MPC859DSLZP50A - PowerQUICC 50MHz Comm Processor | NXP | BGA-357
Référence : MPC859DSLZP50A ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72 | $720,00 |
| 100 | $65 | $6 500,00 |
| 500 | $58 | $29 000,00 |
| 1 000 | $52.5 | $52 500,00 |
MPC859DSLZP50A Présentation
Background Knowledge: A PowerQUICC (Power Architecture QUICC) integrated communications processor is a system-on-chip that combines a high-performance Power Architecture CPU core with dedicated communications peripheral engines such as serial communication controllers, ATM controllers, and fast Ethernet MACs. It sits in the hierarchy of communications ICs > network processors > embedded processors > microprocessors, and historically bridged the gap between general-purpose MCUs and dedicated network ASICs for telecom/datacom infrastructure.
Key features of the MPC859DSLZP50A include a single 32-bit Power Architecture core at 50 MHz, dual 10/100 Mbps Ethernet MACs, multiple serial communication controllers (SCCs), an ATM Utopia interface, and a peripheral bus supporting up to 32 address bits. The device operates from a 1.8 V core supply and 3.3 V I/O supply. It is specifically tailored for DSL modems, integrated access devices (IADs), and residential gateways, where its CPM (Communications Processor Module) offloads protocol processing from the CPU.
The MPC859DSL uses a 0.18-micron CMOS process with low-power modes including doze, sleep, and deep-sleep, allowing idle power reduction in always-on CPE equipment. The CPM can independently handle SCC, SMC, SPI, I2C, and USB protocol layers, enabling wire-speed WAN-side framing without CPU intervention.
Typical applications include DSL modems, integrated access devices (IADs), residential gateways, SOHO routers, and industrial serial-protocol bridges. Its combination of Ethernet MACs, ATM support, and multi-protocol SCCs makes it especially well-suited for converged voice/data CPE where multiple T1/E1, UART, or HDLC links must be aggregated onto an Ethernet uplink.
Design consideration: Because this part is end-of-life on NXP's product page, designers evaluating it for new designs should plan for last-time-buy and consider NXP's QorIQ or PowerQUICC II/III successors for greenfield projects, while the MPC859DSL remains a viable pin-compatible upgrade for legacy repair and existing designs.
This page synthesizes distributor stock signals, NXP's end-of-life notices, and practical design notes on the MPC866/859 PowerQUICC family that are not consolidated in a single manufacturer document.
Alternatives de remplacement direct pour MPC859DSLZP50A — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC859DSLZP50A (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Mounting Type, Process Technology, Core Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC859DSLV50A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC859DSLVR66A
✅ Remplacement direct✓ En stock
$23.85 / unité
Voir la fiche technique →MPC859DSLVR50A
✅ Remplacement direct✓ En stock
$19.85 / unité
Voir la fiche technique →MPC866DSLZP50A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC866DSLV50A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC859DSLZP50A Valeurs maximales et caractéristiques électriques
| Processor Type | MPC8xx PowerQUICC Integrated Communications Controller |
| Core Architecture | 32-bit Power Architecture |
| Number of Cores | 1 |
| Core Frequency | 50 MHz |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 3.3 V |
| Boîtier / Format | 357-PBGA (25x25 mm) |
| Température de fonctionnement | 0 C to +95 C |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| Statut RoHS | RoHS |
| Ethernet MACs | 2 x 10/100 Mbps |
| Process Technology | 0.18 micron CMOS |
| Type de montage | Surface Mount |
| Lifecycle | End of Life per NXP product page |
Guide de configuration des broches du MPC859DSLZP50A 357-pbga (25x25 mm)
Configuration des broches du MPC859DSLZP50A (boîtier 357-pbga (25x25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC859DSLZP50A.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC859DSLZP50A convient pour 6 applications: DSL Modem CPE, Integrated Access Device (IAD), Residential Gateway / SOHO Router, Industrial Serial Protocol Bridge, Legacy Telecom Edge Equipment, ATM-to-Ethernet Aggregation Switch.
DSL Modem CPE
The MPC859DSLZP50A is purpose-built for DSL customer-premises equipment because it integrates dual 10/100 Ethernet MACs, an ATM Utopia interface, and a CPM that handles DSL framing without CPU intervention. At 50 MHz Power Architecture core with 1.8 V core / 3.3 V I/O supplies, it provides the WAN-side aggregation that residential DSL modems need while drawing modest idle power via the CPM doze/sleep modes. This makes it ideal for always-on DSL bridge/router designs that must run continuously without thermal stress.
Recommandé
Integrated Access Device (IAD)
For integrated access devices that combine DSL uplink with VoIP, FXS, and LAN ports, the MPC859DSLZP50A's multi-protocol SCCs, ATM SAR, and dual Ethernet MACs cover the converged voice/data path in a single chip. The 50 MHz Power Architecture core runs the VoIP/RTP stack while the CPM manages ATM AAL2/AAL5 segmentation and HDLC framing on T1/E1 links. The 357-PBGA package supports the I/O density required for 4-port LAN plus 2-port FXS designs without external bridge silicon.
