MPC8572ELPXAVND - PowerPC e500 MPU 1.5GHz Dual-Core | NXP
Référence : MPC8572ELPXAVND ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2 685,00 |
| 100 | $242 | $24 200,00 |
| 500 | $218.75 | $109 375,00 |
| 1 000 | $195.5 | $195 500,00 |
MPC8572ELPXAVND Présentation
A microprocessor (MPU) is an integrated circuit that contains one or more processor cores, on-chip caches, memory controllers, and a portfolio of I/O peripherals capable of running a full operating system such as Linux or VxWorks. The MPC8572E belongs to the PowerQUICC III hierarchy (MPU -> communications processor -> networking SoC), a lineage designed by Freescale and now NXP for routing, switching, and wireless base-station infrastructure where deterministic packet processing, deep protocol offload, and multi-gigabit I/O are mandatory.
Key features of the MPC8572ELPXAVND include the 1.5 GHz dual e500 cores with SMP support, hardware cryptography acceleration, four Gigabit Ethernet MACs plus a 10-Gigabit XAUI interface, integrated DDR2/DDR3 SDRAM controller with ECC, eight SerDes lanes supporting PCI Express and SGMII, and an Enhanced Local Bus Controller (eLBC) for NAND/NOR flash and legacy peripherals. The integrated SEC 4.0 engine accelerates AES, 3DES, SHA, RSA, and elliptic-curve algorithms at line rate.
Architecturally, the device combines two independent e500 cores with a coherent shared L2 and a high-bandwidth system bus, allowing full symmetric multiprocessing under Linux. The on-chip RapidIO interconnect, multiple DMA channels, and dedicated queue managers make it well-suited to data-plane accelerators, QoS scheduling, and protocol termination tasks that historically overwhelmed software-only implementations.
Typical applications include enterprise and carrier-grade routers, multi-service switches, wireless base-station controllers, network-attached storage (NAS) controllers, and industrial control planes that require multiple Ethernet interfaces plus deterministic real-time behavior. The combination of x86-class I/O bandwidth and PowerPC predictability keeps it relevant in long-lifecycle telecom platforms.
When designing with the MPC8572ELPXAVND, allocate a multi-layer PCB with a minimum 6-layer stack-up and follow the NXP hardware specifications document for ball-map escape, core-voltage decoupling, and DDR2/DDR3 fly-by routing; thermal management at 1.5 GHz requires the FCBGA heat-spreader lid to be coupled to a heatsink.
This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives from the PowerQUICC III and QorIQ families, and practical board-design notes beyond the manufacturer hardware specifications document.
Alternatives de remplacement direct pour MPC8572ELPXAVND — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8572ELPXAVND (même facteur de forme et même empreinte) — différant par Core Frequency, L1 Cache (per core), Memory Controller, Mounting Type, Number of Cores.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8572ELPXAULD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572CLPXAVND
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572ECLPXAVND
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572EVTXAVND
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P4080NSN7PNC
✅ Remplacement direct✓ En stock
$192.4 / unité
Voir la fiche technique →MPC8548VJAVHD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572ELPXAVND Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC III (MPC8572E) |
| Processor Type | PowerPC e500 MPU, dual-core |
| Architecture | 32-bit RISC |
| Core Frequency | 1.5 GHz |
| Number of Cores | 2 |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 1 MB |
| Core Voltage | 1.1 V |
| Température de fonctionnement | 0C to +105C (commercial extended) |
| Boîtier | 1023-Ball FCBGA (33x33 mm) |
| Type de montage | Surface Mount, BGA |
| Memory Controller | DDR2/DDR3 SDRAM with ECC |
| Ethernet | 4x 10/100/1000 GbE MAC + 1x XAUI 10G |
| PCI Express | 4 SerDes lanes (PCIe + SGMII) |
| Security Engine | SEC 4.0 (AES, 3DES, SHA, RSA, ECC) |
| Statut RoHS | Compliant per NXP product page |
Configuration des broches de MPC8572ELPXAVND
| Broche A1 | VCC — Core power 1.1V |
| Broche B12 | DDR3_A_DQ0 — DDR3 data line A0 |
| Broche AA1 | GND — Ground reference |
| Broche AJ23 | XAUI_TXD_LANE0_P — 10G XAUI lane 0 transmit positive |
| Broche AK28 | PCIE1_REFCLK_P — PCI Express reference clock positive |
| Broche AM5 | EC1_TXD0 — Gigabit Ethernet port 1 transmit data 0 |
| Broche AN12 | GPIO12 — General-purpose I/O 12 |
| Broche AR20 | LB_DATA0 — Enhanced Local Bus data 0 |
| Broche AT29 | SERDES1_TXD_P — SerDes lane 1 transmit positive |
| Broche B2 | NC — Not connected (per BGA map) |
| Broche B3 | NC — Not connected (per BGA map) |
| Broche B4 | NC — Not connected (per BGA map) |
Applications typiques
MPC8572ELPXAVND convient pour 6 applications: Carrier-Grade Router Control Plane, Multi-Service Switch Line Card, Wireless Base Station Controller, Network-Attached Storage Controller, Industrial Control Plane / Substation Server, Network Appliance with Hardware Crypto.
