P5040NXE7TMC - QorIQ P5 4-Core 1.8GHz SoC, 1295-FCBGA | NXP
Référence : P5040NXE7TMC ✓ ActifP5040NXE7TMC Présentation
A QorIQ P5 SoC is a communications-processor class of multicore microprocessor that integrates CPU cores, a coherent interconnect, memory controllers, packet-processing engines, security accelerators, and high-speed serial interfaces onto a single die. In the broader taxonomy, it sits as a microprocessor (MPU) -> communications processor -> application-specific SoC -> semiconductor IC. The P5 platform was engineered by Freescale (now NXP) to scale from single-core to quad-core configurations on a pin- and software-compatible footprint, simplifying platform migration across performance tiers.
Key differentiating specifications include the four e5500 cores with dual-issue 7-stage pipelines, support for up to 32 GB of DDR3/DDR3L with ECC, two integrated 10 Gigabit Ethernet MACs plus eight 1 Gigabit Ethernet MACs, multiple PCI Express Gen2 controllers, SATA 2.0 interfaces, and a SEC crypto engine. The -TMC suffix indicates the industrial temperature grade (-40C to +105C) with a silicon revision R2.1, providing long-life-cycle availability for embedded and aerospace platforms.
The architecture combines out-of-order execution support, a hierarchical cache topology with shared L3, and tightly coupled datapath accelerators. The 10 GbE and packet-processing engines offload networking tasks from the cores, allowing the device to deliver line-rate throughput on multiple Gigabit ports simultaneously while leaving CPU cycles available for control-plane and application processing.
Typical applications include multi-service routers and switches, network-attached storage (NAS) controllers, wireless base station equipment, industrial control gateways, and defense/aerospace embedded computing platforms where long-life-cycle silicon and ruggedized temperature grades are mandatory.
When designing with this device, plan for a high-density FCBGA layout (1295 balls at 1 mm pitch typical) requiring multi-layer PCB stack-up, controlled-impedance routing for SerDes lanes, and substantial thermal management for the 37.5 x 37.5 mm package. Designers should also budget for the DDR3 ECC memory design rules and reference NXP's QorIQ P5040 reference design for validated power, clock, and reset sequencing.
This page synthesizes distributor pricing, drop-in alternatives within the QorIQ P5 family, and practical design considerations not consolidated on a single manufacturer or distributor page.
Alternatives de remplacement direct pour P5040NXE7TMC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
P5020NXE7TMC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P5010NXE7TMC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P5040NSE7TMC
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
P5020NSE7TMC
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
P5040NSN7TMC
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
P5040NXE7TMC Valeurs maximales et caractéristiques électriques
| Product Family | QorIQ P5 |
| Core Architecture | Power Architecture e5500, 64-bit |
| Number of Cores | 4 |
| Core Frequency | 1.8 GHz |
| Boîtier | 1295-FCBGA (FCPBGA), 37.5 x 37.5 mm |
| Memory Interface | DDR3 / DDR3L with ECC |
| Maximum DDR3 Capacity | 32 GB (per NXP P5040 product brief) |
| 10 Gigabit Ethernet MACs | 2 (XAUI / XFI / 10GBASE-KR capable) |
| 1 Gigabit Ethernet MACs | 8 (SGMII / RGMII capable) |
| PCI Express | PCIe Gen2 controllers (multiple lanes) |
| SATA | SATA 2.0 interfaces |
| Security Accelerator | SEC engine (hardware crypto) |
| Température de fonctionnement | -40C to +105C (industrial) |
| Silicon Revision | R2.1 |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du P5040NXE7TMC 1295-fcbga (fcpbga), 37.5 x 37.5 mm
Configuration des broches du P5040NXE7TMC (boîtier 1295-fcbga (fcpbga), 37.5 x 37.5 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour P5040NXE7TMC.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
P5040NXE7TMC convient pour 6 applications: Multi-Service Routers and Switches, Network-Attached Storage (NAS) Controllers, Wireless Base Station Equipment, Industrial Control Gateways and Edge Servers, Aerospace and Defense Embedded Computing, Test and Measurement Instrumentation.
Multi-Service Routers and Switches
The P5040NXE7TMC's four e5500 cores at 1.8 GHz plus dual 10 GbE MACs and eight 1 GbE MACs make it ideal for multi-service routers and aggregation switches requiring line-rate packet processing across multiple Gigabit and 10 Gigabit uplinks. The integrated SEC crypto engine offloads IPsec/MACsec at line rate, while DDR3 with ECC at up to 32 GB supports large routing tables and deep packet buffers. Placed as the main control and data-plane CPU on a custom ATCA or COM Express carrier, the P5040NXE7TMC replaces what previously required an SoC plus an external NPU.
Recommandé
Network-Attached Storage (NAS) Controllers
The P5040NXE7TMC's quad-core processing combined with multiple SATA 2.0 interfaces and PCIe Gen2 for external SAS/NVMe expansion makes it suitable as a NAS controller SoC. The four e5500 cores handle file-system operations, RAID parity, and network protocol stacks (SMB, NFS, iSCSI) concurrently, while the integrated GbE ports provide multi-port bonding. DDR3 with ECC at up to 32 GB supports caching and large working-set metadata operations; this is a level of integration that older PowerQUICC parts did not provide.
