MPC8572EPXATLD - PowerPC e500 Dual-Core 1.2GHz MPU | NXP
Référence : MPC8572EPXATLD ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $269.5 | $2 695,00 |
| 100 | $248.75 | $24 875,00 |
| 250 | $232 | $58 000,00 |
| 500 | $218.5 | $109 250,00 |
MPC8572EPXATLD Présentation
An integrated communications processor (CP) is a system-on-chip (SoC) that combines a high-performance CPU subsystem with networking, memory, and peripheral controllers on a single die. Within the broader taxonomy, the MPC8572E is a member of the multiprocessor IC class, sitting under the hierarchy microprocessor -> MPU -> embedded processor -> integrated communications processor -> PowerQUICC III. These parts evolved from the original PowerQUICC architecture and target telecom, networking, and storage applications where packet processing, deterministic latency, and rich I/O are required.
Key features of the MPC8572EPXATLD include dual e500 cores with 36-bit physical addressing, hardware MMU and FPU support, an integrated security engine (SEC), four DMA channels, and a 64-bit DDR2/DDR3 memory controller with ECC. The 1023-ball FCBGA package dissipates thermal load via a top-side heat-spreader footprint, supporting industrial and extended-temperature operating points.
Architecturally, the MPC8572E pairs two PowerPC e500 cores with a high-bandwidth internal CoreNet fabric, allowing coherent SMP operation. The hardware-managed L2 cache, RapidIO messaging unit, and packet-processing accelerators reduce host CPU load in routing and switching line cards. The integrated SEC engine handles DES, 3DES, AES, and public-key acceleration, removing the need for an external crypto coprocessor in many designs.
Typical applications for the MPC8572EPXATLD include router/switch line cards, wireless base-station controllers, edge routers, and storage area network (SAN) controllers. It is also deployed in defense and aerospace command/control platforms where PowerQUICC III's deterministic interrupt response is valued.
When designing with this device, allocate adequate PCB layers (typically 8+), enforce length-matched DDR2/DDR3 routing, and follow NXP's Hardware Specifications document for power-rail sequencing and decoupling. Designers transitioning from single-core PowerQUICC III parts should review the dual-core coherency model carefully.
This page synthesizes distributor pricing, application context, and drop-in alternatives for the MPC8572EPXATLD not consolidated in the manufacturer datasheet, helping engineers evaluate sourcing and design trade-offs in one place.
Alternatives de remplacement direct pour MPC8572EPXATLD — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8572EPXATLD (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Series, Mounting Type, Core Processor.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8572EVTATLD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572VTATLD
✅ Remplacement direct✓ En stock
$112.5 / unité
Voir la fiche technique →MPC8548ECPXAUJC
✅ Remplacement direct✓ En stock
$189.9 / unité
Voir la fiche technique →MPC8572EPXATLD Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
| Series | PowerQUICC III MPC8572E |
| Core Processor | PowerPC e500, dual-core |
| Core Count | 2 |
| Largeur du bus de données | 32-bit |
| Maximum Clock Speed | 1.2 GHz |
| Operating Supply Voltage (Core) | 1.1 V |
| Package Type | 1023-FCBGA (33 x 33 mm) |
| Nombre de broches | 1023 |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +105C (extended industrial) |
| Memory Controller | DDR2/DDR3 SDRAM with ECC |
| Ethernet Controllers | 2x Enhanced Triple-Speed Ethernet (eTSEC) |
| Integrated Peripherals | DUART, DMA, I2C, SPI, GPIO, Security Engine (SEC) |
| Statut RoHS | Non-RoHS (SnPb / CSM) |
| Lead Finish | SnPb (CSM package) |
Guide de configuration des broches du MPC8572EPXATLD 1023-fcbga (33 x 33 mm)
Configuration des broches du MPC8572EPXATLD (boîtier 1023-fcbga (33 x 33 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8572EPXATLD.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8572EPXATLD convient pour 6 applications: Router / Switch Line Cards, Wireless Base Station Controllers, Edge Router Platforms, Storage Area Network (SAN) Controllers, Defense / Aerospace Command-and-Control, Industrial Networked Embedded Platforms.
Router / Switch Line Cards
The MPC8572EPXATLD's dual e500 cores at 1.2 GHz and two integrated eTSEC Gigabit Ethernet controllers make it well-suited for mid-range router and switch line cards requiring both control-plane processing and wire-speed data-plane forwarding. The integrated DDR2/DDR3 controller with ECC supports deep routing tables and packet buffers without external memory glue logic. Its RapidIO messaging unit enables inter-card communication in modular chassis designs, while the hardware security engine offloads IPsec and SSL/TLS from the cores. Designers benefit from consolidating control-plane CPU, switch fabric interface, and crypto accelerator into a single 1023-FCBGA package.
Recommandé
Wireless Base Station Controllers
Wireless base-station controllers benefit from the MPC8572EPXATLD's dual-core architecture, dedicating one e500 core to real-time baseband scheduling while the second core handles network-side packet processing and O&M traffic. The integrated DUART, I2C, and SPI interfaces connect to RF front-end controllers, fan trays, and alarm monitoring without an additional BMC chip. Deterministic interrupt latency from the e500 core pair supports the timing-critical MAC/PHY handshake required in 3G/4G baseband cards. The 1023-FCBGA package's thermal envelope accommodates base-station chassis airflow and conduction-cooled assembly.
