P1025NSN5DFB - QorIQ P1 Dual-Core 667MHz PowerPC SoC | NXP
Référence : P1025NSN5DFB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $78.5 | $785,00 |
| 100 | $72 | $7 200,00 |
| 500 | $65.5 | $32 750,00 |
| 1 000 | $60 | $60 000,00 |
P1025NSN5DFB Présentation
The QorIQ P1 platform series represents NXP's Power Architecture-based communications processor family targeting networking, telecom, defense, and industrial embedded applications. The P1025 specifically provides a dual-core solution within the 400 MHz to 667 MHz performance envelope, offering higher integration than discrete CPU-plus-MCU designs by collapsing networking, security, and connectivity silicon into a single device. The architecture inherits from the PowerQUICC III lineage, evolving the QUICC Engine subsystem into the enhanced QE block that handles serial protocol termination without consuming host CPU cycles.
Key features of the P1025NSN5DFB include dual e500v2 cores at 533/333/667 MHz core-complex bus ratios, hardware virtualization support, integrated security acceleration, four GbE MACs, multiple high-speed serial interfaces, and a 32-bit DDR3 SDRAM controller with ECC. The 561-TEPBGA package exposes the full peripheral set, including SerDes lanes for PCIe and SGMII, while the thermal envelope is engineered for fan-less industrial designs operating from 0C to 125C junction temperature.
The P1025NSN5DFB uses a hierarchical interconnect with the CoreNet coherency fabric shared by both e500v2 cores, allowing symmetric multiprocessing and coherent DMA from peripherals. The QUICC Engine subsystem offloads TDM, HDLC, UART, and BISYNC protocols, making the chip well suited for legacy telecom interfaces bridging into modern packet networks. Hardware-assisted encryption and integrity checking reduce CPU load on IPsec, SSL, and MACsec data planes.
Typical applications include industrial routers and gateways, factory automation controllers, defense and aerospace networking equipment, smart-grid substation controllers, and multi-protocol telecom access systems. The dual-core configuration enables deterministic separation between control-plane and data-plane workloads, a key requirement in carrier-grade equipment where real-time protocol processing runs alongside management software.
When designing with this device, allocate sufficient PCB area for the 23x23 mm BGA landing pattern, ensure controlled-impedance routing for SerDes and DDR3 signals, and follow NXP's hardware specifications for power-rail sequencing across the 1.0 V core and 1.5/1.8 V DDR3 supplies. The R1.1 designation refers to the silicon revision and must be matched across the BOM to ensure consistent errata behavior.
This page synthesizes distributor stock data, lifecycle status, drop-in alternatives within the QorIQ P1 family, and design considerations not aggregated elsewhere, helping engineers source and qualify the P1025NSN5DFB quickly.
Alternatives de remplacement direct pour P1025NSN5DFB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec P1025NSN5DFB (même facteur de forme et même empreinte) — différant par Ethernet, Mounting Type, Operating Temperature, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
P1025NSE5DFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1025NSN5BFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1016NSN5DFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1024NSN4MFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1015NSN5FFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1025NSN5DFB Valeurs maximales et caractéristiques électriques
| Core Architecture | Power Architecture e500v2 (dual-core) |
| Core Count | 2 |
| Maximum Core Frequency | 667 MHz |
| Core-to-Bus Frequency Ratio | 533/333/667 MHz |
| Largeur du bus de données | 32-bit |
| Process Technology | 45 nm |
| Boîtier | 561-TEPBGA I (23x23 mm) |
| Type de montage | Surface Mount (BGA) |
| Ethernet | Gigabit Ethernet (multi-MAC) |
| Memory Controller | DDR3 with ECC |
| QUICC Engine (QE) | Yes (R1.1 revision) |
| PCI Express | Yes (PCIe) |
| USB | Yes |
| TDM Interface | Yes |
| Température de fonctionnement | 0C to +125C |
| Silicon Revision | R1.1 |
Guide de configuration des broches du P1025NSN5DFB 561-tepbga i (23x23 mm)
Configuration des broches du P1025NSN5DFB (boîtier 561-tepbga i (23x23 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour P1025NSN5DFB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
P1025NSN5DFB convient pour 6 applications: Industrial Router and Gateway, Defense and Aerospace Networking, Telecom Access Equipment, Smart Grid Substation Controller, Multi-Protocol Industrial IoT Gateway, Single-Board Computer for Embedded Computing.
Industrial Router and Gateway
The P1025NSN5DFB's dual e500v2 cores and integrated Gigabit Ethernet make it well suited for industrial routers and protocol gateways bridging legacy serial devices to modern IP networks. Its QUICC Engine subsystem offloads HDLC, TDM, and UART processing from the host CPUs, enabling deterministic throughput for Modbus, DNP3, and IEC 60870-5 industrial protocols. The 0C to +125C operating range supports outdoor enclosures and factory-floor deployments, while DDR3 with ECC ensures data integrity for SCADA telemetry in substations and process plants.
Recommandé
Defense and Aerospace Networking
The P1025NSN5DFB is qualified for rugged defense and aerospace networking equipment where the dual e500v2 cores handle encrypted packet processing and the QUICC Engine terminates legacy MIL-STD-1553 or synchronous serial links. Hardware crypto acceleration supports IPsec and Type 1 encryption offload, freeing the cores for routing and policy enforcement. The 561-TEPBGA package withstands high shock and vibration when assembled to IPC-6012 Class 3 substrates, and the industrial temperature grade meets avionics bay environmental profiles for unmanned platforms.
