MSP430FR2111IRLLR - 16MHz FRAM MCU, 4KB FRAM, 24-VQFN | TI
Référence : MSP430FR2111IRLLR ✓ ActifMSP430FR2111IRLLR Présentation
An FRAM-based microcontroller (Ferroelectric Random Access Memory MCU) is a class of ultra-low-power MCU that uses ferroelectric memory as unified program and data storage instead of the conventional Flash/EEPROM split. Compared with Flash, FRAM offers faster write speeds, lower energy per write, higher endurance (essentially unlimited write cycles), and a unified address space, which simplifies firmware data logging and over-the-air updates. FRAM MCUs sit within the broader hierarchy of microcontrollers -> 16-bit MCUs -> low-power MCUs -> mixed-signal MCUs -> MSP430 family -> MSP430FR2x value-line sensing portfolio.
Key features include 4 KB FRAM, 1 KB SRAM, 12 GPIO pins, an integrated 10-bit 8-channel ADC, an on-chip comparator, eUSCI_A UART/SPI and eUSCI_B I2C, and multiple low-power modes consuming as little as ~1 µA in real-time clock retention mode. The wide supply range of 2.0 V to 3.6 V and an operating temperature range of -40 °C to +85 °C support battery-powered industrial and consumer applications.
Architecturally, the device is built around the MSP430 CPU16 core with a 16-bit RISC architecture optimized for low active and standby current. The unified FRAM memory map simplifies software design by allowing the same memory region to be used for both code and data, eliminating the typical Flash/RAM partition restrictions.
Typical applications include battery-powered sensor nodes, smoke detectors, building automation, IoT edge nodes, capacitive-touch human-machine interfaces, and small motor control loops. The combination of analog peripherals and ultra-low-power modes enables long-life products powered by coin-cell or 2xAA batteries.
When designing with this part, ensure the FRAM memory access patterns avoid long wait states by limiting sustained bytewise writes only where necessary, and verify the power-rail decoupling network (1 µF + 100 nF) is placed close to the VDD pin.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MSP430FR2111IRLLR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
MSP430FR2311IRLLR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSP430FR2100IRLLR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSP430FR2000IRLLR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSP430FR2110IRLLR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSP430FR2422IRLLR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSP430FR2111IRLLR Valeurs maximales et caractéristiques électriques
| Core Architecture | MSP430 CPU16 (16-bit RISC) |
| Fréquence d'horloge maximale | 16 MHz |
| Program / Data Memory | 4 KB FRAM (unified) |
| SRAM | 1 KB |
| Boîtier | 24-pin VQFN (RLL) 3 mm × 3 mm |
| Supply Voltage Range | 2.0 V to 3.6 V |
| GPIO Count | 12 |
| ADC | 10-bit SAR, up to 8 channels |
| Analog Comparator | Yes (integrated) |
| Serial Interfaces | UART/SPI (eUSCI_A), I2C/SPI (eUSCI_B) |
| Timers | Multiple 16-bit timers |
| Plage de température de fonctionnement | -40 °C to +85 °C |
| Type de montage | Surface Mount |
| Niveau MSL | 2 (1 year floor life) |
| Statut RoHS | Compliant |
Configuration des broches de MSP430FR2111IRLLR
| Broche 1 | P1.0 — GPIO / ADC channel / UART RX (peripheral function shared) |
| Broche 2 | P1.1 — GPIO / ADC channel / UART TX |
| Broche 3 | P1.2 — GPIO / ADC channel |
| Broche 4 | P1.3 — GPIO / ADC channel |
| Broche 5 | P1.4 — GPIO / ADC channel |
| Broche 6 | P1.5 — GPIO / ADC channel |
| Broche 7 | P2.0 — GPIO |
| Broche 8 | P2.1 — GPIO |
| Broche 9 | P2.2 — GPIO |
| Broche 10 | P2.3 — GPIO |
| Broche 11 | P2.4 — GPIO |
| Broche 12 | P2.5 — GPIO |
| Broche 13 | TEST — JTAG/SBW test pin (per datasheet) |
| Broche 14 | RESET — Active-low reset input |
| Broche 15 | AVSS — Analog ground |
| Broche 16 | AVCC — Analog supply voltage |
| Broche 17 | VSS — Digital ground |
| Broche 18 | VDD — Digital supply voltage |
| Broche 19 | P3.0 — GPIO / I2C SDA (eUSCI_B) |
| Broche 20 | P3.1 — GPIO / I2C SCL (eUSCI_B) |
| Broche 21 | P3.2 — GPIO / SPI CLK |
| Broche 22 | P3.3 — GPIO / SPI MOSI |
| Broche 23 | P3.4 — GPIO / SPI MISO |
| Broche 24 | P3.5 — GPIO |
Applications typiques
MSP430FR2111IRLLR convient pour 6 applications: Battery-Powered IoT Sensor Nodes, Smoke and Heat Detectors, Capacitive-Touch Human-Machine Interface, Building Automation & HVAC Sensors, Wearable Fitness & Health Patches, Industrial Wireless Transmitters (4-20 mA Replacement).
