MPC860PZQ66D4-FR - 66MHz PowerQUICC MPU, 357-PBGA | NXP
Référence : MPC860PZQ66D4-FR ⚠ Dernier achatMPC860PZQ66D4-FR Présentation
A PowerQUICC (pronounced "power-quick") is a family of integrated communications processors that fuses a PowerPC integer unit with a specialized RISC-based Communications Processor Module. This dual-engine architecture lets the CPM handle low-level serial framing, DMA, and protocol termination while the CPU runs the application and control plane. PowerQUICC devices belong to the broader category of embedded microprocessors (MPU), sitting above general microcontrollers (MCU) in integration level because they include dedicated communications peripherals, memory controllers, and external bus interfaces rather than relying solely on internal flash.
Key features of the MPC860PZQ66D4-FR include a 32-bit PowerPC core with separate instruction and data caches, four baud-rate generators, a 10/100 Mbps Fast Ethernet controller, support for up to eight SCC (Serial Communications Controller) channels, four SMC (Serial Management Controller) channels, an I2C controller, an SPI interface, a PCMCIA interface, and a 32-bit external bus interface. The CPM off-loads DMA and protocol handling from the CPU, freeing the core for routing, control, and management tasks.
Architecture depth: the MPC860 uses a 0.32 micron CMOS process and integrates an integer PowerPC unit with an embedded RISC controller inside the CPM. This dual-core topology delivers deterministic serial performance while keeping CPU load low - critical for router, bridge, and DSLAM designs where throughput and latency matter more than raw clock speed. The part supports both single- and multi-PHY Ethernet configurations through its Media Independent Interface.
Typical applications include ISDN router and remote access server designs, DSLAM line cards, Ethernet-to-Serial bridge gateways, industrial protocol converters, and legacy telecom equipment. The wide CPM peripheral set also suits SCADA concentrators, factory-floor protocol routers, and PBX interface cards. Designers usually pair the MPU with external SDRAM, Flash, and PHY devices.
When designing with this part, pay close attention to power sequencing: 3.3 V I/O must come up before or simultaneous with the 2.5 V core voltage, and the HRESET must remain asserted until both rails stabilize. PCB layout requires a minimum of 4 PCB layers with continuous ground and power planes directly under the PBGA to keep impedance-controlled traces for the address/data bus clean.
This page synthesizes distributor pricing, drop-in alternatives within the MPC860 family, and practical design considerations not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MPC860PZQ66D4-FR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
MPC860PZQ80D4-FR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC860PZQ50D4-FR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC860DPZQ66D4-FR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC860SRZQ66D4-FR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC860TCZQ66D4-FR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC860PZQ66D4-FR Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC MPC8xx |
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU |
| Core Architecture | PowerPC (CPU) + RISC (CPM) |
| Core Count | 1 Core (CPU) + CPM |
| Speed / Clock Frequency | 66 MHz |
| Operating Voltage | 3.3 V |
| Bus Width | 32-Bit |
| Process Technology | 0.32 micron CMOS |
| Boîtier / Format | 357-PBGA (25x25 mm) |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Contains Lead (FR suffix indicates Pb-free reflow-compatible finish) |
| Statut RoHS | RoHS (compliant per LCSC listing) |
| Lead Finish | Pb-free (FR suffix) |
| Integrated Communications | 10/100 Ethernet MAC, SCC, SMC, I2C, SPI, PCMCIA |
| Number of SCC | Up to 4 SCC channels |
| Number of SMC | Up to 2 SMC (per datasheet family) |
Guide de configuration des broches du MPC860PZQ66D4-FR 357-pbga (25x25 mm)
Configuration des broches du MPC860PZQ66D4-FR (boîtier 357-pbga (25x25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC860PZQ66D4-FR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC860PZQ66D4-FR convient pour 7 applications: ISDN Router and Remote Access Server, DSLAM Line Card Controller, Industrial Protocol Converter Gateway, Legacy Telecom PBX Interface Card, SCADA Concentrator / RTU, Embedded Network Bridge / Gateway, Industrial Ethernet Switch Controller.
ISDN Router and Remote Access Server
The MPC860PZQ66D4-FR is well suited to ISDN router and remote access server designs because its Communications Processor Module (CPM) off-loads serial framing, DMA, and protocol termination from the 66 MHz PowerPC core. The integrated SCC, SMC, and 10/100 Ethernet MAC let a single chip terminate up to four synchronous serial links while routing IP traffic at wire speed. With a 32-bit external bus and PCMCIA interface, designers can add WAN modems or ISDN transceivers directly to the MPU. Compared with discrete CPU-plus-ASIC solutions, the integrated CPM reduces BOM cost and frees the CPU for routing table management. The 357-PBGA package with 1.27 mm pitch supports multi-layer PCB stack-ups typical of enterprise router boards.