Recommandé
Edge Router Platforms
The MPC8572EPXATLD fits edge-router platforms that require integrated crypto, multi-gigabit Ethernet, and flexible memory options in a single SoC. Its hardware-accelerated SEC engine handles IPsec, SSL, and public-key operations at line rate without burdening the e500 cores, which remain free for routing-protocol computation (OSPF, BGP, MPLS). Dual eTSEC ports can be aggregated or split between LAN/WAN segments, while the DDR3 memory controller supports the deep FIB tables needed for IPv4/IPv6 edge routing. The 1.1 V core supply keeps board-level power within typical edge-router thermal budgets.
Recommandé
Storage Area Network (SAN) Controllers
Storage area network controllers rely on the MPC8572EPXATLD's deterministic e500 core pair, hardware-accelerated DMA, and RapidIO messaging to manage RAID volumes, iSCSI target stacks, and Fibre Channel bridging. The DDR2/DDR3 controller with ECC provides the low-latency, error-corrected memory required for write-back cache coherency in RAID-6 implementations. The integrated security engine accelerates AES-encrypted storage traffic without an external crypto card. Designers can partition the dual cores between initiator-side protocol handling and target-side block management, reducing overall controller latency.
Recommandé
Defense / Aerospace Command-and-Control
Defense and aerospace command-and-control systems leverage the MPC8572EPXATLD's deterministic interrupt response, dual-core redundancy options, and the CSM SnPb package for legacy lead-based assembly required in many MIL-spec programs. The dual e500 cores can run primary and watchdog flight-control software on separate cores, providing lockstep-style fault detection without an external supervisor. Integrated eTSEC ports and RapidIO satisfy the deterministic, high-reliability networking used in mission computers. The 1023-FCBGA package is qualified for the extended industrial temperature range required in avionics and ground-mobile platforms.
Recommandé
Industrial Networked Embedded Platforms
Industrial embedded platforms such as substation controllers, SCADA masters, and programmable automation controllers (PACs) benefit from the MPC8572EPXATLD's long-life-cycle availability, dual-core determinism, and rich peripheral set. The integrated DUART and GPIO connect to legacy RS-485 and parallel industrial buses without a bridge ASIC. Hardware ECC on the DDR2/DDR3 controller improves reliability in unattended substation cabinets. The RapidIO interface allows deterministic coupling between multiple PACs in a chassis, while the on-chip security engine protects grid-control traffic from tampering.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8572EPXATLD — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8572EVTATLD | MPC8572VTATLD | MPC8548ECPXAUJC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same |
| Core Count | 2 (dual e500) | 2 (dual e500) | 1 (single e500) | 1 (single e500) |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet Controllers | 2x eTSEC (10/100/1000) | 2x eTSEC (10/100/1000) | 2x eTSEC (10/100/1000) | 2x eTSEC (10/100/1000) |
| Lead Finish / RoHS | SnPb (CSM) / Non-RoHS | SnPb (CSM) / Non-RoHS | SnPb (CSM) / Non-RoHS | SnPb / Non-RoHS |
Principaux différenciateurs
- Dual-core 1.2 GHz operation in a single FCBGA (vs MPC8572VTATLD)
- Higher clock speed than MPC8572EVTATLD (vs MPC8572EVTATLD)
- Pin-compatible with the broader MPC8572E family (vs MPC8548ECPXAUJC)
Notes de conception
Estimated: the 1023-FCBGA package at 33x33 mm with 1.0 mm ball pitch requires a high-density PCB with microvia-in-pad and 8+ routing layers. Route the DDR2/DDR3 signals on inner layers with length-matched tracks; reference NXP AN3665 and the MPC8572E Hardware Specifications for byte-lane routing rules. Maintain continuous reference planes under the BGA to control impedance and reduce crosstalk on high-speed SerDes lanes.
The MPC8572EPXATLD requires multiple power rails (core ~1.1 V, DDR2/3 VTT 0.9 V or 0.75 V, SerDes analog 1.0 V, I/O 1.8 V/2.5 V/3.3 V) with strict sequencing per the hardware specifications. Use a PMIC with power-good feedback to the PORESET pin; failure to sequence rails correctly can latch up the device. Decouple each rail with bulk ceramic plus 0.1 uF/1 nF pairs placed within 5 mm of the BGA balls.
Estimated: at 1.2 GHz dual-core the MPC8572EPXATLD can dissipate 8-12 W depending on workload; the FCBGA package requires a top-side heat spreader or heat sink. Junction-to-ambient thermal resistance without a heat sink typically exceeds 15 C/W, so a thermal solution is mandatory. Derate the core clock to 1.0 GHz if the chassis cannot supply >25 CFM airflow over the heat spreader.
Do not confuse the MPC8572EPXATLD (dual-core 1.2 GHz) with the MPC8572VTATLD (single-core) or MPC8572EVTATLD (lower-speed dual-core) - all share the 1023-FCBGA footprint, but firmware RCW (reset configuration word) values differ. Always confirm the exact device marking on the top of the BGA before reflashing boot images. The CSM SnPb package is non-RoHS; do not place it on RoHS-only assembly lines without a dedicated leaded reflow profile.
Informations de conformité
Non-RoHS SnPb (CSM) package per datasheet identifier PQ38H Rev 2.1 CSM SnPb. REACH compliance per NXP product statements. Not AEC-Q100 qualified. Use MPC85xx RoHS variants for lead-free requirements.
