P1025NSE5BFB - QorIQ P1025 667MHz Dual-Core PowerPC | NXP
Référence : P1025NSE5BFB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $76.78 | $76,78 |
| 10 | $68.5 | $685,00 |
| 100 | $58.25 | $5 825,00 |
| 500 | $49.8 | $24 900,00 |
| 1 000 | $43.2 | $43 200,00 |
P1025NSE5BFB Présentation
A QorIQ communications processor (also known as a Power Architecture SoC or communications MPU) is a highly-integrated system-on-chip designed for packet processing, secure routing, and embedded control in networked equipment. It belongs to the broader family of embedded microprocessors (MPU) that combine one or more processor cores, memory controllers, high-speed I/O, and acceleration engines on a single die. Within NXP's portfolio, QorIQ P1 sits between the lower-cost P1015 family and the higher-performance P2/P4 families.
Key differentiating features of the P1025NSE5BFB include dual 32-bit e500v2 cores (vs single-core P1016), 667 MHz operation, integrated hardware security engine, QUICC Engine for legacy TDM/UTOPIA support, and industrial temperature range from 0C to +125C. The combination of DDR3 with ECC and integrated GbE MACs makes it suitable for line cards, secure routers, and industrial gateways that demand deterministic throughput.
Architecturally, the device uses a hierarchical interconnect that allows each e500v2 core to access L1 caches while sharing L2 and I/O subsystems. The 45 nm process provides a favorable power/performance balance for fanless industrial deployments where the larger 23x23 mm BGA helps spread thermal dissipation. Hardware accelerators offload crypto, pattern matching, and packet inspection from the cores.
Typical applications include secure network routers, industrial Ethernet switches, defense communications equipment, factory automation controllers, LTE small-cell baseband, and smart-grid gateways. The dual-core configuration and QUICC Engine make it especially attractive where TDM/legacy interfaces must coexist with modern IP traffic.
When designing with this part, allocate sufficient PCB layers (typically 8+), follow NXP AN-4320 for BGA routing, and place bulk decoupling capacitors within 2 inches of the power balls. Designers should refer to NXP's hardware specifications for the recommended DDR3 topology and SERDES termination network.
This page synthesizes distributor pricing, drop-in alternatives from the QorIQ P1 family, and practical design notes not directly compiled in the manufacturer datasheet, giving engineers a single reference for evaluation, sourcing, and PCB layout considerations.
Alternatives de remplacement direct pour P1025NSE5BFB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec P1025NSE5BFB (même facteur de forme et même empreinte) — différant par Core Architecture, Ethernet, Memory Controller, Operating Temperature, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
P1025NSN5BFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1025NXE5BFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1016NSE5BFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1015NSE5BFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1020NSE5BFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P2020NSE5BFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1025NSE5BFB Valeurs maximales et caractéristiques électriques
| Series | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 2 |
| Largeur du bus de données | 32-Bit |
| Max Core Frequency | 667 MHz |
| Température de fonctionnement | 0C to +125C |
| Boîtier | 561-TEPBGA I (23x23 mm) |
| Type de montage | Surface Mount (BGA) |
| Memory Controller | DDR3 with ECC |
| Ethernet | Integrated GbE MAC |
| PCI Express | Yes (PCIe) |
| USB | Yes |
| TDM Support | Yes (via QUICC Engine) |
| Security Engine | Yes (SEC) |
| QUICC Engine | Yes (QE) |
| Process Technology | 45 nm |
| Lead-Free Status | Lead Free |
| Statut RoHS | RoHS Compliant |
Guide de configuration des broches du P1025NSE5BFB 561-tepbga i (23x23 mm)
Configuration des broches du P1025NSE5BFB (boîtier 561-tepbga i (23x23 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour P1025NSE5BFB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
P1025NSE5BFB convient pour 7 applications: Secure Enterprise Routers, Industrial Ethernet Switches, Defense Communication Equipment, LTE Small-Cell Baseband, Smart-Grid Gateways, Factory Automation Controllers, VoIP & Unified Communications Appliances.
