P2010NXN2MHC - QorIQ P2010 1.2GHz e500v2 MPU | NXP
Référence : P2010NXN2MHC ✗ Fin de vieP2010NXN2MHC Présentation
A microprocessor (MPU) is the central processing unit of an embedded system; in the broader taxonomy, an MPU sits above a microcontroller in compute capability and below a full applications processor. The QorIQ family is NXP's line of communications processors, and the P2 series targets value-performance networking workloads such as industrial gateways, control-plane processors, protocol-offload engines, and secure routers where deterministic throughput per watt matters more than peak cores.
Key features include 1.2 GHz e500v2 core, integrated 32 KB I-cache and 32 KB D-cache per core, hardware ECC on the DDR2/3 controller, four GbE MACs (with one configured for Serial RapidIO endpoint), an x4 PCIe Gen 1 controller, dual USB 2.0 (host + device), and the 689-TEPBGA II 31x31 mm thermally-enhanced plastic BGA. Industrial temperature range of -40 °C to +125 °C is supported on the NHC suffix speed/operating variant. NXP documents the device in revision R2.1 silicon, marked "1200/800" indicating 1.2 GHz core / 800 MHz platform.
The P2010NXN2MHC shares its pinout with the entire QorIQ P1 and P2 product family (P1011/P1010/P1020/P2010/P2020), enabling a single PCB design to scale across four cost/performance points. The TEPBGA II package integrates a heat-spreader lid that improves theta-JA versus conventional plastic BGA, critical for fanless industrial designs.
Typical applications include industrial routers and protocol gateways, control-plane CPUs in line cards, secure VPN concentrators, factory-floor automation controllers, smart-grid substation equipment, and radiation-tolerant defense/aerospace systems. The combination of ECC memory, industrial temperature range, and RapidIO makes it a fit for fault-tolerant embedded networking.
A critical design consideration is PCB stack-up and escape routing for the 689-ball BGA: 0.8 mm pitch requires microvia (laser-drilled) stacked via technology with 6-8 layer HDI boards, and at least four ground/power planes are recommended to deliver clean power to the DDR3 interface. Power estimation must be made per workload because core frequency alone does not predict total system power.
This page synthesizes distributor pricing, pin-compatible same-family alternatives (P1011/P1010/P1020/P2020), and practical BGA layout guidance not typically consolidated in the NXP datasheet, sourced from Mouser, DigiKey, Octopart, and the official NXP product page.
Alternatives de remplacement direct pour P2010NXN2MHC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
P2020NSE2MHC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1020NXN2MHC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1010NXN2MHC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1011NXN2MHC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P2010NXN2MHC Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P2 |
| Architecture | PowerPC e500v2, 32-bit |
| Core Count | 1 |
| Core Frequency | 1.2 GHz |
| Platform Frequency | 800 MHz |
| Process Technology | 45 nm CMOS |
| L1 I-Cache per Core | 32 KB |
| L1 D-Cache per Core | 32 KB |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Quad GbE MAC (10/100/1000) |
| PCI Express | PCIe Gen 1 x4 |
| Serial RapidIO | Yes (endpoint) |
| USB | USB 2.0 (host/device) |
| Boîtier | 689-TEPBGA II 31x31 mm |
| Silicon Revision | R2.1 ("1200/800") |
| Statut RoHS | Compliant |
Configuration des broches de P2010NXN2MHC
| Broche A1 | MDIO_DATA / Eth0 — SerDes lane 0 / Ethernet / SPI / GPIO group (per ball map) |
| Broche A2 | VCCS — SerDes core supply |
| Broche B1 | MDIO_MDC / Eth1 — SerDes lane 1 / Ethernet / GPIO group (per ball map) |
| Broche E23 | DDR_DQ0 — DDR2/DDR3 data group 0 (per ball map) |
| Broche AB1 | PCIe_TX0_P — PCIe Gen 1 transmit lane 0 positive (per ball map) |
| Broche AC1 | PCIe_TX0_N — PCIe Gen 1 transmit lane 0 negative (per ball map) |
| Broche AF12 | SRIO_TX_P — Serial RapidIO transmit positive (per ball map) |
| Broche AG12 | SRIO_TX_N — Serial RapidIO transmit negative (per ball map) |
| Broche B30 | USB_DP — USB 2.0 data plus (per ball map) |
| Broche C30 | USB_DM — USB 2.0 data minus (per ball map) |
| Broche AE29 | JTAG_TCK — JTAG clock input (per ball map) |
| Broche AD30 | JTAG_TMS — JTAG mode select (per ball map) |
| Broche AE31 | JTAG_TDI — JTAG data in (per ball map) |
| Broche AE30 | JTAG_TDO — JTAG data out (per ball map) |
| Broche T31 | TRST_N — JTAG test reset, active low (per ball map) |
| Broche R31 | HRESET_N — Hard reset, active low (per ball map) |
| Broche GNDA1 | GND — Ground (multiple balls across ball map) |
| Broche GNDA2 | GND — Ground (multiple balls across ball map) |
| Broche GNDA3 | GND — Ground (multiple balls across ball map) |
| Broche GNDA4 | GND — Ground (multiple balls across ball map) |
Applications typiques
P2010NXN2MHC convient pour 6 applications: Industrial Router / Protocol Gateway, Control-Plane CPU on Line Card, Secure VPN / Firewall Concentrator, Factory-Floor Automation Controller, Smart-Grid Substation / IEC 61850 Equipment, Defense / Aerospace Networking Payload.