Recommandé
Residential Gateway / SOHO Router
In residential gateway and SOHO router applications, the MPC859DSLZP50A's dual 10/100 Ethernet MACs drive the LAN switch fabric while the Power Architecture core runs NAT/firewall/DHCP services at wire-rate for typical broadband speeds. The CPM offloads PPPoE, PPTP, and IPSec ESP processing, freeing the 50 MHz core for routing tables and QoS classification. Low-power deep-sleep mode also helps the gateway meet energy-efficiency regulations such as the EU Code of Conduct on broadband equipment.
Recommandé
Industrial Serial Protocol Bridge
Beyond telecom, the MPC859DSLZP50A's multiple serial communication controllers (SCCs) and parallel I/O make it a robust platform for industrial protocol bridging - converting multi-drop RS-485 HDLC, UART, or BISYNC links onto Ethernet or ATM uplinks. The 0 to +95 C operating range covers most indoor industrial enclosures, and the 0.18 micron CMOS process provides proven long-term reliability for unattended factory-floor nodes. Designers can implement Modbus TCP, DNP3/IP, or proprietary serial-to-IP bridging on a single chip.
Recommandé
Legacy Telecom Edge Equipment
For legacy telecom edge equipment such as channel banks, digital cross-connect systems, and small-business PBXs, the MPC859DSLZP50A's TDM support, multi-protocol SCCs, and proven PowerQUICC reliability make it a field-deployed workhorse. Designers maintaining installed-base hardware can use it as a repair spare with confidence in long-term support from distributors like Rochester Electronics, while architects planning new platforms should select a current PowerQUICC II/III or QorIQ successor. The 357-PBGA footprint simplifies board-level swaps in existing chassis.
Recommandé
ATM-to-Ethernet Aggregation Switch
For small ATM-to-Ethernet aggregation switches used by ISPs and campus networks, the MPC859DSLZP50A integrates an ATM SAR with the AAL1/AAL2/AAL5 protocols alongside dual Ethernet MACs, eliminating external bridging silicon. At 50 MHz it can sustain multiple T1/E1 ATM links while forwarding Ethernet frames at wire-rate through the CPM's fast-path DMA. The same 357-PBGA footprint across the MPC866/859 family simplifies SKU selection for different port counts.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC859DSLZP50A — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC859DSLV50A | MPC859DSLVR66A | MPC859DSLVR50A | MPC866DSLZP50A | MPC866DSLV50A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Frequency | 50 MHz | 50 MHz | 66 MHz | 50 MHz | 50 MHz | 50 MHz |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Lead-Free / RoHS | Contains Lead / RoHS | Lead-free / RoHS | Lead-free / RoHS | Lead-free / RoHS | Contains Lead / RoHS | Lead-free / RoHS |
| Ethernet MACs | 2 x 10/100 Mbps | 2 x 10/100 Mbps | 2 x 10/100 Mbps | 2 x 10/100 Mbps | 2 x 10/100 Mbps | 2 x 10/100 Mbps |
| PCI Bridge | Not bonded | Not bonded | Not bonded | Not bonded | Bonded / active | Bonded / active |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C |
Principaux différenciateurs
- Integrated ATM SAR with Ethernet MACs (vs MPC859DSLV50A)
- 50 MHz speed grade for cost-sensitive CPE (vs MPC859DSLVR66A)
- MPC859 silicon without PCI bridge (vs MPC866DSLZP50A)
Notes de conception
The 357-PBGA package at 50 MHz and 1.8 V core / 3.3 V I/O dissipates on the order of 1-2 W under typical CPE workloads (estimated, based on 50 MHz PowerQUICC family figures). At full CPM activity with all SCCs and both Ethernet MACs active, designers should provide at least 4-layer PCB with a continuous ground plane beneath the BGA and thermal vias under the die-expose pad to keep junction temperature within the 0-95 C operating range.
Route the 357-PBGA with microvia or HDI technology to fan out the 1.0 mm pitch ball grid without necking. Place 0.1 uF decoupling capacitors adjacent to every supply ball, with bulk 10 uF tantalum or ceramic capacitors on the 1.8 V and 3.3 V rails within 25 mm. Maintain 50 ohm controlled impedance on Ethernet MII/RMII traces and keep the 50 MHz system clock traces short and guard-banded.
Because NXP has flagged MPC859DSLZP50A as End of Life, do not design it into new production programs without a written last-time-buy agreement and approved franchised-distributor stock. Designers should also confirm the silicon revision ('A' suffix) matches the firmware in their boot ROM, as some CPM errata are revision-dependent. Verify the system clock PLL configuration against the family datasheet AC timing table before committing to a BOM.
The 1.8 V core and 3.3 V I/O rails require proper power sequencing per the MPC866/859 hardware specifications: the 3.3 V I/O supply must be present before or coincident with the 1.8 V core supply to avoid latch-up. Use a supervisor IC or sequenced regulator pair; do not rely on diode-OR coupling. Decoupling must be sized to handle CPM DMA bursts during Ethernet packet reception without droop exceeding 5 percent.
Informations de conformité
Per the verified distributor data, MPC859DSLZP50A is RoHS compliant but contains lead per the lead-free-status field on DigiChip. Reach, halogen-free, and conflict-mineral status are not in the verified web data and are marked unknown. AEC-Q100 is not applicable because this is a commercial-grade CPE part.
