MPC862TCVR80B - 80MHz PowerQUICC MPC8xx MPU, 357-PBGA | NXP
Référence : MPC862TCVR80B ✗ Fin de vieMPC862TCVR80B Présentation
An MPU (Microprocessor Unit) of the PowerQUICC MPC8xx class is an integrated communications processor that combines a PowerPC execution core with on-chip peripherals optimized for WAN, LAN, and telecom I/O. In the broader taxonomy, the MPC862TCVR80B is a microprocessor -> CPU/MPU -> integrated communications processor -> embedded MPU -> semiconductor. This architecture family was widely deployed in legacy routers, switches, and industrial control boards in the late 1990s and 2000s.
Key features include a 32-bit PowerPC core at 80 MHz, an on-chip CPM supporting serial channels, ATM, Fast Ethernet, and HDLC/PPP protocols, plus memory controllers for SDRAM, DRAM, and burst-mode flash/ROM. The 357-PBGA package provides a robust thermal path for sustained industrial workloads. The device targets -40C to +95C ambient (industrial) operating ranges per the family documentation.
Typical applications for the MPC862TCVR80B include legacy enterprise networking equipment, ISDN/ADSL modem gateways, industrial serial routers, and long-lifecycle embedded control systems. Its integration of CPU and CPM reduces BOM count versus a discrete CPU + companion communications ASIC. Designers moving to RoHS-compliant revisions can use this part as a drop-in upgrade path on existing PBGA footprints.
Designers should verify the specific datasheet revision before PCB layout because BGA ball assignments are exact and any pin-map error requires board rework. Use the 357-PBGA land pattern exactly as specified in the manufacturer mechanical drawing, and follow the power-decoupling guidance for the VDDHV/VCC pins. Engineers considering migration should review the broader PowerQUICC III (MPC83xx) family for forward-compatible designs.
This page consolidates verified distributor pricing, lifecycle status, pin-compatible alternatives in the same 357-PBGA footprint, and practical design considerations that are not surfaced on a single distributor listing.
Alternatives de remplacement direct pour MPC862TCVR80B — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC862TCVR80B (même facteur de forme et même empreinte) — différant par Core Architecture, Package / Case, Processor Type.
MPC860PVR80D4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC860DTZQ80D4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC866PCVR100A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC862TCVR66B
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC862PVR80B
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →MPC862TCVR80B Valeurs maximales et caractéristiques électriques
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU |
| Core Architecture | PowerPC (MPC8xx family) |
| Core Clock Speed | 80 MHz |
| Tension d'alimentation | 3.3 V |
| Number of Cores | 1 |
| Bit Width | 32-bit |
| On-chip Communications Module (CPM) | Yes (RISC-based, for networking/serial) |
| Boîtier / Format | 357-PBGA (25 x 25 mm) |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| Statut RoHS | RoHS Compliant |
| Process Node | 0.32 um |
| Manufacturer | NXP USA Inc. (formerly Motorola/Freescale) |
Guide de configuration des broches du MPC862TCVR80B 357-pbga (25 x 25 mm)
Configuration des broches du MPC862TCVR80B (boîtier 357-pbga (25 x 25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC862TCVR80B.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC862TCVR80B convient pour 6 applications: Legacy Enterprise Routers, ISDN / DSL Modem Gateways, Industrial Serial Communication Controllers, Embedded Linux Networking Appliances, Telecom Line Cards and Access Multiplexers, Long-Lifecycle Avionics and Defense Sub-Systems.
Legacy Enterprise Routers
The MPC862TCVR80B's integrated Communications Processor Module (CPM) and 80 MHz PowerPC core make it well-suited for legacy enterprise routers handling Fast Ethernet, HDLC, and PPP traffic. Its 357-PBGA package allows compact board layouts while sustaining industrial temperature operation. The on-chip CPM offloads serial-channel processing from the core, freeing CPU cycles for routing-table lookups and protocol stacks in low- to mid-density WAN edge deployments.
Recommandé
ISDN / DSL Modem Gateways
The MPC862TCVR80B's CPM supports multiple HDLC/PPP channels and ATM segmentation, which historically powered integrated ISDN and DSL gateway designs. At 80 MHz with a 32-bit core, it can manage both the WAN-side protocol termination and the local Ethernet/IP routing in a single chip. The 357-PBGA package integrates well into compact gateway enclosures and the 3.3 V supply simplifies power-tree design alongside DSL line-driver ASICs.