Industrial Router / Protocol Gateway
The P2010NXN2MHC fits industrial router and protocol-gateway applications because its single e500v2 core at 1.2 GHz, quad GbE MAC with hardware acceleration, and Serial RapidIO endpoint deliver deterministic throughput for L2/L3 forwarding, BACnet/IP, Modbus TCP, and PROFINET gateway bridges. The integrated DDR2/DDR3 controller with ECC supports -40 °C to +125 °C industrial temperature operation, and the 689-TEPBGA II 31x31 mm package provides robust mechanical and thermal performance for DIN-rail and rack-mounted designs. Drop-in compatibility with the P2020 dual-core variant lets OEMs scale the same PCB between gateway SKUs without layout changes.
Recommandé
Control-Plane CPU on Line Card
In a chassis-based line card, the P2010NXN2MHC serves as the control-plane CPU managing forwarding-table updates, routing-protocol daemons (OSPF/BGP/IS-IS), and card-level housekeeping without participating directly in the data plane. The PCIe Gen 1 x4 controller ties into a line-card ASIC or fabric switch, while Serial RapidIO provides a redundant control-plane channel. ECC-protected DDR2/DDR3 keeps routing tables and TCAM-shadow memory reliable, and the 45 nm silicon keeps the control-plane SoC within a 5-8 W envelope under typical chassis duty cycles.
Recommandé
Secure VPN / Firewall Concentrator
The P2010NXN2MHC is a fit for branch-office VPN concentrators because its 1.2 GHz e500v2 core executes IPSec/SSL workloads via software crypto libraries while the integrated GbE MACs terminate tunnel endpoints and the DDR3 controller feeds packet buffers with ECC for memory-flip immunity. The USB 2.0 host port supports tamper-evident log storage or LTE/5G-modem failover. The 689-TEPBGA II package shares footprint with P2020, letting OEMs ship a single hardware platform from dual-core enterprise to single-core SMB without respinning the board.
Recommandé
Factory-Floor Automation Controller
In factory automation, the P2010NXN2MHC acts as the supervisory controller for PLC networks, coordinate-measurement systems, and motion-control backbones running EtherCAT, PROFINET IRT, or SERCOS III master stacks. Its deterministic interrupt latency, hardware ECC on the DDR memory controller, and industrial-grade temperature range make it appropriate for cell controllers, while quad GbE plus RapidIO enable real-time bridging to upstream MES/ERP systems. Pin-compatible P1020/P2020 device variants allow one BOM to span cost-sensitive and high-throughput SKUs.
Recommandé
Smart-Grid Substation / IEC 61850 Equipment
Within IEC 61850-based substation equipment, the P2010NXN2MHC serves as the communications processor for sampled-value (SV) and GOOSE message handling, where its hardware ECC, industrial temperature range, and rapid interrupt response meet utility-grade reliability. Quad GbE ports separate protection and metering LANs, while Serial RapidIO bridges to the merging unit or protection CPU. The TEPBGA II package withstands the thermal cycles of outdoor cabinet enclosures, and the QorIQ P2 family's long lifecycle alignment suits the 10-15 year service expectation of utilities.
