MPC855TCVR50D4 - 50MHz PowerQUICC MPU 357-BGA | NXP
Référence : MPC855TCVR50D4 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $88.05 | $88,05 |
| 10 | $79.24 | $792,40 |
| 100 | $70.44 | $7 044,00 |
| 500 | $61.63 | $30 815,00 |
| 1 000 | $52.83 | $52 830,00 |
MPC855TCVR50D4 Présentation
A PowerQUICC processor is a highly integrated system-on-chip that combines a general-purpose microprocessor with specialized communication hardware, typically used in networking equipment where multiple serial protocols must be handled without burdening the main CPU. The MPC855T extends the MPC8xx family by integrating Ethernet support directly into the CPM, eliminating the need for an external Ethernet MAC in many designs while preserving the multi-protocol serial capabilities of the original MPC860 architecture.
Key features include a 32-bit PowerPC core running at 50 MHz, dual Fast Ethernet controllers via the CPM, multiple serial communication controllers (SCCs), serial management controllers (SMCs), a system integration unit with memory controller, and on-chip peripherals including timers, DMA, and interrupt controllers. The 357-PBGA package provides ample I/O for the external memory bus and peripheral interfaces while maintaining compatibility with existing MPC860 PowerQUICC PCB layouts.
Typical applications include low-cost remote access equipment, DSLAM line cards, integrated access devices, router and switch control planes, and industrial networking controllers. The combination of integrated Ethernet and PowerPC processing makes the MPC855T well suited for embedded networking designs where deterministic communication handling is required.
When designing with this device, ensure proper thermal management through adequate PCB copper area and consider using the same MMU2 board layout patterns as MPC860 for design reuse. The MPC855T is also available at 66 and 80 MHz speed grades for higher throughput requirements within the same BGA footprint.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Detailed specifications, lifecycle information, and application examples are provided to support component selection and qualification decisions for both new designs and legacy system maintenance.
Alternatives de remplacement direct pour MPC855TCVR50D4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC855TCVR50D4 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Mounting Type, Communication Processor Module.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC855TVR50D4
✅ Remplacement direct✓ En stock
$48.1 / unité
Voir la fiche technique →MPC860TZQ50D4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC860ENZQ50D4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC855TCVR66D4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC855TVR66D4
✅ Remplacement direct✓ En stock
$55.4 / unité
Voir la fiche technique →MPC860TCVR50D4
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MPC855TCVR50D4 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Series | MPC8xx |
| Core Processor | MPC8xx |
| Core Architecture | PowerPC |
| Number of Cores | 1 |
| Bit Width | 32-bit |
| Core Frequency | 50 MHz |
| Communication Processor Module | CPM with dual Fast Ethernet |
| Boîtier | 357-PBGA (25x25 mm) |
| Type de montage | Surface Mount |
| Ethernet Support | Fast Ethernet 100 Mbps (integrated) |
| Température de fonctionnement | -40C to +105C (industrial) |
| Process Technology | 0.32 um CMOS |
| Statut du cycle de vie | End of Life / Last Time Buy |
Guide de configuration des broches du MPC855TCVR50D4 357-pbga (25x25 mm)
Configuration des broches du MPC855TCVR50D4 (boîtier 357-pbga (25x25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC855TCVR50D4.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC855TCVR50D4 convient pour 6 applications: DSLAM Line Card Controller, Integrated Access Device, Router Control Plane Processor, Industrial Ethernet Controller, Legacy Network Equipment Maintenance, Multi-Protocol Serial Communication Hub.
DSLAM Line Card Controller
The MPC855TCVR50D4's integrated Fast Ethernet controllers and Communication Processor Module make it ideal for DSLAM line card applications where deterministic packet handling is required. Operating at 50 MHz with the PowerPC core handling supervisory tasks while the CPM offloads ATM and Ethernet processing, this part delivers proven performance for central office equipment. The 357-PBGA footprint allows direct PCB reuse across the MPC860 PowerQUICC family, simplifying both new designs and legacy system upgrades. Engineers benefit from the extensive PowerQUICC ecosystem supporting over 50 third-party tool vendors, including Green Hills INTEGRITY and Wind River VxWorks for telecommunications-grade software stacks.
Recommandé
Integrated Access Device
Access equipment combining voice, data, and video services benefits from the MPC855TCVR50D4's dual integrated Fast Ethernet controllers and multi-protocol serial support. The PowerPC core at 50 MHz handles routing protocols and management functions while the dedicated CPM manages time-critical TDM and packet processing. This division of labor eliminates the need for external Ethernet MACs and reduces BOM cost in IAD designs. Industrial temperature grade (-40C to +105C) supports deployment in customer premises equipment and outdoor enclosures.