Secure Enterprise Routers
The P1025NSE5BFB's dual e500v2 cores at 667 MHz, integrated SEC hardware crypto engine, and GbE MACs make it ideal for secure enterprise router line cards. Why it fits: the hardware SEC engine offloads AES, 3DES, and IPsec operations, leaving both PowerPC cores available for routing-table lookups and control-plane protocols. How it's used: typically placed on the router mainboard with DDR3-1333 ECC DRAM (2 GB typical), one GbE to WAN, one GbE to LAN switch fabric, and a PCIe link to a hardware crypto co-processor. Performance consideration: dual cores deliver ~1.6 Gbps of IPsec throughput at 667 MHz while consuming ~3 W typical, an order of magnitude better than software-only crypto on a generic RISC CPU.
Recommandé
Industrial Ethernet Switches
The P1025NSE5BFB's industrial 0C to +125C temperature range, integrated QUICC Engine for TDM/industrial protocols, and DDR3 with ECC make it well-suited to managed industrial Ethernet switches. Why it fits: the QUICC Engine handles legacy Profibus/Interbus/TDM signals that are still common in factory automation, while the GbE MACs drive switch ports. How it's used: the SoC connects to a managed GbE switch ASIC via PCIe or via RGMII, runs PROFINET or EtherCAT master firmware on the e500v2 cores, and uses ECC DDR3 to detect memory corruption in 24/7 deployments. Performance consideration: the industrial temperature grade and ECC allow deployment in unconditioned cabinets, eliminating the need for active cooling and reducing field-service intervals.
Recommandé
Defense Communication Equipment
Defense and aerospace communications systems benefit from the P1025NSE5BFB's hardware security engine, industrial temp range, and dual-core throughput for multi-channel processing. Why it fits: the SEC engine supports classified-mode crypto algorithms, and the dual e500v2 cores can run separate red/black channel processing in parallel. How it's used: typically paired with ruggedized DDR3 ECC memory and an FPGA front-end, the SoC handles link-layer crypto while the FPGA manages RF modulation. Performance consideration: hardware crypto offload ensures deterministic latency for tactical data links, where jitter on software crypto would miss critical timing windows.
Recommandé
LTE Small-Cell Baseband
Small-cell baseband processing fits the P1025NSE5BFB's profile thanks to dual cores, GbE, PCIe for DSP co-processors, and the QUICC Engine for timing synchronization. Why it fits: at 667 MHz dual-core, the SoC can run L1/L2 baseband stacks for a 4G LTE femtocell while the QE handles IEEE 1588 timing via TDM. How it's used: the part sits between the RF transceiver (front-end) and the backhaul GbE link, with one core reserved for PHY/baseband and the second for management/OAM. Performance consideration: the integrated SEC engine accelerates encryption for user-plane backhaul traffic without burdening the cores, and DDR3 with ECC reduces soft-error rates in elevated-temperature outdoor deployments.
Recommandé
Smart-Grid Gateways
Smart-grid aggregation gateways leverage the P1025NSE5BFB's industrial-grade operation, security, and ability to bridge legacy serial protocols to modern IP networks. Why it fits: the QUICC Engine handles RS-485/RS-232 SCADA links while the GbE uplinks the data to utility control centers, and the SEC protects authentication per IEC 62351. How it's used: the SoC runs a real-time Linux distribution with IEC 61850 and DNP3 protocol stacks, with the dual cores dedicating one to time-critical SCADA polling. Performance consideration: 0-125C industrial range and lead-free BGA enable outdoor cabinet deployment, while ECC DDR3 prevents memory corruption that would silently corrupt metering data.
Recommandé
Factory Automation Controllers
The P1025NSE5BFB serves as the central processor in programmable logic controllers (PLCs) and motion controllers where deterministic, secure multi-axis control is required. Why it fits: dual e500v2 cores deliver a fast control loop (250 us is achievable) while the QUICC Engine interfaces with servo drives via TDM. How it's used: one core runs the real-time OS with EtherCAT master, while the second core handles HMI/networking tasks. Performance consideration: the integrated SEC engine secures the OPC-UA channel to the factory MES, and ECC DDR3 mitigates SEU-induced memory errors in electrically noisy plant environments.