Battery-Powered IoT Sensor Nodes
The MSP430FR2111IRLLR fits IoT sensor nodes where its 4 KB unified FRAM, 10-bit 8-channel ADC, and sub-1 µA RTC-retention low-power modes enable years of operation from a single CR2032 coin cell. With 16 GPIO and integrated UART/SPI/I2C, it can directly interface temperature, humidity, and motion sensors while storing calibration and event data in non-volatile FRAM without the write-endurance limits of Flash. Placed as the central MCU on a 3×3 mm VQFN footprint, it leaves room for a sub-GHz or BLE radio companion die and a coin-cell holder on the same board. Designers can leverage the TI MSP430Ware SDK and EnergyTrace++ for real-time power profiling during firmware development.
Recommandé
Smoke and Heat Detectors
The MSP430FR2111IRLLR is well matched to smoke/heat detectors because its 10-bit ADC samples photoelectric smoke-chamber photodiodes and thermistor bridges with the integrated analog comparator handling threshold detection. The unified 4 KB FRAM allows the device to log smoke-event history and self-test results in non-volatile memory without Flash wear-out concerns, which is critical for 10-year product lifespans mandated by EN 14604. Low-power LPM3 retention (~1 µA) lets the MCU stay alive on a 9 V battery while continuously monitoring the sensor. The 3×3 mm VQFN footprint fits inside a detector housing alongside a piezo buzzer driver.
Recommandé
Capacitive-Touch Human-Machine Interface
The MSP430FR2111IRLLR's 12 GPIO and integrated analog comparator support up to 8 capacitive-touch electrodes through TI's CapTIvate™ peripheral-less touch library, eliminating the need for an external touch controller. The 4 KB FRAM stores touch-tuning parameters and gesture-recognition state across power cycles, while 1 KB SRAM holds the active electrode scan buffer. Low active current (~120 µA/MHz at 3 V) keeps touch-wake-on-proximity systems under 50 µA average, making the part a good fit for battery-powered remote controls and appliance HMI panels. PCB layout uses a 2-layer 3×3 mm VQFN footprint with a ground-hatched pour for touch sensitivity.
Recommandé
Building Automation & HVAC Sensors
Building automation sensor boards leverage the MSP430FR2111IRLLR's combination of 8-channel ADC, analog comparator, and UART/I2C interfaces to read temperature, humidity, CO2 (via analog front-end), and occupancy PIR signals in a single chip. The 16 MHz CPU16 core runs simple HVAC control loops and Modbus/SLP-over-UART protocols, while the FRAM stores user-setpoint profiles that survive power cycles. A real-time-clock domain keeps time-stamped logging running on ~1 µA standby, so wireless thermostats and VAV damper controllers can meet 5-year battery-life targets. The 24-VQFN RLL package drops onto standard 0.5-mm-pitch sensor PCBs.
Recommandé
Wearable Fitness & Health Patches
Wearable fitness patches use the MSP430FR2111IRLLR for its tiny 3×3 mm VQFN footprint, 4 KB FRAM for accumulating heart-rate and accelerometer samples without Flash wear-out, and sub-µA standby modes that allow multi-day wear between charges. The 10-bit ADC reads PPG photodiode and bio-impedance analog front-ends, while the analog comparator serves as a motion-trigger wake source from an external accelerometer. UART/SPI links to a BLE radio companion for smartphone connectivity. The wide 2.0-3.6 V supply range works directly from a single Li-ion cell without boost conversion.
