MPC8241LVR266D - PowerPC 603e MPU, 266MHz, 357-BGA | NXP
Référence : MPC8241LVR266D ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $35.5 | $35,50 |
| 10 | $32 | $320,00 |
| 100 | $28.5 | $2 850,00 |
| 500 | $25 | $12 500,00 |
| 1 000 | $22 | $22 000,00 |
MPC8241LVR266D Présentation
An integrated host processor is a category of embedded MPU that combines a CPU core, memory controller, and peripheral bridges on a single die, reducing chip count and board complexity. The MPC8241 fits in the taxonomy: PowerPC 603e core -> PowerQUICC II family -> integrated host processor -> embedded microprocessor -> MPU. By collapsing five discrete chips into one, it is engineered for cost-sensitive, power-sensitive embedded designs that still require a 32-bit processor.
Key features include 266MHz core frequency, integrated SDRAM controller with ECC support, PCI 2.1 host bridge at up to 66MHz, dual UART, I2C, and general-purpose timers. The 603e core delivers approximately 388 MIPS at 266MHz and supports both user and supervisor modes. The 357-PBGA package provides robust thermal performance for industrial environments and supports JTAG boundary-scan for manufacturing test.
Typical applications include telecom line cards, network routers, industrial control, RAID storage controllers, and embedded PCI-based designs. The integrated PCI bridge makes the MPC8241 particularly attractive for legacy designs requiring 32-bit processing with peripheral expansion, where designers want to consolidate ASICs and bridges into a single host processor. The device also includes dedicated power-management modes to minimize idle power in always-on systems.
When designing with the MPC8241LVR266D, ensure the 3.3V supply is well-decoupled with bulk and high-frequency ceramic capacitors close to each power pin. JTAG signals must be brought out to a header for debug and boundary-scan. The PCI bus segment length should follow standard PCI routing guidelines to avoid signal-integrity issues at 66MHz operation.
Alternatives de remplacement direct pour MPC8241LVR266D — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8241LVR266D (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, PCI Interface, Process Technology, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8241LZQ266D
✅ Remplacement direct✓ En stock
$64.8 / unité
Voir la fiche technique →KMPC8241LVR266D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8241LVR266D-FR
✅ Remplacement direct✓ En stock
$53.1 / unité
Voir la fiche technique →MPC8245ARZU400D
✅ Remplacement direct✓ En stock
$119.95 / unité
Voir la fiche technique →MPC8250AZUPIBC
✅ Remplacement direct✓ En stock
$110.25 / unité
Voir la fiche technique →MPC8241LVR266D Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Status | Obsolete (End of Life) |
| Core Processor | PowerPC 603e |
| Series | PowerQUICC II (MPC82xx) |
| Number of Cores | 1 |
| Bus Width | 32-Bit |
| Clock Speed | 266 MHz |
| Process Technology | 0.25 micron |
| Tension d'alimentation | 3.3 V |
| Boîtier | 357-PBGA (25 x 25 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0°C to +105°C |
| Memory Controller | SDRAM with ECC |
| PCI Interface | PCI 2.1, up to 66 MHz |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Tray Quantity | Per datasheet packaging info |
| Statut RoHS | Refer to NXP product page (likely non-RoHS given vintage 2005) |
Guide de configuration des broches du MPC8241LVR266D 357-pbga (25 x 25 mm)
Configuration des broches du MPC8241LVR266D (boîtier 357-pbga (25 x 25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8241LVR266D.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8241LVR266D convient pour 6 applications: Telecom Line Cards, Embedded PCI Bridge Designs, RAID Storage Controllers, Industrial Control Systems, Network Routers and Switches, Legacy PCI-Based Embedded Boards.
Telecom Line Cards
The MPC8241LVR266D's 266MHz PowerPC 603e core, integrated PCI 2.1 bridge at 66MHz, and on-chip SDRAM controller with ECC make it well-suited for telecom line card designs that require deterministic 32-bit processing in a single-chip host. Placed as the central host processor on a line card, it manages control-plane traffic, HDLC channels, and DMA streams to a framer or network processor without needing an external bridge ASIC. Compared to discrete CPU-plus-chipset designs, the integrated host collapses five chips into one, reducing board area and power; against newer QorIQ parts, the MPC8241 remains attractive for cost-sensitive legacy platforms with established firmware.
Recommandé
Embedded PCI Bridge Designs
With an integrated PCI 2.1 interface supporting up to 66MHz, the MPC8241LVR266D is a natural fit for embedded systems that need a 32-bit host processor plus PCI expansion without a discrete bridge. The host CPU enumerates PCI devices, configures BARs, and runs firmware directly, eliminating a separate south-bridge chip. Its 357-PBGA footprint keeps routing tight for compact PCI mezzanine cards and PMC modules. Compared with newer QorIQ devices that expose PCIe, the MPC8241's classic PCI bus is preferred for legacy peripherals, while delivering more compute than smaller microcontrollers in the same bill of materials.
Recommandé
RAID Storage Controllers
The MPC8241LVR266D's integrated SDRAM controller (with ECC) plus PCI host bridge suits RAID controller cards where the host CPU drives DMA engines, XOR/RAID accelerators, and disk channels. At 266MHz it delivers enough headroom to manage multiple SATA/SCSI channels while running the controller firmware stack. The 357-BGA package keeps the chip footprint manageable on standard RAID card PCBs, and the 603e's deterministic interrupt latency benefits command-queue scheduling. Against larger PowerQUICC III controllers, the MPC8241 fits entry-level and mid-range RAID where cost and power trump raw throughput.
