MSPM0G3507 - 80MHz Cortex-M0+ 128KB MCU CAN-FD | TI
Référence : MSPM0G3507 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
MSPM0G3507 Présentation
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and programmable peripherals such as timers, ADCs, and communication interfaces. Within the semiconductor hierarchy, the MSPM0G3507 belongs to the MSP 32-bit MCU portfolio: MCU -> embedded processor -> integrated circuit. It is a member of the MSPM0G350x performance sub-family, TI's cost-optimized, analog-rich Cortex-M0+ line.
Key differentiating features include dual 12-bit ADCs sampling at 4 Msps - unusually fast for the Cortex-M0+ class - a 12-bit DAC, three comparators, and two operational amplifiers that can eliminate external analog front-end components. The MATHACL hardware math accelerator accelerates trigonometric and division operations common in PID and motor-control loops, and the integrated CAN-FD controller supports industrial and automotive networking.
Architecturally, the enhanced Cortex-M0+ platform pairs the low-power core with TI's analog peripheral integration and an extended temperature range from -40C to +125C, positioning the MSPM0G3507 between TI's entry-level MSPM0L devices and higher-performance C2000 real-time MCUs.
Typical applications include motor control and digital power conversion, industrial sensing and signal-conditioning nodes, CAN-FD networked modules in factory and automotive systems, and medical alarm designs demonstrated in TI's IEC 60601-1-8 reference design using the MSPM0G3507.
Design tip: program and debug through the SWDIO/SWCLK pins using an XDS110-based LaunchPad debugger, and use TI SysConfig to configure pins and peripherals graphically.
This page synthesizes distributor pricing data, drop-in alternatives within the MSPM0G350x family, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour MSPM0G3507 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MSPM0G3507 (même facteur de forme et même empreinte) — différant par Core Processor, Peripherals.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MSPM0G3506
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSPM0G3505
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSPM0G3507-Q1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSPM0G3519
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSPM0G3107
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSPM0G3507 Valeurs maximales et caractéristiques électriques
| Core Processor | Arm Cortex-M0+ |
| Core Size | 32-bit |
| Fréquence d'horloge maximale | 80 MHz |
| Flash Memory | 128 KB (128K x 8) |
| SRAM | 32 KB |
| ADC Resolution | 12-bit |
| ADC Channels / Converters | 2 x ADC, 4 Msps |
| DAC | 1 x 12-bit |
| Comparators | 3 |
| Operational Amplifiers | 2 |
| CAN Interface | CAN-FD |
| Hardware Math Accelerator | MATHACL (trigonometric and division operations) |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Température de fonctionnement | -40C to +125C |
| Package / Pin Count | 48-LQFP (7x7 mm); family also offered in 64-LQFP and 32-VQFN (5x5) |
| Type de montage | Surface Mount |
| Data Converter Sum | ADC x2, DAC x1 |
| Peripherals | CAN-FD, MATHACL, OPA, COMP, DAC, ADC |
Guide de configuration des broches du MSPM0G3507 48-lqfp (7x7 mm); family also offered in 64-lqfp and 32-vqfn (5x5)
Configuration des broches du MSPM0G3507 (boîtier 48-lqfp (7x7 mm); family also offered in 64-lqfp and 32-vqfn (5x5)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MSPM0G3507.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MSPM0G3507 convient pour 6 applications: Motor Control and Digital Power, Industrial Sensing and Signal Conditioning, CAN-FD Networked Modules, Medical Alarms and Portable Diagnostics, Building Automation and HVAC Control, Consumer and IoT Edge Devices.
Motor Control and Digital Power
The MSPM0G3507 fits motor control through its combination of dual 12-bit ADCs sampling at 4 Msps, which capture phase-current and bus-voltage feedback fast enough for current-loop closure, and the MATHACL accelerator, which offloads the trigonometric and division operations that software FOC implementations otherwise execute slowly on a Cortex-M0+. Placed in a BLDC or PMSM drive, the MCU reads shunt currents through its two integrated operational amplifiers, eliminating external front-end amplifiers and their offset and cost penalties. The trade-off versus TI's C2000 line is lower PWM resolution and fewer motor-specific peripherals, so it is best for cost-sensitive, sensor-based drives rather than high-performance sensorless systems.
Recommandé
Industrial Sensing and Signal Conditioning
For industrial sensing nodes, the MSPM0G3507 integrates the complete analog chain: two operational amplifiers to amplify sensor outputs, three comparators for threshold detection independent of the CPU, the 12-bit DAC for stimulus or bias generation, and dual 4 Msps ADCs for high-speed acquisition. Operating from 1.62V to 3.6V with -40C to +125C capability, it survives factory-floor conditions and battery-backed installations. A typical chain connects a bridge or current-loop sensor to the OPA inputs, digitizes the conditioned signal at up to 4 Msps, and streams results over UART or SPI. Ultra-low-power MSP family heritage keeps sleep current low for periodically woken sensor nodes.