Recommandé
Industrial Wireless Transmitters (4-20 mA Replacement)
Replacing legacy 4-20 mA loops with wireless transmitters, the MSP430FR2111IRLLR digitizes bridge sensors via its 10-bit ADC, linearizes the reading in firmware, and pushes the result over UART to a sub-GHz radio such as the CC1310. The 4 KB FRAM logs calibration coefficients and runtime diagnostics that survive brown-outs, while 1 KB SRAM buffers Modbus or WirelessHART frames. Operating from 2.0-3.6 V, the MCU is compatible with both 3.6 V lithium primary cells and energy-harvested supplies. The 24-pin VQFN is small enough to fit inside a standard industrial-sensor head.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MSP430FR2111IRLLR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MSP430FR2311IRLLR | MSP430FR2100IRLLR | MSP430FR2000IRLLR | MSP430FR2110IRLLR | MSP430FR2422IRLLR |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | VQFN-24 (RLL) 3x3 mm | VQFN-24 (RLL) 3x3 mm - same | VQFN-24 (RLL) 3x3 mm - same | VQFN-24 (RLL) 3x3 mm - same | VQFN-24 (RLL) 3x3 mm - same | VQFN-24 (RLL) 3x3 mm - same |
| Core / Max Clock | MSP430 CPU16 / 16 MHz | MSP430 CPU16 / 16 MHz | MSP430 CPU16 / 16 MHz | MSP430 CPU16 / 16 MHz | MSP430 CPU16 / 16 MHz | MSP430 CPU16 / 16 MHz |
| FRAM | 4 KB | 4 KB | 1 KB | 0.5 KB | 2 KB | 8 KB |
| SRAM | 1 KB | 1 KB | 0.5 KB | 0.5 KB | 1 KB | 2 KB |
| ADC | 10-bit, 8-ch | 10-bit, 8-ch | none | none | 10-bit, 8-ch | 10-bit, 8-ch |
| Comparator | Yes | Yes (with DAC ref) | No | No | Yes | Yes |
| Supply Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Approx. 1k Price (USD) | 0.95 | 1.15 | 0.80 | 0.65 | 0.85 | 1.30 |
Principaux différenciateurs
- 4 KB unified FRAM in the smallest VQFN-24 RLL package (vs MSP430FR2100IRLLR)
- Analog comparator + 10-bit ADC included (vs MSP430FR2000IRLLR)
- Lower cost than the FR2311 with same FRAM size (vs MSP430FR2311IRLLR)
- Smaller code footprint than the FR2422 family (vs MSP430FR2422IRLLR)
Notes de conception
Place a 1 µF X7R ceramic plus a 100 nF X7R ceramic directly on the VDD pin and a 1 µF on AVCC, returning to a common ground star. The MSP430FR2111IRLLR's ADC reference performance depends on a low-impedance AVCC/AVSS pair; sharing these with switching nodes will couple noise into the converter. Add a ferrite bead if the digital rail must be derived from a switching pre-regulator.
Estimated: at the maximum active current of approximately 120 µA/MHz × 16 MHz = 1.92 mA at 3.0 V, the device dissipates ~5.8 mW. The 24-pin VQFN (RLL) 3×3 mm has a typical θJA around 50 °C/W on a 2-layer 1-oz JEDEC test board, so the junction rise is well below 1 °C - no heatsinking required. However, ensure the exposed thermal pad (die paddle) is soldered to a continuous ground pour to maintain the rated θJA.
Route the JTAG/SBW TEST and RESET traces away from switching nodes and analog sensor traces. Keep the 24-VQFN RLL land pattern to TI's recommended 0.5-mm-pitch QFN layout with via-in-pad or 4 thermal vias under the die pad for ground continuity. The small 3×3 mm footprint leaves little room for stubs - use impedance-controlled traces for SPI running above 10 MHz.
Do not exceed 3.6 V on VDD/AVCC - the MSP430FR2111 absolute-maximum rating is 4.1 V, and any over-voltage event can permanently damage the FRAM controller. Avoid long sustained writes to FRAM in tight loops; although FRAM endurance is essentially unlimited, sustained bytewise writes at full MCLK can starve the CPU and ADC. Use DMA for ADC-to-FRAM transfers and the built-in wait-state generator for MCLK > 8 MHz.
For SPI peripherals running above 8 MHz, add 22-33 Ω series damping resistors at the MSP430FR2111IRLLR eUSCI pins to absorb reflections on longer PCB traces. The internal pull-ups on I2C-capable P3.0/P3.1 are weak (typically ~35 kΩ) - use external 4.7 kΩ pull-ups when the bus capacitance exceeds 50 pF. Keep analog sensor traces guarded by a ground pour to minimize crosstalk into the ADC inputs.
Informations de conformité
RoHS and REACH compliance per TI product page; lead-free / halogen-free per TI MSP430FR2x datasheet family. AEC-Q100 not qualified - for automotive designs choose a Q1-grade MSP430 variant.