Recommandé
Industrial Control Systems
For industrial automation controllers, the MPC8241LVR266D combines a 32-bit PowerPC core, PCI expansion, and a wide operating temperature range (0°C to +105°C for the LV industrial grade), enabling deployment in factory-floor equipment. Its 603e core handles deterministic control loops, while the integrated PCI bus accepts motion-control or I/O mezzanines. The 357-PBGA package is ruggedized for vibration-prone industrial enclosures. Compared with microcontroller-only solutions, the MPC8241's higher compute and PCI integration suit complex PLCs and machine controllers; against modern Cortex-A designs, it remains in service for long-lifecycle factory installations.
Recommandé
Network Routers and Switches
The MPC8241LVR266D's combination of a 266MHz PowerPC 603e core, PCI bridge, and SDRAM controller makes it a viable control-plane processor for small-to-medium enterprise routers and managed switches. The host CPU runs routing stacks, manages switch ASIC configuration, and processes management-plane traffic via PCI-attached PHYs. ECC SDRAM support protects route tables against soft errors in always-on equipment. Against larger QorIQ or Layerscape communications processors, the MPC8241 fits cost-optimized branch-office and SMB gear where modest throughput and proven firmware ecosystems outweigh raw packet-rate.
Recommandé
Legacy PCI-Based Embedded Boards
The MPC8241LVR266D remains a strong fit for legacy PCI-based single-board computers and PMC cards that need a 32-bit host without redesign. Its 357-PBGA package is footprint-compatible across the MPC8241 family, enabling field upgrades to higher-speed variants like the MPC8245ARZU400D without board rework. The integrated SDRAM and PCI controllers simplify SBC BOMs, and JTAG support eases board bring-up and boundary-scan manufacturing test. Against modern SoCs that have dropped legacy PCI, the MPC8241 preserves investment in installed PCI peripherals and firmware while delivering a stable, well-documented platform.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8241LVR266D — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8241LZQ266D | KMPC8241LVR266D | MPC8241LVR266D-FR | MPC8245ARZU400D | MPC8250AZUPIBC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Processor | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC G2 |
| Clock Speed | 266 MHz | 266 MHz | 266 MHz | 266 MHz | 400 MHz | 300 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C |
| PCI Interface | PCI 2.1 up to 66 MHz | PCI 2.1 up to 66 MHz | PCI 2.1 up to 66 MHz | PCI 2.1 up to 66 MHz | PCI 2.1 up to 66 MHz | PCI 2.1 up to 66 MHz |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
Principaux différenciateurs
- Pin-compatible upgrade path within PowerQUICC II family (vs MPC8245ARZU400D)
- Identical die, traceability-coded variant for factory sourcing (vs MPC8241LVR266D-FR)
- Functional equivalent for legacy rebuild programs (vs KMPC8241LVR266D)
Notes de conception
The MPC8241LVR266D requires a clean 3.3V core supply; place bulk tantalum or polymer capacitors near the BGA power pins and add 0.1uF ceramic decoupling caps within 5mm of each supply ball. According to NXP PowerQUICC II design guides, multi-layer ceramic placement is critical because the 357-BGA's inductance is non-trivial. Power sequencing between core and PLL supply rails must follow the datasheet timing diagram to avoid latch-up. Estimated: at 266MHz with full PCI traffic, the device draws roughly 1-2W depending on I/O toggling; budget 2.5W headroom for worst-case thermal design.
Route the 32-bit address/data bus with matched lengths and 50-ohm controlled impedance on the top or inner microstrip/stripline layers. According to PCI 2.1 layout guidelines, the PCI bus segment must be kept under the maximum trace length and stub rules; for 66MHz operation, length matching within 150 mils across the bus is recommended. The 357-BGA requires microvia or via-in-pad technology for fan-out; standard through-vias under the BGA can break out only with careful dog-bone fan-out and at least 4 routing layers.
The 357-PBGA package at 25x25mm provides adequate thermal spreading, but at 266MHz with high PCI bus utilization the junction can approach 100°C in sealed enclosures. According to NXP PowerQUICC II thermal models, theta_JA for the 357-BGA is roughly 25-30°C/W with a standard JEDEC 4-layer test board; design for at least 2oz copper on inner/outer layers or use thermal vias under the central power balls. In industrial environments at 105°C ambient, derate clock frequency or improve heatsinking.
Do not confuse the LV (industrial temperature) grade with LZQ (different window/qualification) when ordering substitutes; verify the exact suffix against NXP's ordering information. Because the part is obsolete, counterfeit risk is elevated - always source from authorized distributors and require date code, lot traceability, and (ideally) X-ray or decapsulation inspection for high-reliability applications. Also ensure JTAG TRST is properly pulled per IEEE 1149.1 to enable boundary-scan; a floating TRST can cause intermittent test failures in production.
Informations de conformité
Part is obsolete (EOL). Original 2005-vintage PowerQUICC II datasheet may pre-date full RoHS documentation. Refer to NXP product page and PCN documents for definitive compliance status; contact NXP for material declaration if required for new designs.