Recommandé
DSLAM Line Card Controller
The MPC860PZQ66D4-FR fits DSLAM line card designs where it concentrates traffic from many subscriber lines back to a central uplink. Its CPM off-loads ATM cell segmentation, HDLC framing, and DMA, leaving the PowerPC core free to handle PPPoE, IGMP, and QoS scheduling for hundreds of subscribers per card. The 66 MHz speed and dual Ethernet MAC option (DP variant) provide sufficient bandwidth aggregation headroom for ADSL2+ and VDSL2 line rates. PCMCIA and I2C interfaces let the MPU talk to line-driver DSPs and configuration EEPROM directly. The 3.3 V supply and integrated 2.5 V core regulator simplify power-tree design compared to discrete MPUs that require external DC-DC converters.
Recommandé
Industrial Protocol Converter Gateway
The MPC860PZQ66D4-FR powers industrial protocol converter gateways because its CPM exposes SCC, SMC, I2C, and SPI in a single chip, allowing simultaneous Modbus RTU, Profibus, CAN, and Ethernet connectivity. The 66 MHz PowerPC core runs the protocol translation stack, while the CPM handles real-time serial framing deterministically. With 32-bit external bus and SDRAM controller support, designers can include large routing tables for industrial networks of thousands of nodes. The wide operating temperature tolerance typical of PBGA packages suits factory-floor enclosures with ambient temperatures from 0 C to 70 C. RoHS-compliant FR lead finish meets modern industrial compliance requirements for new installations in EU jurisdictions.
Recommandé
Legacy Telecom PBX Interface Card
The MPC860PZQ66D4-FR is widely deployed in legacy PBX interface cards where T1/E1 trunk termination and ISDN PRI signaling require deterministic serial performance. The CPM integrates up to four SCC channels that map directly to T1/E1 framers via the Serial Interface (SI) module, eliminating the need for external protocol handling ASICs. At 66 MHz, the PowerPC core runs call-control stacks (H.248, MGCP) while the CPM handles time-division multiplexing with sub-microsecond jitter. The 357-PBGA package's excellent thermal performance suits the sealed enclosures typical of central-office equipment. Designers can extend product life by sourcing the part through authorized distributors such as Rochester Electronics while migrating new designs to PowerQUICC II.
Recommandé
SCADA Concentrator / RTU
The MPC860PZQ66D4-FR integrates well into SCADA concentrators and remote terminal units because its CPM handles many serial telemetry channels while the PowerPC core executes control logic. The integrated 10/100 Ethernet MAC simplifies uplink to the SCADA master station, and the SCC/SMC channels connect to field instrumentation via RS-232/485 transceivers. Operating from 3.3 V with internal core regulation, the part fits into low-power RTU designs that may run on solar or battery backup. The 357-PBGA package, while requiring a multi-layer PCB, supports the long-term reliability needs of unattended remote installations. RoHS compliance with the FR suffix helps meet IEC environmental directives for grid infrastructure.
Recommandé
Embedded Network Bridge / Gateway
The MPC860PZQ66D4-FR serves as the central MPU in embedded Ethernet-to-serial bridges because its CPM handles Ethernet MAC, SCC/SMC, and I2C/SPI in a single chip - reducing PCB area and BOM count. At 66 MHz, the PowerPC core runs bridging, filtering, and management protocols (SNMP, HTTP, Telnet) while the CPM moves packets between Ethernet and serial interfaces with minimal CPU intervention. The 32-bit external memory bus supports SDRAM for buffering, and PCMCIA supports compact storage for firmware upgrades. The 357-PBGA package offers excellent thermal characteristics for sealed industrial enclosures. NXP's strong third-party toolchain support (Linux, VxWorks, Green Hills) accelerates embedded software development.
