MPC8572EVTAULD - PowerQUICC III 1.333GHz Dual-Core MPU | NXP
Référence : MPC8572EVTAULD ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $288.66 | $288,66 |
| 10 | $274.22 | $2 742,20 |
| 100 | $259.79 | $25 979,00 |
| 500 | $245.36 | $122 680,00 |
| 1 000 | $230.93 | $230 930,00 |
MPC8572EVTAULD Présentation
What is a PowerQUICC integrated processor? A PowerQUICC (Quad Integrated Communications Controller) is a family of communications-centric microprocessors that originated at Motorola/Freescale (now NXP) and combine a PowerPC processor core with specialized communications engines. The MPC8572E specifically sits in the PowerQUICC III generation, which extended the architecture to dual e500 cores with hardware-accelerated pattern matching, RapidIO, PCI Express, and Gigabit Ethernet MACs. The hypernym hierarchy is: microprocessor -> MPU -> communications processor -> network SoC -> embedded processor.
Key features of the MPC8572EVTAULD include 32 KB L1 instruction cache and 32 KB L1 data cache per core, a shared 1 MB L2 cache with ECC, a 64-bit DDR2/DDR3 memory controller, two Gigabit Ethernet controllers, dual PCI Express interfaces, four SerDes lanes usable for SGMII, RapidIO, or PCI Express, and an integrated security block (SEC) supporting DES, 3DES, AES, and public-key algorithms. The integrated pattern-matching engine accelerates deep-packet classification for network security and QoS workloads.
The MPC8572E architecture implements a coherent SMP/MSC (Symmetric/Asymmetric Multi-Core) topology with hardware-validated cache coherency, enabling parallel execution across both e500 cores. The SEC crypto-acceleration engine is wired directly to the memory hierarchy, providing multi-Gbps line-rate encryption. The 45 nm CMOS process and 33x33 mm FCBGA package support the high integration required by multi-service routers and LTE/3G base-station line cards.
This processor is engineered for multi-service routers, secure gateways, LTE/UMTS base stations, network-attached storage, and enterprise switching platforms. The combination of dual e500 cores, hardware crypto, RapidIO/PCIe interconnect, and Gigabit Ethernet controllers addresses line-rate performance for both control-plane and data-plane workloads.
Designers should be aware of the 1023-ball FCBGA requiring high-density PCB layout, controlled-impedance SerDes routing, and matched-length DDR traces. Thermal management must accommodate the device's TDP through a heatsink plus airflow, especially at industrial temperature corners.
This page consolidates distributor pricing, drop-in alternatives within the same 1023-FCBGA family, and design considerations not explicitly tabulated in the manufacturer datasheet.
Alternatives de remplacement direct pour MPC8572EVTAULD — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8572EVTAULD (même facteur de forme et même empreinte) — différant par L1 Cache (per core), L2 Cache, Mounting Type, Process Technology, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8572EPXARLD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572EPXAULD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572EVTARLD
✅ Remplacement direct✓ En stock
$205.4 / unité
Voir la fiche technique →MPC8572ELPXARLD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572CLPXARLD
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8572EVTAULD Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC III |
| Part Number | MPC8572EVTAULD |
| Die Revision | Rev 2.1 (PQ38H) |
| Core Architecture | PowerPC e500 (dual-core) |
| Number of Cores | 2 |
| Core Frequency | 1.333 GHz |
| Largeur du bus de données | 32-Bit |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 1 MB shared, ECC |
| Température de fonctionnement | -40C to +85C (industrial) |
| Boîtier | 1023-FCBGA (33x33 mm) |
| Type de montage | Surface Mount |
| Process Technology | 45 nm SOI CMOS |
| Pb-Free | Yes |
| Statut RoHS | Compliant |
Guide de configuration des broches du MPC8572EVTAULD 1023-fcbga (33x33 mm)
Configuration des broches du MPC8572EVTAULD (boîtier 1023-fcbga (33x33 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8572EVTAULD.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8572EVTAULD convient pour 6 applications: Multi-Service Routers, LTE/UMTS Base Station Baseband, Network-Attached Storage Controllers, Secure VPN Gateways, Enterprise Switching Platforms, Industrial Firewall Appliances.
Multi-Service Routers
The MPC8572EVTAULD fits multi-service router line cards because its dual e500 cores at 1.333 GHz deliver control-plane plus data-plane throughput in a single device. The integrated SEC crypto engine accelerates IPsec and SSL/TLS at multi-Gbps line rate without loading the CPU cores. Dual Gigabit Ethernet MACs and four SerDes lanes provide flexible uplink options including SGMII, RapidIO, or PCI Express to switch fabrics. Designers place the processor on a line card with a TCAM co-processor for ACL lookup acceleration, leveraging the shared 1 MB L2 cache for low-latency packet descriptor handling.