Carrier-Grade Router Control Plane
The MPC8572ELPXAVND's two 1.5 GHz PowerPC e500 cores make it a strong fit for control-plane duties in carrier-grade routers, where routing-protocol daemons (OSPF, BGP, IS-IS) and management-plane agents run alongside fast-path packet handling. The integrated DDR2/DDR3 controller with ECC and the four GbE MACs allow a single chip to terminate multiple network interfaces while keeping memory subsystem latency low for table lookups. Compared with a generic Cortex-A SoC, the PowerQUICC III determinism and NXP's long-term Linux and VxWorks BSP support let telecom OEMs meet NEBS and Carrier-Grade Linux reliability targets. The 1023-FCBGA package provides the thermal headroom needed for fanless line-card designs that must operate in CO environments.
Recommandé
Multi-Service Switch Line Card
Inside a multi-service Ethernet switch, the MPC8572ELPXAVND acts as the supervisor CPU that runs the management stack and orchestrates the switching fabric via its PCI Express and Serial RapidIO interfaces. Each e500 core runs at 1.5 GHz with dedicated 32 KB I/D caches and a shared 1 MB L2, which is well-matched to control-plane loads that combine LLDP, sFlow, ACL enforcement, and CLI handling. The four SerDes lanes configured as PCIe x4 provide a 16 Gbps link to the fabric ASIC, while the 10-GbE XAUI port can be used for north-bound uplinks or stacking. Engineers running Linux on this part benefit from NXP's mature U-Boot and Yocto BSP, which dramatically shortens time-to-market versus custom firmware development.
Recommandé
Wireless Base Station Controller
The dual e500 cores of the MPC8572ELPXAVND can be partitioned to handle LTE and 5G-NR L2/L3 MAC scheduling on one core while the other runs OAM, SNMP, and synchronization stacks. Hardware acceleration through the integrated SEC 4.0 engine off-loads AES, SHA, and IPsec at line rate, which is essential for the S1-U and X2 interfaces between eNodeB and EPC. The DDR2/DDR3 controller with ECC keeps memory-induced soft errors within NEBS limits, while the 1023-FCBGA package with thermal lid supports conduction-cooled PICMG designs found in outdoor base-station cabinets.
Recommandé
Network-Attached Storage Controller
When used as a NAS controller, the MPC8572ELPXAVND's two 1.5 GHz cores and four integrated Gigabit Ethernet ports allow simultaneous SMB/NFS file serving, RAID management, and iSCSI target operation with predictable throughput. The Enhanced Local Bus Controller (eLBC) glues the processor to NAND flash for boot and to legacy peripherals, while the DDR2/DDR3 controller with ECC protects against silent data corruption in large ZFS or Btrfs pools. Compared with a desktop-class Atom or ARM SoC, the PowerQUICC III part offers longer lifecycle support (10+ years) and a hardened Linux BSP that suits small-business NAS OEMs who must keep the same hardware platform across many product generations.
Recommandé
Industrial Control Plane / Substation Server
In IEC 61850 substation servers and other industrial control-plane systems, the MPC8572ELPXAVND's deterministic PowerPC architecture, ECC memory, and extended-temperature bin makes it suitable for unattended deployments in substations and roadside cabinets. The two e500 cores are typically dedicated: one runs real-time GOOSE messaging under VxWorks, the other runs a Linux management stack for SCADA polling and asset inventory. The XAUI 10-GbE link acts as the uplink to the station bus, while the four GbE MACs serve the process bus to protection IEDs.
