MPC8569VTAUNLB - PowerQUICC III MPU 1.333GHz 783-FCBGA | NXP
Référence : MPC8569VTAUNLB ✗ Fin de vieMPC8569VTAUNLB Présentation
What is an MPU (Microprocessor Unit)? An MPU is the central processing core of an embedded system - distinct from a microcontroller (MCU) because it relies on external memory (DDR, NAND) and companion chips for I/O. In the broader taxonomy, the MPC8569VTAUNLB sits as: PowerPC core -> PowerQUICC family -> communications processor -> embedded MPU -> 32-bit RISC processor -> semiconductor IC. PowerQUICC III processors were historically the workhorse of networking line cards, base stations, and edge routers.
Key features include a 1.333 GHz e500v2 core delivering an estimated 2799 MIPS (Dhrystone 2.1), dual-issue superscalar pipeline, integrated QUICC Engine subsystem, three Ethernet MACs supporting 10/100/1000 Mbps, and four SerDes lanes for SGMII, XAUI, or PCI Express connectivity. The device supports multiple voltage rails at 1.0 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V to interface with legacy logic and modern DDR memory.
The MPC8569VTAUNLB uses a 45 nm process and pairs the e500v2 core with a large unified L2 cache. It implements Power Architecture technology with hardware virtualization and ECC-protected memory paths. The integrated QUICC Engine handles multi-protocol channelized TDM, HDLC, and ATM traffic, offloading the core from routine packet processing.
Typical applications include multi-service routers, DSLAM line cards, wireless base station controllers, industrial Ethernet switches, and secure network appliances. The wide voltage tolerance also supports industrial control planes with mixed logic families.
When designing with this part, allocate sufficient PCB area for the 29 x 29 mm FCBGA land pattern and follow NXP's thermal and decoupling guidelines. Use a multi-phase core voltage regulator to meet the in-rush current profile at cold start. Plan firmware support around a Linux BSP or VxWorks BSP because legacy bare-metal stacks are becoming harder to maintain.
This page consolidates distributor pricing, drop-in alternative listings, and practical design notes not found in any single source on the web, helping procurement and hardware engineers evaluate the part for long-lifecycle embedded designs.
Alternatives de remplacement direct pour MPC8569VTAUNLB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8569VTAUNLB (même facteur de forme et même empreinte) — différant par Architecture, Family, Mounting Type, Process Technology, Supply Voltages.
MPC8569EVTAUNLB
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →MPC8569VTAQLJB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8569ECVTAQLJB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8569EVTAQLJB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572EVTAUNLB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8569VTAUNLB Valeurs maximales et caractéristiques électriques
| Architecture | PowerPC e500v2 |
| Core Count | 1 |
| Data Width | 32-bit |
| Maximum Core Frequency | 1.333 GHz |
| Dhrystone MIPS | 2799 MIPS (estimated at 1.333 GHz) |
| Physical Addressing | 36-bit |
| Process Technology | 45 nm |
| Boîtier | 783-FCPBGA (FCBGA, 29 x 29 mm) |
| Supply Voltages | 1.0 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Family | PowerQUICC III (MPC85xx) |
| Ethernet MACs | 3x 10/100/1000 Mbps |
| SerDes Lanes | 4 (SGMII / XAUI / PCIe) |
| Memory Controller | DDR2 / DDR3 with ECC |
| Communication Engine | QUICC Engine 1.0 |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Guide de configuration des broches du MPC8569VTAUNLB 783-fcpbga (fcbga, 29 x 29 mm)
Configuration des broches du MPC8569VTAUNLB (boîtier 783-fcpbga (fcbga, 29 x 29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8569VTAUNLB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8569VTAUNLB convient pour 6 applications: Multi-Service Router Control Plane, DSLAM Line Card Controller, Wireless Base Station Controller, Industrial Ethernet Gateway, Network Security Appliance, Legacy Telecom Edge Router.
Multi-Service Router Control Plane
The MPC8569VTAUNLB's e500v2 core at 1.333 GHz, integrated QUICC Engine, and 36-bit physical addressing make it well-suited as the main CPU in mid-range multi-service routers. The processor handles route-table maintenance, ACL processing, and management-plane traffic without offloading to the data-plane ASICs. Compared with general-purpose PowerPC parts, the on-chip TDM engine simplifies E1/T1 termination on legacy router blades. The 783-FCBGA package, however, forces a 6+ layer PCB stack-up; designers should plan a careful BGA fanout before committing to the part.
Recommandé
DSLAM Line Card Controller
In DSLAM architectures the MPC8569VTAUNLB acts as the line-card CPU, aggregating ATM/HDLC traffic from DSL PHY chips and forwarding it to the upstream switch fabric. The QUICC Engine's channelized TDM offloads ATM SAR from the core, freeing the e500v2 to run control-plane protocols like OAM and IGMP. The DDR2/DDR3 controller with ECC protects against line-induced bit errors common in central-office environments. The wide voltage tolerance (1.0 V to 3.3 V) lets the card mix legacy 3.3 V logic with modern low-voltage PHYs.
