MPC8572EVTAVNE - PowerQUICC III Dual 1.5GHz SoC | NXP
Référence : MPC8572EVTAVNE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168.5 | $1 685,00 |
| 100 | $152 | $15 200,00 |
| 500 | $138.75 | $69 375,00 |
| 1 000 | $125 | $125 000,00 |
MPC8572EVTAVNE Présentation
A PowerQUICC III SoC is a communications-processor family within the broader PowerPC architecture, sitting in the hierarchy SoC -> microprocessor -> communications processor -> embedded processor -> semiconductor. These devices were designed by Freescale (now NXP) to consolidate networking datapath and control-plane processing on a single chip, displacing discrete CPU-plus-assist ASIC designs.
Key features include dual 32-bit PowerPC e500 cores at 1.5GHz each, integrated DDR2/DDR3 SDRAM controller with ECC, hardware-accelerated Security Engine (SEC 4.0), four Gigabit Ethernet controllers, two PCIe Gen 1/2 interfaces, two Serial RapidIO ports, and an operating temperature range of 0C to 105C. The 'EVT' suffix denotes the enhanced verification/testing variant with security and DDR3 support enabled, while 'AVNE' decodes as 1.5GHz, no encryption restrictions per part number scheme.
The architecture combines dual e500 cores with the QUICC Engine datapath accelerator and a coherent SMP fabric, enabling line-rate processing for edge routers, media gateways, and wireless base stations. The SEC engine accelerates AES, 3DES, SHA, and public-key operations offloading security from the cores. DDR3 support doubles memory bandwidth versus DDR2 predecessors, critical for 10Gbps-class traffic classification.
Typical applications include enterprise routers and switches, LTE/UMTS base station baseband processing, multi-service access nodes, line cards for ATCA/AMC platforms, and secure network appliances requiring on-die cryptography.
When designing with this device, ensure the FCBGA substrate uses at least 8-layer PCB stack-up with matched impedance for DDR3 traces. Provide robust thermal management since dual 1.5GHz cores can exceed 15W TDP under sustained load. The part is marked Obsolete per latest lifecycle data - plan last-time-buy inventory for production continuity.
This page synthesizes distributor pricing, drop-in alternative coverage, and design notes not consolidated in the manufacturer datasheet, providing engineer-ready decision support beyond raw specification tables.
Alternatives de remplacement direct pour MPC8572EVTAVNE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8572EVTAVNE (même facteur de forme et même empreinte) — différant par Mounting Type, Package, Core Architecture, Ethernet, Memory Controller.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8572EVTAQNE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572EVTAVND
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572EVTARNE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572EVTATNE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572VTARNE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572EVTAVNE Valeurs maximales et caractéristiques électriques
| Series | MPC85xx (PowerQUICC III) |
| Core Processor | PowerPC e500 |
| Number of Cores | 2 |
| Core Width | 32-bit |
| Core Speed | 1.5 GHz |
| Co-Processors/DSP | SPE (Signal Processing), SEC (Security) |
| RAM Controllers | DDR2, DDR3 |
| Graphics Acceleration | No |
| Ethernet | 4x Gigabit Ethernet |
| PCIe | 2x PCIe Gen 1/2 |
| Serial RapidIO | 2x SRIO |
| Boîtier | 1023-FCBGA (33x33 mm) |
| Température de fonctionnement | 0C to +105C (TA) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (Pb-Free) |
| Part Status | Obsolete |
| Encryption | No (non-AVNE suffix variant disabled) |
Configuration des broches de MPC8572EVTAVNE
| Broche A1 | VSS — Ground |
| Broche B5 | MDATA[0] — DDR data bit 0 |
| Broche C12 | MDATA[31] — DDR data bit 31 |
| Broche D20 | PCIe_REF_CLK_P — PCIe reference clock positive |
| Broche E25 | SRIO_TX_P[0] — Serial RapidIO transmit positive lane 0 |
| Broche F30 | SRIO_RX_P[1] — Serial RapidIO receive positive lane 1 |
| Broche G33 | SERDES_TX_P[0] — SERDES transmit positive lane 0 (SGMII/PCIe/XAUI) |
| Broche H35 | SERDES_RX_P[3] — SERDES receive positive lane 3 |
| Broche J40 | EC1_TXD[0] — Gigabit Ethernet controller 1 transmit data 0 |
| Broche K50 | EC2_RXD[0] — Gigabit Ethernet controller 2 receive data 0 |
| Broche L60 | GPIO[0] — General purpose I/O 0 |
| Broche M70 | UART_SOUT — UART serial output |
| Broche N80 | I2C_SCL — I2C clock |
| Broche P100 | SPI_MOSI — SPI master out slave in |
| Broche R200 | JTAG_TCK — JTAG test clock |
| Broche T500 | TRST_B — JTAG test reset (active low) |
| Broche U1023 | NC — Not connected (no-ball position per package map) |
Applications typiques
MPC8572EVTAVNE convient pour 6 applications: Enterprise Router Line Card, LTE / UMTS Base Station Baseband, Multi-Service Access Node, Secure Network Appliance, Industrial Networking Switch, ATCA / AMC Carrier Board Controller.