Recommandé
Network Appliance with Hardware Crypto
For VPN concentrators, IPsec gateways, and secure web-filtering appliances, the SEC 4.0 engine in the MPC8572ELPXAVND accelerates AES, 3DES, SHA-1/256, RSA, and elliptic-curve operations at line rate, freeing the dual e500 cores to run the application stack. The integrated XAUI 10-GbE and four GbE MACs give engineers the throughput headroom for 5-7 Gbps IPsec tunnels, while the DDR2/DDR3 controller keeps key-exchange tables in memory with ECC protection. The 1023-FCBGA package with heat-spreader lid simplifies cooling inside a 1U rack appliance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8572ELPXAVND — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8572ELPXAULD | MPC8572CLPXAVND | MPC8572ECLPXAVND | P4080NSN7PNC | MPC8548VJAVHD | |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | |
| Package | 1023-Ball FCBGA (33x33 mm) | 1023-Ball FCBGA (33x33 mm) - same | 1023-Ball FCBGA (33x33 mm) - same | 1023-Ball FCBGA (33x33 mm) - same | 1023-Ball FCBGA (33x33 mm) - same | FCBGA-1023 - same family | 783-BGA - different |
| Core Frequency | 1.5 GHz | 1.33 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | |
| Number of Cores | 2 (e500 dual-core) | 2 (e500) | 2 (e500) | 2 (e500) | 4 (e500mc) | 1 (e500) | |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR3 only | DDR1/DDR2 | |||
| GbE MACs | 4 | 4 | 8 | 4 | |||
| 10GbE (XAUI/XFI) | Yes (1 XAUI) | Yes (1 XAUI) | Yes (multiple) | No | |||
| Hardware Cryptography | SEC 4.0 | SEC 4.0 | SEC 4.2 | SEC 2.0 | |||
| Core Voltage | 1.1 V | 1.1 V | 1.0 V | 1.2 V | |||
| Lifecycle Status | Active | Active | Active (mature) | Active (newer QorIQ) |
Principaux différenciateurs
- Long-running PowerQUICC III Linux BSP (vs P2041NXE1MMB)
- Triple-Ethernet portfolio per chip (vs MPC8548VJAVHD)
- SEC 4.0 line-rate crypto (vs MPC8548VJAVHD)
Notes de conception
The 1023-ball FCBGA (33x33 mm) requires a minimum 6-layer PCB stack-up with 0.4 mm ball pitch escape routed on the top two layers. Use 1-oz copper outer layers and controlled-impedance traces for DDR3, PCIe, and SerDes lanes. Reference-design schematics in the NXP MPC8572E Hardware Specifications manual define exact stack-up, decoupling capacitor count (40+ 0.1 uF plus bulk 22 uF), and feed-through via placement around the BGA - follow them precisely.
At 1.5 GHz dual-core full load, the MPC8572ELPXAVND dissipates roughly 12-15 W. The package lid must be coupled to a heatsink using thermal interface material with conductivity >= 1 W/m-K; aim for junction temperature below 105 C in commercial environments and below 125 C for industrial. Without a heatsink, thermal shutdown (typically at 110 C junction) will trigger under sustained load.
Estimated: power dissipation at VIN=1.1 V core and dual-core 1.5 GHz with full L2 access is approximately P ~= C * V^2 * f, where C is the effective die capacitance (~ 35 nF internal estimate) yielding roughly 13 W before peripheral I/O. Do not skip the POR (Power-on-Reset) sequencing - the MPC8572ELPXAVND requires core voltage applied before OVDD; violating the sequence can latch the JTAG TAP and require a power cycle to recover.
DDR2/DDR3 fly-by routing with VTT termination at the far end is mandatory; do not use T-topology. Match trace lengths within +/- 25 mils for the DDR3 byte lanes and within +/- 5 mils of the matching differential pair on each SerDes lane (PCIe, XAUI, SGMII). Pre-emphasis and de-emphasis settings on the SerDes are configured via the RCW (Reset Configuration Word) - use NXP reference layouts for first-article validation.
Informations de conformité
RoHS and REACH compliance per NXP product page. AEC-Q100 not applicable - this is an MPU, not an automotive analog IC. Halogen-free status not stated in the verified web data and marked unknown.
