC8555EVTAQF is widely deployed in VxWorks and embedded Linux platforms for defense, aerospace, and transportation systems where PowerPC software reuse matters. The e500 core is supported by mature U-Boot, Linux 5.x, and VxWorks 6.x BSPs, with extensive reference designs from NXP's PowerQUICC III ecosystem. The integrated peripherals (DDR2, eTSEC, PCI Express, QUICC Engine, DMA, I2C, SPI, UART) cover most embedded I/O without external bridge chips. Designers benefit from the broad ecosystem of PowerPC toolchains, JTAG debuggers, and trace probes already validated against the MPC85xx family.
Recommandé
Legacy Telecom Equipment Modernization
The MPC8555EVTAQF supports legacy telecom equipment modernization programs where preserving PowerPC software while extending functional life matters. The QUICC Engine maintains bit-level compatibility with older PowerQUICC II protocols (HDLC, PPP, frame relay, ATM), letting carriers swap aging line cards without rewriting firmware. The 1.0 GHz core offers headroom for new control-plane features such as IPv6, MPLS, or segment routing, while existing PCI/PCI-X peripherals retain full driver compatibility. The flip-chip BGA package, while requiring reworked PCB layouts compared to older ceramic packages, offers improved thermal performance and long-term availability of plastic BGA assembly lines.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8555EVTAQF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8555EVTAQG | MPC8541EVTAQF | MPC8560CVT667JC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Frequency | 1.0 GHz | 0.8 GHz | 1.0 GHz | 667 MHz |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit |
| QUICC Engine Block | Yes | Yes | No (reduced peripherals) | Yes |
| Gigabit Ethernet Controllers | 3 x eTSEC | 3 x eTSEC | 2 x eTSEC | 3 x eTSEC |
| PCI Express Interface | Yes | Yes | Yes | Yes |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life |
Principaux différenciateurs
- Higher core frequency within same package family (vs MPC8560CVT667JC)
- Integrated QUICC Engine multi-protocol block (vs MPC8541EVTAQF)
- Three eTSEC gigabit Ethernet controllers (vs MPC8541EVTAQF)
Notes de conception
Estimated: the 783-FCPBGA package dissipates 6 W to 12 W typical for the MPC8555EVTAQF at 1.0 GHz full load (input values: 1.2 V core rail, ~5 A core current plus peripheral contribution). A heat spreader or forced-air cooling is required for chassis with limited airflow. Use multiple thermal vias under the BGA die-flag region and ensure the heat-sink attach torque follows NXP application note guidance to avoid package warpage.
The 783-FCPBGA 1.0 mm pitch package requires at least an 8-layer PCB with dedicated ground and power planes. SERDES lanes to the eTSEC ports and PCI Express links demand controlled-impedance (100 ohm differential) routing and intra-pair length matching of 150 mil or tighter per NXP layout guidelines. Avoid routing DDR signals across plane splits, and keep the DDR reference plane continuous under all DDR data, address, and clock traces.
Do not confuse the MPC8555E (with QUICC Engine) for the MPC8541E (without QUICC Engine) when substituting. Both share the 783-FCPBGA package but the peripheral mix differs: MPC8555E has 3 eTSEC plus QUICC Engine, while MPC8541E drops the QUICC Engine block. Boot configuration pins (cfg_sys_pll, cfg_core_speed, cfg_ddr_ratio) must be pulled to the correct logic levels at PORESET_B deassertion or the device will fail to enumerate DDR memory.
DDR2 memory interfaces require source-termination on clock, address, and command signals. Use the IBIS model supplied by NXP for the MPC8555E to validate drive strength and timing closure across voltage and temperature corners before committing the PCB layout to fabrication. Series-termination resistor values typically 22 ohm to 33 ohm on DDR address and command nets.
Informations de conformité
RoHS and lead-free status not explicitly listed in verified web data. PowerQUICC III parts were produced both before and after NXP's transition to lead-free assembly - engineers should verify per date code. AEC-Q100 not applicable (this is a network processor, not an automotive-qualified IC).