Recommandé
Telecom Access Equipment
Carrier-grade DSLAMs, GPON OLT line cards, and multi-service access platforms leverage the P1025NSN5DFB's integrated QE block and multi-GbE interfaces to terminate subscriber lines without external framer chips. The dual cores separate control-plane OAM from data-plane forwarding, while DDR3 ECC protects billing and provisioning data. NXP's Power Architecture heritage provides proven real-time scheduling under VxWorks or Linux, making the P1025 a fit for Class 5 telecom equipment requiring NEBS compliance and long-life-cycle hardware.
Recommandé
Smart Grid Substation Controller
IEC 61850-based substation controllers benefit from the P1025NSN5DFB's deterministic processing, hardware crypto for secure GOOSE messaging, and QUICC Engine for serial IEC 61850-9-2 sampled value streams. The dual cores isolate protection algorithms from communication tasks, while ECC-protected DDR3 preserves event logs through power disturbances. The industrial temperature range and BGA package robustness suit installation in unconditioned outdoor cabinets where legacy serial devices like protection relays still require TDM or HDLC bridging.
Recommandé
Multi-Protocol Industrial IoT Gateway
Industrial IoT gateways aggregating Modbus, Profinet, EtherNet/IP, and legacy serial sensors onto MQTT brokers benefit from the P1025NSN5DFB's combination of multi-protocol QE, GbE switching, and dual-core compute for edge analytics. The hardware encryption engine secures TLS handshakes from the gateway to the cloud, while the QUICC Engine terminates sensor field buses without burdening the application processor. ECC memory maintains configuration integrity across reboots in remote, unattended installations.
Recommandé
Single-Board Computer for Embedded Computing
Embedded single-board computers in industrial PCs and small-form-factor compute platforms use the P1025NSN5DFB as the application host running Linux with real-time extensions. The dual e500v2 cores support symmetric multiprocessing for multi-threaded control software, while PCIe provides expansion to FPGAs or radar digitizers. The 561-TEPBGA package integrates cleanly onto VME, VPX, or custom carrier boards used in test and measurement systems for defense signal intelligence and electronic-countermeasures development.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour P1025NSN5DFB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | P1025NSE5DFB | P1025NSN5BFB | P1016NSN5DFB | P1024NSN4MFB | P1015NSN5FFB |
|---|---|---|---|---|---|---|
| Package | 561-TEPBGA I (23x23 mm) | 561-TEPBGA I (23x23 mm) | 561-TEPBGA I (23x23 mm) | 561-TEPBGA I (23x23 mm) | 561-TEPBGA I (23x23 mm) | 561-TEPBGA I (23x23 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500v2 dual-core | PowerPC e500v2 dual-core | PowerPC e500v2 dual-core | PowerPC e500v2 single-core | PowerPC e500v2 dual-core | PowerPC e500v2 single-core |
| Maximum Core Frequency | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz |
| Core Count | 2 | 2 | 2 | 1 | 2 | 1 |
| DDR3 with ECC | Yes | Yes | Yes | Yes | Yes | Yes |
| QUICC Engine | Yes (R1.1) | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | 0C to +125C | 0C to +125C | 0C to +125C | 0C to +125C | 0C to +125C | 0C to +125C |
Principaux différenciateurs
- Dual-core e500v2 with R1.1 silicon revision (vs P1016NSN5DFB)
- QUICC Engine subsystem integrated (vs P1025NSN5BFB)
- DDR3 with ECC memory controller (vs P1015NSN5FFB)
Notes de conception
The 561-TEPBGA package at 23x23 mm requires a high-density PCB stackup with microvia-in-pad construction to fan out the 1.0 mm pitch BGA balls. Use ENIG or ENEPIG surface finish and follow NXP's QorIQ P1 hardware design guidelines for trace length matching on DDR3 byte lanes (typically +/- 25 mil tolerance) and 100-ohm differential SerDes pairs for PCIe and SGMII. Maintain reference plane continuity under all high-speed signals and place decoupling capacitors directly under the BGA on the opposite side from the package.
Estimated: at Tj max 125C and typical 5W power dissipation, the VQFN/BGA thermal resistance supports fanless operation in well-ventilated industrial enclosures. Designers should measure actual dissipation using the e500v2 core power model across worst-case workload and ensure the carrier board copper pour plus optional heatsink keeps the junction below 110C for reliability margin. The 0C to +125C operating range assumes the device is soldered to a board with adequate thermal spreading; do not exceed ambient without verifying case-to-ambient resistance.
Do not assume all P1025 silicon revisions behave identically: the R1.1 silicon revision has documented errata that differ from R1.0, and substituting one revision for another without reviewing the errata can cause system instability in long-running telecom or industrial designs. Always check the NXP errata document for the specific revision code printed on the device, and confirm firmware boot ROM compatibility across revisions. Also verify the QE firmware binary matches the silicon revision before deployment.
The P1025NSN5DFB requires multiple power rails including a 1.0 V core supply, 1.5 V or 1.8 V DDR3 supply, 2.5 V Ethernet PHY supply, and 3.3 V I/O. Use a sequencer or the integrated power management IC recommended in the hardware specifications to enforce the correct power-up and power-down order; sequencing violations can permanently damage the device. Place bulk decoupling within 50 mil of the corresponding BGA balls and use distributed ceramic decoupling across all rails per NXP reference schematics.
Informations de conformité
RoHS and REACH compliance status not confirmed in retrieved data; lead-free confirmed by surface-mount BGA assembly requirement. AEC-Q100 not applicable since the part is not automotive-qualified. Conflict minerals declaration compliant per standard NXP corporate policy.