Recommandé
VoIP & Unified Communications Appliances
Small-to-medium business VoIP appliances benefit from the P1025NSE5BFB's GbE throughput, hardware crypto for SRTP, and the QUICC Engine for legacy PSTN/TDM interfaces. Why it fits: the dual cores can manage hundreds of concurrent SIP/RTP sessions, while the QE handles legacy T1/E1 PRI trunks for interop with installed PSTN switches. How it's used: the SoC runs an embedded Asterisk/FreeSWITCH fork on Linux, with one core dedicated to media transcoding. Performance consideration: hardware SRTP encryption offload (via SEC) preserves core cycles for voice processing, and DDR3 ECC eliminates audio artifacts from memory-bit errors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour P1025NSE5BFB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | P1025NSN5BFB | P1025NXE5BFB | P1016NSE5BFB | P1015NSE5BFB | P1020NSE5BFB | P2020NSE5BFB |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 561-TEPBGA I (23x23 mm) | 561-TEPBGA I (23x23 mm) - same | 561-TEPBGA I (23x23 mm) - same | 561-TEPBGA I (23x23 mm) - same | 561-TEPBGA I (23x23 mm) - same | 561-TEPBGA I (23x23 mm) - same | 561-TEPBGA I (23x23 mm) - same |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500 |
| Number of Cores | 2 | 2 | 2 | 1 | 1 | 2 | 2 |
| DDR Controller | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC |
| QUICC Engine | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Security Engine (SEC) | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Industrial 0C to +125C temp range in NSE suffix (vs P1025NXE5BFB)
- Dual e500v2 cores at 667 MHz in pin-compatible family (vs P1016NSE5BFB)
- 45 nm process with integrated SEC + QE dual engines (vs P2020NSE5BFB)
Notes de conception
Estimated: The 561-TEPBGA I package at 23x23 mm has 1.0 mm ball pitch, typically requiring 8+ PCB layers with microvia stackups. Use NXP AN-4320 as the reference for BGA escape routing. Critical signals (DDR3, PCIe, SERDES) need matched-length impedance control with reference plane continuity, and the BGA thermal pad (if present) must be thermally connected to the inner ground plane via a 6x6 thermal via array.
Estimated: The P1025NSE5BFB power dissipation is typically around 2.5-3.5 W at full dual-core 667 MHz load, with peaks reaching 4.5 W. The 23x23 mm TEPBGA allows passive copper spreading on standard 4-layer FR4 with no active cooling. For sealed enclosures or elevated ambient temps, provide at least 25 cm^2 of continuous inner copper under the BGA to keep junction below 125C at maximum industrial temperature.
Verify the part suffix carefully. The 'NSE' suffix indicates industrial temp 0-125C, 'NXE' is extended -40 to +125C, and 'NSE5BFB' encodes the speed bin and feature set. Mixing industrial and extended temp parts in a single PCB variant will cause thermal margin issues in outdoor deployments. Also confirm whether your design needs Ethernet Switch or PCI Express variants — the suffix carries this information.
Estimated: Design budget for a typical P1025NSE5BFB system is 8-12 W total. Provide at least 4 separate voltage rails: core (1.0 V), DDR3 I/O (1.5 V), SerDes I/O (1.0/1.2 V), and 3.3 V peripheral I/O. Use NXP's recommended sequencing: core first, then DDR3 I/O, then peripheral I/O. Use a high-efficiency DC-DC regulator with monotonically-safe voltage rails to avoid lockup during partial power-up.
Informations de conformité
RoHS compliant and Lead Free per NXP product page and DigiKey listing. AEC-Q100 not applicable - QorIQ is not automotive-grade. Halogen-free status reported by NXP. REACH and conflict-minerals compliance is reported on NXP's environmental portal.