Recommandé
CAN-FD Networked Modules
The MSPM0G3507's integrated CAN-FD controller makes it a natural node processor for industrial buses and automotive body/sensor networks running flexible-data-rate CAN. Unlike MCUs needing an external CAN controller, the on-chip module transmits frames up to the CAN-FD data phase rates while the 80 MHz core handles protocol stacks and application logic; MATHACL accelerates any signal processing between messages. Connect the CAN-FD TX/RX pins to a 3.3V CAN transceiver at the physical layer. Because the MSPM0G3507-Q1 variant shares the same die, one PCB design serves both commercial and automotive-qualified fleet requirements, and the MSPM0G3519 offers a same-footprint memory upgrade path.
Recommandé
Medical Alarms and Portable Diagnostics
TI explicitly demonstrates medical alarm functionality with the MSPM0G3507 in a reference design developed in accordance with IEC 60601-1-8, using the MCU to implement primary alarm, backup alarm, and visual alarm outputs. The dual 4 Msps ADCs and integrated op-amps digitize physiological sensor signals in portable monitors, while the low-power MSP architecture extends battery life in bedside or ambulatory equipment. The -40C to +125C range and 1.62V minimum supply support battery-powered designs. Designers should follow TI's medical reference design documentation for alarm timing redundancy and verify the specific quality grade and documentation package required for their regulatory submission.
Recommandé
Building Automation and HVAC Control
In building automation, the MSPM0G3507 controls fans, dampers, and pumps while hosting sensor interfaces and fieldbus communication. The 80 MHz Cortex-M0+ executes PID loops efficiently with MATHACL accelerating the control math, two op-amps condition NTC thermistor or pressure-sensor signals, and CAN-FD or UART links panels to a building controller. The 12-bit DAC can generate analog control references for variable-speed drives or actuator drivers. Extended -40C to +125C operation covers rooftop and mechanical-room environments where consumer-grade MCUs fail, and the cost-optimized MSPM0G positioning keeps BOM cost competitive in high-volume thermostat and controller applications.
Recommandé
Consumer and IoT Edge Devices
For IoT edge products, the MSPM0G3507 combines an ultra-low-power MSP pedigree with enough analog integration to replace discrete sensor front ends: op-amps, comparators, DAC, and 4 Msps ADCs in a single chip reduce component count in smart meters, appliance controls, and connected accessories. The 128KB flash hosts BLE or sub-1GHz module drivers over UART/SPI alongside application firmware, and the 1.62V minimum supply directly matches single-cell lithium battery rails through a simple regulator. Cost-optimized family pricing, availability in a compact 5x5 mm VQFN, and TI's free SysConfig tooling shorten development cycles for high-volume consumer platforms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MSPM0G3507 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MSPM0G3506 | MSPM0G3505 | MSPM0G3519 | MSPM0G3107 |
|---|---|---|---|---|---|
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) available - same footprint | 48-LQFP (7x7 mm) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Core / Frequency | Arm Cortex-M0+ 80 MHz | Arm Cortex-M0+ 80 MHz | Arm Cortex-M0+ 80 MHz | Arm Cortex-M0+ 80 MHz | Arm Cortex-M0+ 80 MHz |
| Flash Memory | 128 KB | 64 KB | 32 KB | Larger option (family high-memory member) | 128 KB |
| CAN-FD | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Maximum flash memory in the pin-compatible cost-down ladder (vs MSPM0G3506)
- Fastest ADC pair in the Cortex-M0+ class within MSPM0G (vs MSPM0G3107)
- Same-die automotive upgrade path (vs MSPM0G3507-Q1)
Notes de conception
Place a 100 nF ceramic decoupling capacitor at each VDD pin pair, as close to the pins as possible, plus a bulk 4.7-10 uF capacitor near the device; the analog supply and VREF inputs should be filtered separately (ferrite bead plus local capacitance) to preserve the full ADC performance of the dual 4 Msps converters. Keep the VREF trace short and guarded by ground. Use TI SysConfig to confirm pin muxing before layout freeze, since peripheral assignments change between the 32-VQFN, 48-LQFP, and 64-LQFP package options.
Do not assume package pin compatibility outside the MSPM0G350x family: engineers attempting STM32F103VGT6 substitution on the TI E2E forum were advised no pin-to-pin crossover exists. Within the family, confirm flash headroom before choosing MSPM0G3506/3505 cost-down parts, as 64KB/32KB flash replaces the 128KB of the G3507. When designing for future migration to MSPM0G3519, verify VREF+ / VREF- pin handling per the TI E2E guidance - unused VREF pins on the G3519 footprint require explicit review rather than being left floating by accident.
The two integrated operational amplifiers can replace external signal-conditioning stages, but PCB layout still determines accuracy: route sensor inputs differentially where possible, keep high-current motor or switching nodes away from OPA and ADC input traces, and use the on-chip comparators with internal references for fast protection functions so they react without ADC/software latency. When sampling at the full 4 Msps rate, sequence conversions with the ADC's hardware triggers from timers instead of software polling to avoid jitter in control loops.
Informations de conformité
RoHS/lead-free status per standard TI active-product offering; the -Q1 variant is the automotive-qualified option. Detailed REACH and conflict-minerals declarations should be pulled from TI's product quality portal.