Recommandé
Industrial Serial Communication Controllers
Industrial serial controllers benefit from the MPC862TCVR80B's multi-channel CPM, which can manage many UART/SCC channels simultaneously for protocol bridging, Modbus aggregation, and fieldbus gateway duties. The 80 MHz core handles local control logic while the CPM handles real-time serial I/O. Operating from 3.3 V and housed in a robust 357-PBGA package, the part fits legacy industrial control boards where long-term availability is essential.
Recommandé
Embedded Linux Networking Appliances
Running embedded Linux, the MPC862TCVR80B provides a stable, long-lifecycle 32-bit PowerPC platform with 80 MHz performance suitable for small firewalls, VPN terminators, and protocol-converter appliances. Its on-chip memory controller supports SDRAM and burst flash, allowing a full Linux system in a small footprint. Engineers maintain designs on this part because of the mature GCC and U-Boot toolchain support for the PowerQUICC architecture.
Recommandé
Telecom Line Cards and Access Multiplexers
In telecom line-card designs, the MPC862TCVR80B's CPM provides TDM/framer glue logic and multi-channel HDLC for legacy access multiplexers. Its 357-PBGA package delivers the thermal and electrical integrity required for densely populated line-card PCBs. The 80 MHz core handles supervisory control while the CPM handles per-channel serial processing, reducing the need for additional framer ASICs in compact access platforms.
Recommandé
Long-Lifecycle Avionics and Defense Sub-Systems
Avionics and defense sub-systems with multi-decade support obligations often standardize on PowerQUICC MPC8xx parts because of their mature firmware base and long-term distributor support. The MPC862TCVR80B's 357-PBGA package, 3.3 V supply, and 80 MHz core are well documented for DO-254/DO-178 evidence packages. Its integration reduces board-level component count, which simplifies reliability analysis and obsolescence management over program lifecycles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC862TCVR80B — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC860PVR80D4 | MPC860DTZQ80D4 | MPC866PCVR100A | MPC862TCVR66B | MPC862PVR80B |
|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Speed | 80 MHz | 80 MHz | 80 MHz | 100 MHz | 66 MHz | 80 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Core Architecture | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx |
| CPM Channels / Protocol Support | Full CPM (multi-channel HDLC, ATM, Ethernet) | Reduced CPM (fewer channels) | Minimum CPM configuration | Enhanced CPM with Fast Ethernet | Full CPM (same as target) | Full CPM (minor revision) |
| RoHS / Lead-Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free |
Principaux différenciateurs
- Full CPM feature set versus reduced MPC860 variants (vs MPC860DTZQ80D4)
- Higher core clock than the 66 MHz MPC862TCVR66B (vs MPC862TCVR66B)
- RoHS-compliant and lead-free versus legacy Motorola-marked stock (vs Legacy Motorola-branded MPC862 stock)
Notes de conception
The 357-PBGA package requires exact adherence to the NXP mechanical drawing for land pattern, pad diameter, and solder-mask definition. Use NSMD (non-solder-mask-defined) pads with the manufacturer-recommended pitch. Place at least 4 via-in-pad or via-tented thermal vias under the central ball matrix to dissipate the ~3.3 V core power dissipation. Run high-speed signal traces on inner layers with reference planes to control impedance and EMI.
Provide separate decoupling for the core VDD and the I/O VCC rails. Place 0.1 uF and 10 uF ceramic capacitors as close as possible to each power pin group. Estimated: at 80 MHz with typical CPM utilization, expect ~1.5-2 W core power dissipation; size the regulator with at least 25% headroom. Use a bulk tantalum or polymer cap on the 3.3 V rail to handle CPM burst loads.
Do not assume a generic 357-ball BGA footprint will match the MPC862TCVR80B ball map - the ball assignments are part-specific to the MPC8xx PowerQUICC family. Verify the JTAG pinout (TCK/TMS/TDO/TDI/TRST) against the datasheet before board bring-up. Also confirm reset polarity and configuration word source - mistakes here are a common cause of first-article board failures.
Estimated: the 357-PBGA package has theta_JA in the range of 15-20 C/W on a standard 4-layer JEDEC test board, allowing roughly 5 W dissipation at 85 C ambient. For industrial enclosures with limited airflow, add a top-side heatsink or thermal pad. Always confirm with the manufacturer's thermal model for the actual mounting and board stack-up.
Informations de conformité
RoHS compliant and lead-free per NXP product page and DigiKey catalog entries (2026-10-17). AEC-Q100 not applicable - this is an industrial/networking MPU, not an automotive-grade part. REACH status inferred compliant per EU distributor listings; specific declaration not verified in the provided data.