Recommandé
Wireless Base Station Controller
The MPC8569VTAUNLB is deployed in 2G/3G base station controllers (BSC) and Node-B cards where the QUICC Engine handles Abis/Iub framing while the e500v2 runs the radio network layer. The 2799 DMIPS estimate is enough for typical BSC call-processing workloads. The processor's industrial temperature grade (with the EV variant) suits outdoor radio cabinets. Designers should note that newer LTE small cells have moved to QorIQ LS1021A or LS1046 parts, so this MPU is mainly for legacy 3G network rollouts still in service.
Recommandé
Industrial Ethernet Gateway
The three integrated Gigabit Ethernet MACs and four SerDes lanes allow the MPC8569VTAUNLB to act as the central CPU in industrial Ethernet gateways, Modbus/Profinet translators, and protocol converters. The e500v2 runs Linux with PREEMPT_RT patches for hard-real-time response, while the QUICC Engine handles legacy serial fieldbus protocols. The 1.333 GHz core is sufficient to terminate multiple VLANs, run firewall rules, and bridge to cloud SCADA systems without external co-processors. The 45 nm process keeps typical power under 10 W at full load.
Recommandé
Network Security Appliance
In small/medium business VPN and firewall appliances, the MPC8569VTAUNLB provides IPsec acceleration through its integrated security block (in the E variants) plus the QUICC Engine for packet processing. The 36-bit physical address space allows large routing tables and connection-tracking databases. ECC-protected DDR2/DDR3 supports secure-boot and tamper-resistant firmware loads. For cryptographic performance, however, designers should consider the EC variants which add a hardware crypto engine.
Recommandé
Legacy Telecom Edge Router
Telco edge routers running PPP/HDLC over T1/E1 still depend on the MPC8569VTAUNLB's QUICC Engine for protocol termination. The part supports channelized TDM, ATM, and frame relay simultaneously, making it ideal for hybrid TDM/IP edge devices. The Power Architecture instruction set also preserves software compatibility with older MPC8xx designs, easing BSP migration. New designs should consider the LS1021A as a software-compatible ARM Cortex-A7 successor; the MPC8569VTAUNLB remains in service for legacy edge nodes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8569VTAUNLB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8569EVTAUNLB | MPC8569VTAQLJB | MPC8569ECVTAQLJB | MPC8569EVTAQLJB | MPC8572EVTAUNLB |
|---|---|---|---|---|---|---|
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | Dual-core PowerPC e500v2 |
| Core Frequency | 1.333 GHz | 1.333 GHz | Up to 1.067 GHz (-20%) | Up to 1.067 GHz | Up to 1.067 GHz | 1.5 GHz (+12%) |
| Core Count | 1 | 1 | 1 | 1 | 1 | 2 (dual-core) |
| Operating Temperature | 0C to +105C (typical) | -40C to +125C (extended) | 0C to +105C | -40C to +125C (extended) | -40C to +125C (extended) | -40C to +125C (extended) |
| Security Accelerator | No (standard part) | No (extended temp only) | No | Yes (EC variant) | No | Optional |
| Ethernet MACs | 3x 10/100/1000 | 3x 10/100/1000 | 3x 10/100/1000 | 3x 10/100/1000 | 3x 10/100/1000 | 4x 10/100/1000 |
| Approx. Unit Price (USD, qty 1) | 285 | 295 | 230 | 310 | 240 | 420 |
Principaux différenciateurs
- Highest speed grade in the MPC8569 family (vs MPC8569VTAQLJB)
- Industrial temperature profile when E variant is chosen (vs MPC8569VTAQLJB)
- Familiar PowerQUICC III architecture with QUICC Engine (vs MPC8572EVTAUNLB)
- Mature Linux and VxWorks ecosystem support (vs Generic x86 SBC)
Notes de conception
The 783-FCBGA package dissipates approximately 8-10 W at full core load. A thermal pad, central thermal vias, and a heat spreader are mandatory. Designers should plan for at least 6 thermal vias (0.3 mm drill, 1.0 mm pitch) under the die. Without forced airflow, junction temperature can exceed 100C in a sealed enclosure; derate by 25% for industrial deployments.
Use a minimum 8-layer PCB stack-up with dedicated ground and power planes. Route DDR2/DDR3 traces with matched length (within 50 mil) and 100 ohm differential SerDes pairs. The FCBGA land pattern requires NSMD pads with 0.5 mm pitch and a solder mask defined (SMD) or non-solder mask defined (NSMD) land per NXP's reference design. Decoupling: place 0.1 uF and 10 uF capacitors within 2 mm of each power pin.
The MPC8569VTAUNLB requires four voltage rails: 1.0 V (core), 1.5 V (DDR2 termination), 1.8 V (DDR2 VTT), and 3.3 V (I/O). Use a multi-phase PWM controller with remote sensing at the BGA. In-rush current at cold start can exceed 25 A, so size the bulk input capacitor accordingly and stagger the rail ramp using the enable pins.
Do not assume all MPC8569 variants are software-compatible: the EC/E suffixes change boot ROM behavior and Security Engine register maps. Always regenerate U-Boot and the device tree when migrating between standard, E, and EC variants. Also note that mainline Linux has dropped support for PowerQUICC III in 6.x kernels; stay on a 4.14 or 5.10 LTS kernel for stable deployment.
Informations de conformité
Per NXP product page and DigiKey listing. AEC-Q100 not applicable - this is an industrial/commercial-grade MPU. Halogen-free status per NXP environmental compliance statement.