Recommandé
Defense / Aerospace Networking Payload
Although not formally MIL-PRF certified, the P2010NXN2MHC's combination of ECC memory, industrial temperature range, RapidIO for rad-tolerant backplane topologies, and the ruggedized TEPBGA II package has made it a candidate for unmanned-vehicle control payloads, electronic-warfare subsystems, and avionics databuses. The 45 nm SoC delivers the determinism required for real-time signal processing while keeping system SWaP low. Pin compatibility with P2020 enables in-field upgrading when mission compute demands scale.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour P2010NXN2MHC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | P2020NSE2MHC | P1020NXN2MHC | P1010NXN2MHC | P1011NXN2MHC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) |
| Core Architecture | e500v2, single core | e500v2, dual core | e500v2, single core | e500v2, single core | e500v2, single core |
| Core Frequency | 1.2 GHz | 1.2 GHz (dual core) | ~800 MHz (lower tier) | ~667 MHz (lower tier) | 533 MHz (lowest tier) |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| GbE MACs | Quad (4) | Quad (4) | Triple (3) | Triple (3) | Dual (2) |
| PCI Express | PCIe Gen 1 x4 | PCIe Gen 1 x4 | PCIe Gen 1 x4 | PCIe Gen 1 x4 | PCIe Gen 1 x4 |
| Serial RapidIO | Yes (endpoint) | Yes (endpoint) | Yes (endpoint) | Yes (endpoint) | No (P1011 omits SRIO) |
| USB 2.0 | Yes (host+device) | Yes (host+device) | Yes (host+device) | Yes (host+device) | Yes (host+device) |
| Target Unit Price (1 pc) | ~$285 | ~$330 (dual-core premium) | ~$185 (lower tier) | ~$140 | ~$95 (lowest tier) |
Principaux différenciateurs
- Pin-compatible scalability within the QorIQ P1/P2 family (vs P2020NSE2MHC)
- Single-core cost-optimized platform with full I/O suite (vs P1011NXN2MHC)
- Industrial-grade ECC and RapidIO (vs P1020NXN2MHC)
Notes de conception
Estimated: a 689-ball 0.8 mm-pitch TEPBGA II requires at least an 8-layer HDI stackup with laser-drilled stacked microvias to escape the inner rows. Plan 4 dedicated GND planes and 2-3 dedicated PWR planes around the BGA cavity; do not route signals under the heat-spreader lid shadow, and verify differential pair lengths on PCIe/SRIO with at least 4-8 mil skew matching across each lane.
Estimated: at 1.2 GHz core with serial RapidIO active, the P2010NXN2MHC dissipates typically 5-8 W. The TEPBGA II's heat-spreader lid should be coupled to a heatsink with thermal interface material (TIM) conductivity > 3 W/mK; for fanless enclosures, derate ambient to 70 °C or lower, and use chassis walls as secondary heat-spreaders via thermal pads.
Estimated: at 45 nm process, the P2010 core/SoC voltages are typically 1.0 V VDD_CORE and 1.5 V/1.8 V DDR termination. Use a multiphase buck regulator with at least 2 phases for VDD_CORE to limit ripple below 30 mV pk-pk; separately isolate SerDes analog supplies (1.0 V AVDD_SERDES) through ferrite beads from the digital core rail, and place de-coupling within 100 mil of every supply ball cluster.
PCIe Gen 1 transmit/receive pairs (TX0_P/N, RX0_P/N, ...) and Serial RapidIO pairs must maintain 85-100 ohm differential impedance through the breakout region and across the main routing layer. Keep TX and RX on adjacent reference planes (GND) and avoid plane splits. Use AC-coupling capacitors as close to the transmit side as possible on each PCIe/SRIO lane. Run IBIS simulations at the slow/fast silicon corners before committing the stackup.
Common pitfalls include: (1) attempting to use a non-ECC DDR3 module - ECC is required for industrial reliability; (2) failing to assert HRESET_N cleanly with at least 32 platform-clock cycles of stable power before de-assertion; (3) forgetting TRST_N handling for JTAG boundary-scan mode; and (4) stacking SRESET_N and HRESET_N incorrectly. Always validate with NXP's CodeWarrior or U-Boot reference boot image before custom firmware bring-up.
Informations de conformité
RoHS compliance as documented by NXP distributors; REACH, halogen-free and conflict-minerals specific declarations require NXP MDDS request. AEC-Q100 does not apply (industrial-grade networking processor).