Recommandé
Router Control Plane Processor
Mid-range router designs leverage the MPC855TCVR50D4 as a management and control plane processor, where its PowerPC core runs routing protocols (RIP, OSPF, BGP) while the CPM handles forwarding plane interfaces. At 50 MHz, the part provides adequate processing for control plane tasks in small-to-medium enterprise routers. The 357-PBGA package provides robust thermal performance for fanless router chassis designs, with the established PowerQUICC software ecosystem including U-Boot and Linux reference implementations.
Recommandé
Industrial Ethernet Controller
Factory automation and industrial networking systems use the MPC855TCVR50D4 for deterministic Ethernet communication in harsh environments. The industrial temperature rating (-40C to +105C) and integrated dual Ethernet controllers enable compact PLC and SCADA controller designs without external MAC chips. The PowerPC architecture supports real-time operating systems including RTEMS and VxWorks, providing deterministic response times required for industrial protocol stacks like EtherNet/IP, PROFINET, and Modbus TCP.
Recommandé
Legacy Network Equipment Maintenance
The MPC855TCVR50D4 supports long-life maintenance of deployed networking equipment including legacy DSLAMs, access multiplexers, and enterprise routers. With End of Life status, the part is available through authorized distributors and aftermarket suppliers like Rochester Electronics for continued support. The 357-PBGA footprint and 50 MHz operation match the original design specifications, allowing direct field replacement without PCB modification. Engineers maintaining installed bases benefit from the stable PowerQUICC software ecosystem and existing firmware compatibility.
Recommandé
Multi-Protocol Serial Communication Hub
Telecommunications equipment requiring multiple serial protocols (HDLC, UART, BISYNC, transparent) utilizes the MPC855TCVR50D4's multiple SCCs and SMCs within the Communication Processor Module. The dedicated CPM handles time-critical protocol processing while the PowerPC core manages higher-layer functions. This architecture eliminates discrete protocol controllers in access equipment designs, reducing board complexity and improving reliability. The 50 MHz operation provides sufficient throughput for T1/E1 aggregation in small access multiplexers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC855TCVR50D4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC855TVR50D4 | MPC860TZQ50D4 | MPC860ENZQ50D4 | MPC855TCVR66D4 | MPC855TVR66D4 | MPC860TCVR50D4 |
|---|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 66 MHz | 66 MHz | 50 MHz |
| Core Architecture | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx |
| Integrated Ethernet | Dual Fast Ethernet (CPM) | Dual Fast Ethernet (CPM) | External Ethernet MAC | Enhanced Ethernet (10/100) | Dual Fast Ethernet (CPM) | Dual Fast Ethernet (CPM) | Enhanced Ethernet (CPM) |
| Bit Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Lead-Free / RoHS | Non-RoHS (legacy part) | Lead-free variant available | RoHS compliant | RoHS compliant | Non-RoHS (legacy part) | Lead-free variant | Lead-free variant |
| Lifecycle Status | Last Time Buy | Last Time Buy | End of Life | End of Life | Last Time Buy | Last Time Buy | Last Time Buy |
Principaux différenciateurs
- Integrated dual Fast Ethernet in CPM (vs MPC860TZQ50D4)
- Available at three speed grades in same package (vs MPC855TCVR66D4)
- Mature ecosystem with 50+ third-party tools (vs Newer QorIQ processors)
Notes de conception
The 357-PBGA package at 50 MHz operation generates moderate heat in typical access equipment applications. For designs operating at elevated ambient temperatures or in sealed enclosures, provide at least 4 square inches of PCB copper area connected to the BGA thermal balls. The industrial temperature grade supports operation to 105C ambient with adequate thermal management.
The MPC855T is footprint-compatible with MPC860 PowerQUICC designs, enabling direct PCB reuse. Route the memory bus (address/data) with matched-length traces and 50 ohm controlled impedance. Decoupling requires 0.1 uF ceramic capacitors placed within 5 mm of each power pin, plus bulk capacitors at the board edge connector.
Verify boot mode configuration via the hard-reset configuration pins before first power-up. The MPC855T supports various boot sources including Flash, EPROM, and serial download. Incorrect MODCK or RSTCONF settings will cause boot failures. Consult the MPC855T reference manual for the specific configuration sequence matching your memory map.
Keep the CPM serial interface traces (SCC, SMC) isolated from the memory bus to prevent crosstalk. Use ground guard traces around high-speed Ethernet signals. The PHY interface requires careful length matching for MII (under 150 mm) and RMII (under 75 mm) modes. Consider using series termination resistors on clock signals.
Informations de conformité
Per the part number suffix convention, MPC855TCVR50D4 is the original leaded/non-RoHS variant; the MPC855TVR50D4 (without 'C') is the lead-free variant for RoHS markets. The industrial temperature grade is indicated by 'D4' suffix.