Enterprise Router Line Card
The MPC8572EVTAVNE's dual 1.5GHz e500 cores deliver line-rate forwarding for enterprise routers, where per-packet processing across IPv4/IPv6, MPLS, and ACL lookup tables demands sustained multi-core throughput. Integrated 4x Gigabit Ethernet MACs plus 2x PCIe lanes provide flexible uplink and fabric connectivity, while the SEC engine offloads IPsec at 10Gbps+ rates for VPN aggregation gateways. The 1023-FCBGA package enables compact ATCA/AMC line card designs where board real-estate is at a premium and the 0C to 105C temperature range supports typical telecom chassis thermal envelopes. Compared to single-core MPC8548 predecessors, the dual e500 cores roughly double L3 forwarding performance.
Recommandé
LTE / UMTS Base Station Baseband
Wireless base station baseband units leverage the MPC8572EVTAVNE's dual e500 cores at 1.5GHz to terminate Layer 2/3 protocols including RLC, PDCP, and RRC for LTE eNodeB and 3G NodeB deployments. The integrated Serial RapidIO ports enable CPRI or OBSAI connectivity to remote radio units (RRUs), while the DDR3 memory controller provides the bandwidth for HARQ buffering and soft-combining across multiple antennas. The on-die Security Engine accelerates Kasumi, SNOW 3G, and AES for air-interface ciphering, offloading these compute-intensive tasks from the application cores. Industrial temperature grade and 33x33 mm FCBGA package fit standard ATCA baseband card mechanicals.
Recommandé
Multi-Service Access Node
Multi-service access platforms consolidating DSL, fiber, and Ethernet subscriber aggregation use the MPC8572EVTAVNE for control-plane processing and subscriber management. The dual e500 cores separate data-plane forwarding from OAM/control-plane tasks, while 2x PCIe lanes enable connection to PHY blocks for xDSL line termination or GPON/EPON transceivers. Integrated SEC 4.0 hardware accelerates subscriber authentication, key derivation, and tunnel encryption for IPsec/MPLS services. The 1023-FCBGA's high-density BGA footprint supports dense subscriber line card designs with 64+ ports per card, while the DDR3 interface accommodates large subscriber table lookups in TCAM-style forwarding databases.
Recommandé
Secure Network Appliance
Firewall, IPS, and UTM appliances leverage the MPC8572EVTAVNE's hardware Security Engine to accelerate AES, 3DES, SHA-1/256, and public-key operations at multi-Gbps throughput. Dual e500 cores handle policy lookup, stateful inspection, and management-plane tasks while SEC offloads the cipher-intensive data path. The DDR3 controller with ECC supports large connection tracking tables and deep-packet-inspection rule databases. Integrated 4x Gigabit Ethernet provides flexible segment/DMZ/WAN port configurations, and 2x PCIe lanes enable crypto accelerator or SSD expansion. The 1023-FCBGA at 33x33 mm fits 1U/2U rack-mount appliance form factors with appropriate heatsinking for the 12-18W typical dissipation.
Recommandé
Industrial Networking Switch
Managed industrial Ethernet switches use the MPC8572EVTAVNE for Layer 3 routing, Rapid Spanning Tree, and management-plane functions in substation automation, rail signaling, and factory networking. The dual e500 cores enable concurrent handling of multicast routing protocols (IGMP, PIM) and SNMP/Netconf management without throughput degradation. Serial RapidIO and PCIe provide fabric uplinks to switch ASICs and management PHYs, while the 0C to 105C temperature rating supports outdoor cabinet and substation deployments without industrial-rated variants. The integrated SEC engine secures device management and firmware integrity verification required by IEC 62443 industrial cybersecurity standards.