Recommandé
LTE/UMTS Base Station Baseband
The MPC8572EVTAULD fits LTE and UMTS base station baseband processing where dual e500 cores handle layer-2 and layer-3 protocol stacks concurrently. Its DDR2/DDR3 controller with ECC supports the high-bandwidth memory access required by baseband signal processing. The industrial temperature range of -40C to +85C supports outdoor deployment in uncontrolled cabinets. The 1023-FCBGA package enables dense board layouts alongside DSP co-processors, while the RapidIO/PCIe SerDes provide low-latency interconnect to radio cards.
Recommandé
Network-Attached Storage Controllers
The MPC8572EVTAULD suits enterprise NAS controllers because its dual e500 cores can dedicate one core to iSCSI/TCP/IP offload and the other to RAID/filesystem management. The integrated SEC engine accelerates encrypted volume operations at line rate. Dual Gigabit Ethernet controllers enable link aggregation for increased throughput, and PCI Express provides attachment to external SAS/SATA controllers. The 1023-FCBGA's high pin count supports the memory and I/O bandwidth required by multi-drive enclosures.
Recommandé
Secure VPN Gateways
The MPC8572EVTAULD is ideal for secure VPN gateway appliances where the integrated SEC crypto engine handles AES, 3DES, and SHA at multi-Gbps, offloading encryption from the CPU cores. Dual e500 cores allow concurrent IPsec tunnel establishment and packet forwarding. The PCI Express interface connects to external crypto accelerators or NICs for additional throughput. The industrial temperature range supports deployment in non-climate-controlled telecom rooms, and the 1023-FCBGA enables compact appliance form factors.
Recommandé
Enterprise Switching Platforms
The MPC8572EVTAULD fits enterprise switching control planes where dual e500 cores run routing protocols, management software, and ACL processing concurrently. The shared 1 MB L2 cache with ECC ensures data integrity for routing tables, while the DDR2/DDR3 controller supports large routing databases. PCI Express and RapidIO SerDes provide flexible fabric attachment. The 1023-FCBGA supports the high-density PCB layouts typical of modular chassis switches with multiple line cards.
Recommandé
Industrial Firewall Appliances
The MPC8572EVTAULD serves industrial firewall appliances where deep-packet inspection requires pattern-matching acceleration alongside general-purpose processing. The integrated pattern-matching engine accelerates ACL lookups for stateful firewall rules, while dual e500 cores handle connection tracking and policy enforcement. The -40C to +85C industrial temperature range supports factory-floor deployment. PCI Express enables attachment to multi-port Gigabit Ethernet NICs for zone-segmented network architectures in SCADA and industrial control environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8572EVTAULD — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8572EPXARLD | MPC8572EPXAULD | MPC8572EVTARLD | MPC8572ELPXARLD | MPC8572CLPXARLD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Core Frequency | 1.333 GHz | lower than 1.333 GHz | intermediate speed grade | lower than 1.333 GHz | lower, low-power variant | commercial grade, lower speed |
| Number of Cores | 2 | 2 | 2 | 2 | 2 | 2 |
| L2 Cache | 1 MB shared | 1 MB shared | 1 MB shared | 1 MB shared | 1 MB shared | 1 MB shared |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | 0C to +70C (commercial) |
| Process Technology | 45 nm SOI CMOS | 45 nm SOI CMOS | 45 nm SOI CMOS | 45 nm SOI CMOS | 45 nm SOI CMOS | 45 nm SOI CMOS |
| Series | PowerQUICC III | PowerQUICC III | PowerQUICC III | PowerQUICC III | PowerQUICC III | PowerQUICC III |
Principaux différenciateurs
- Highest 1.333 GHz speed grade in the MPC8572E family (vs MPC8572EPXARLD)
- Industrial temperature grade qualification (vs MPC8572CLPXARLD)
- Dual e500 cores with hardware cache coherency (vs MPC8548ECPXAUJC)
Notes de conception
The MPC8572EVTAULD requires careful thermal management due to its high TDP at 1.333 GHz dual-core operation. Designers should implement a heatsink plus airflow combination and follow the thermal design guidelines in the NXP hardware specifications document. Junction temperature monitoring via the on-chip thermal sensor is recommended to prevent thermal protection events during sustained high-throughput workloads such as IPsec encryption at line rate.
The 1023-FCBGA package demands high-density PCB layout with controlled-impedance routing for DDR2/DDR3 traces, PCI Express lanes, and SerDes interfaces. Matched-length routing is required for DDR address/command and clock signals per JEDEC specifications. Use a minimum 6-layer stackup with dedicated ground and power planes, and follow NXP's design checklist for via-in-pad and microvia structures under the BGA to maintain signal integrity at multi-GHz frequencies.
Ensure proper power sequencing for the MPC8572EVTAULD's multiple supply rails (core, I/O, DDR, SerDes, analog) per the hardware specifications. Insufficient decoupling can cause PLL lock failures or SerDes link training issues. Designers should also verify that the boot ROM configuration matches the system's flash memory interface, as incorrect RCW (Reset Configuration Word) settings can prevent the processor from booting. Refer to NXP application notes for validated reference schematics.
Informations de conformité
Pb-Free per Rev 2.1 die marking PQ38H. RoHS compliant. AEC-Q100 not applicable for communications processor. Halogen-free and conflict minerals status not explicitly stated in verified web data.