Recommandé
Industrial Ethernet Switch Controller
The MPC860PZQ66D4-FR can drive managed industrial Ethernet switches because its CPM provides management-plane Ethernet plus serial console ports. The PowerPC core runs the switching control plane (CLI, SNMP, RSTP) while the 10/100 Ethernet MAC links to external PHY-managed switch ASICs via MII. At 66 MHz, the MPU handles thousands of MAC-address entries and VLAN configurations without CPU saturation. The wide peripheral set (I2C, SPI, SCC, SMC) lets a single chip monitor PoE controllers, fan speed, and temperature sensors alongside Ethernet management. RoHS-compliant FR lead finish supports deployment in modern industrial networks subject to IEC 61850 and similar grid-compliance standards.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC860PZQ66D4-FR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC860PZQ80D4-FR | MPC860PZQ50D4-FR | MPC860DPZQ66D4-FR | MPC860SRZQ66D4-FR | MPC860TCZQ66D4-FR |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Speed | 66 MHz | 80 MHz (+21%) | 50 MHz (-24%) | 66 MHz (same) | 66 MHz (same) | 66 MHz (same) |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Core Architecture | PowerPC CPU + RISC CPM | PowerPC CPU + RISC CPM | PowerPC CPU + RISC CPM | PowerPC CPU + RISC CPM | PowerPC CPU + RISC CPM | PowerPC CPU + RISC CPM |
| Ethernet MAC | 1 x 10/100 Fast Ethernet | 1 x 10/100 Fast Ethernet | 1 x 10/100 Fast Ethernet | 2 x 10/100 Fast Ethernet | 1 x 10/100 Fast Ethernet | 1 x 10/100 Fast Ethernet |
| SCC Channels | Up to 4 | Up to 4 | Up to 4 | Up to 4 | Reduced count | Up to 4 + FCC support |
| RoHS / Lead Finish | RoHS / FR (Pb-free) | RoHS / FR (Pb-free) | RoHS / FR (Pb-free) | RoHS / FR (Pb-free) | RoHS / FR (Pb-free) | RoHS / FR (Pb-free) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principaux différenciateurs
- Last production member of the PowerQUICC I family at 66 MHz with full feature set (vs MPC860PZQ80D4-FR)
- Single Ethernet MAC configuration (vs dual-MAC DP variant) (vs MPC860DPZQ66D4-FR)
- Standard feature set (SR variant has reduced SCC channels) (vs MPC860SRZQ66D4-FR)
- FR (Pb-free reflow-compatible) lead finish (vs MPC860PZQ66D4 (non-FR))
Notes de conception
Power sequencing is critical for the MPC860PZQ66D4-FR: the 3.3 V I/O rail must reach 90% of nominal before or simultaneously with the internal 2.5 V core voltage. Both rails must be stable before HRESET is de-asserted. Use a power-good supervisor IC (e.g., TPS3808) to gate HRESET to prevent PLL mis-lock. Adding 10 uF bulk + 0.1 uF ceramic decoupling per power pin cluster reduces switching transients on the CPM clocks.
The 357-PBGA at 1.27 mm pitch demands a minimum 4-layer stack-up with continuous ground and power planes directly under the BGA. Use micro-via-in-pad (0.2 mm via diameter with 0.4 mm pad) for inner-row BGA balls when routing the 32-bit external data bus. Match trace lengths within 100 mils across the address/data bus to preserve timing margins. Decoupling: 0.1 uF X7R ceramic per power pin pair, plus 10 uF bulk on each supply rail within 1 cm of the package edge.
Estimated: at 3.3 V supply with full CPM activity, the MPC860PZQ66D4-FR dissipates approximately 1.5-2 W typical and 2.5 W peak. The 357-PBGA package theta_JA is approximately 20 C/W in still air, yielding a 50 C junction temperature rise at 2.5 W dissipation. Provide at least 10 cm^2 of unbroken copper pour on the top layer connected to GND balls to keep junction temperatures below 110 C. Forced-air cooling is recommended for sealed industrial enclosures where ambient exceeds 50 C.
Do not confuse the -FR suffix with "lead-free" in the traditional sense - the FR designation specifically means "Pb-free reflow-compatible finish," indicating the BGA solder balls use SAC alloy instead of SnPb. Both the FR and non-FR variants are functionally identical. Avoid confusing MPC860PZQ66D4-FR with the MPC860DT (dual Ethernet) or MPC860SR (reduced feature) variants - these are pin-compatible but have different CPM configuration registers. Validate firmware against the correct reference manual before drop-in substitution.
Route the MII Ethernet signals (RX/TX clocks, data, control) as 50-ohm impedance-controlled differential pairs on the top microstrip layer, keeping total length under 50 mm to meet IEEE 802.3 timing. The SCC serial clocks should be length-matched to within 25 mils across all channels to prevent frame-synchronization skew. Keep the 66 MHz CPU clock trace short (under 25 mm) and shield it with ground vias on both sides to suppress radiated EMI that could disturb Ethernet PHY operation.
Informations de conformité
RoHS compliant per LCSC and NXP product listings. FR suffix denotes Pb-free reflow-compatible lead finish (SAC alloy BGA balls). Not AEC-Q100 qualified (industrial/telecom MPU, not automotive). REACH compliance not explicitly stated in the verified web data.