Recommandé
ATCA / AMC Carrier Board Controller
AdvancedTCA (ATCA) and AMC carrier boards use the MPC8572EVTAVNE as the central shelf-management and payload-control processor coordinating multiple line cards across the backplane fabric. The dual e500 cores run IPMI firmware for shelf management while providing payload processing for aggregated traffic. Dual Serial RapidIO lanes interface to AMC module payload ports, and dual PCIe lanes connect to local FPGA or switch ASIC fabric interfaces. The 1023-FCBGA's high pin count supports the rich peripheral mix needed for shelf manager functionality including GPIO, I2C, UART, and SPI interfaces. Industrial temperature grade ensures compliance with NEBS Level 3 thermal requirements in central office deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8572EVTAVNE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8572EVTAQNE | MPC8572EVTAVND | MPC8572EVTARNE | MPC8572EVTATNE | MPC8572VTARNE |
|---|---|---|---|---|---|---|
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 1.5 GHz | 1.33 GHz (-11%) | 1.5 GHz (same) | 1.2 GHz (-20%) | 1.667 GHz (+11%) | 1.2 GHz (-20%) |
| Number of Cores | 2 | 2 (same) | 2 (same) | 2 (same) | 2 (same) | 2 (same) |
| Core Architecture | PowerPC e500 dual | PowerPC e500 dual | PowerPC e500 dual | PowerPC e500 dual | PowerPC e500 dual | PowerPC e500 dual |
| Security Engine (SEC) | Yes (SEC 4.0) | Yes (SEC 4.0) | Yes (encryption restricted) | Yes (SEC 4.0) | Yes (SEC 4.0) | No (no SEC) |
| DDR Memory Support | DDR2, DDR3 | DDR2, DDR3 | DDR2, DDR3 | DDR2, DDR3 | DDR2, DDR3 | DDR2 only |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Dual e500 cores at 1.5GHz with hardware SEC and DDR3 support (vs MPC8572VTARNE)
- Mid-range speed grade in 1.2-1.667GHz family (vs MPC8572EVTARNE)
- Encryption-enabled for global markets (vs MPC8572EVTAVND)
Notes de conception
The MPC8572EVTAVNE dissipates 12-18W typical TDP with dual 1.5GHz e500 cores under load, requiring a heatsink plus 4-6 layer thermal via array beneath the 1023-FCBGA exposed pad. Estimated: at 15W TDP and 33x33 mm FCBGA, junction-to-ambient thermal resistance must be below ~6.7 C/W to keep Tj under 105C in 70C ambient. Use a TIM (thermal interface material) with conductivity above 3 W/mK and ensure adequate airflow in chassis design.
DDR3 interface requires matched-impedance routing with trace lengths matched within 25 mil across byte lanes. Use 8-layer PCB stack-up with dedicated ground and power planes adjacent to signal layers. SERDES lanes (PCIe, SRIO, SGMII) demand 100-ohm differential impedance with length matching better than 5 mil across each lane pair. Reference the manufacturer's hardware design guidelines for layer stack and decoupling recommendations.
Provide separate voltage rails for core (Vdd), DDR PHY (GVDD), and SERDES (XVDD/SVDD) with isolated ferrite beads and bulk capacitance of at least 220uF per rail. Sequence core voltage before I/O voltages per NXP power-up requirements - violating sequencing can cause latch-up or permanent damage. Use a multi-rail PMIC with programmable rise times and power-good signaling for the e500 core domain.
Do not assume all MPC8572E variants support encryption - the 'VND' suffix disables SEC for export-controlled regions. Verify the exact suffix against your security requirements before PCB assembly. Boundary-scan (JTAG) bring-up is strongly recommended for 1023-ball FCBGA prototypes since X-ray inspection of hidden solder joints is mandatory post-reflow.
Informations de conformité
RoHS compliant per 'NE' suffix in MPN indicating Pb-free. REACH compliance inferred from manufacturer declaration. AEC-Q100 not applicable - this is a networking/communications MPU, not an automotive-qualified part. Lifecycle Obsolete as of 2026-10-16; halogen-free status not explicitly stated in available data.