Recommandé
Wireless Base Station Equipment
For LTE and 5G small-cell base stations, the P5040NXE7TMC's quad e5500 cores deliver the throughput required for L2/L3 baseband processing and Ethernet fronthaul/backhaul. The SEC engine accelerates crypto for secure backhaul, and the -40C to +105C industrial temperature grade supports outdoor cabinet deployments. Multi-port GbE plus 10 GbE uplinks support CPRI/eCPRI traffic alongside traditional IP traffic on a single SoC.
Recommandé
Industrial Control Gateways and Edge Servers
Industrial edge gateways and protocol-conversion servers benefit from the P5040NXE7TMC's combination of quad-core CPU performance, hardware SEC, and rich connectivity. The industrial -40C to +105C temperature range tolerates factory-floor cabinet environments, while multiple GbE, PCIe, and SATA interfaces allow direct connection to PLCs, sensors, and edge storage. Real-time Linux or VxWorks can run on the e5500 cores with deterministic interrupt latency.
Recommandé
Aerospace and Defense Embedded Computing
The P5040NXE7TMC's long-life-cycle silicon (R2.1 revision), industrial temperature grade, and high-density FCBGA package make it well-suited for aerospace and defense embedded computing platforms. The SEC engine supports secure boot and tamper-resistant communications, while the high core count supports multi-domain separation (red/black processing) on a single SoC. Conduction-cooled VPX carrier cards commonly use QorIQ P5040 as the primary CPU.
Recommandé
Test and Measurement Instrumentation
High-end network test equipment, protocol analyzers, and packet generators leverage the P5040NXE7TMC's multi-port GbE/10 GbE interfaces and quad-core processing to capture, analyze, and replay traffic at line rate. The large DDR3 capacity supports deep packet capture buffers, while PCIe Gen2 lanes accommodate high-speed ADC/FPCI digitizer cards. The QorIQ P5 ecosystem provides proven Linux and VxWorks BSPs for test-equipment manufacturers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour P5040NXE7TMC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | P5020NXE7TMC | P5010NXE7TMC | P5040NSE7TMC | P5020NSE7TMC |
|---|---|---|---|---|---|
| Package | 1295-FCBGA (37.5 x 37.5 mm) | 1295-FCBGA (37.5 x 37.5 mm) - same | 1295-FCBGA (37.5 x 37.5 mm) - same | 1295-FCBGA (37.5 x 37.5 mm) - same | 1295-FCBGA (37.5 x 37.5 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Number of Cores | 4 (e5500, 64-bit) | 2 (e5500) | 1 (e5500) | 4 (e5500) | 2 (e5500) |
| Core Frequency | 1.8 GHz | 1.8 GHz | 1.8 GHz | 1.8 GHz | 1.8 GHz |
| 10 GbE MACs | 2 | 2 | 2 | 2 | 2 |
| 1 GbE MACs | 8 | 8 | 8 | 8 | 8 |
| DDR3 Controller | DDR3/3L with ECC, up to 32 GB | DDR3/3L with ECC | DDR3/3L with ECC | DDR3/3L with ECC | DDR3/3L with ECC |
| SEC Crypto Engine | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Quad-core e5500 at 1.8 GHz in a single 1295-FCBGA (vs P5020NXE7TMC)
- Industrial -40C to +105C temperature grade (vs P5040NSE7TMC)
- SEC crypto engine integrated on-die (vs P5040NSN7TMC)
Notes de conception
The 1295-ball FCBGA at 37.5 x 37.5 mm requires a high-layer-count PCB (typically 10+ layers) with controlled-impedance routing for the 10 GbE SerDes lanes (XAUI/XFI/10GBASE-KR). Per NXP's QorIQ P5040 hardware reference design guidance, microvia stack-ups and laser-drilled vias under the BGA are mandatory for reliable assembly. Reference the NXP QorIQ P5040 reference design for the validated stack-up, ball-map escape routing, and length-matching rules.
The QorIQ P5040 SoC can dissipate 15-25W under load (per NXP P5040 product brief thermal guidance), so a substantial thermal solution is required. Use a heatsink with thermal interface material rated for the -40C to +105C industrial range, or design for conduction cooling via a VPX/cPCI chassis cold plate. The exposed-die FCBGA package requires an integrated heat spreader or direct-attached heatsink with appropriate mounting force.
Power sequencing for the P5040NXE7TMC must follow the NXP QorIQ P5040 datasheet: core voltage (Vdd), platform voltage, and I/O voltage must be sequenced to avoid latch-up. Use a multi-rail PMIC such as the NXP VR5100 or equivalent to provide the required sequencing. Decoupling requires high-frequency ceramics (0402/0201) immediately adjacent to each BGA ball pair as well as bulk capacitors on each voltage rail.
Common pitfalls include: omitting the impedance-matched reference clock for the 10 GbE SerDes, failing to apply the required reset sequencing after power-up, and using a non-validated DDR3 DIMM/UDIMM that does not meet the JEDEC SPD timing profile supported by the integrated memory controller. Per NXP's QorIQ P5040 errata list (R2.1), always consult the latest silicon errata before finalizing the PCB layout.
Informations de conformité
Compliance information not explicitly listed in the verified web data. QorIQ P5 family is generally RoHS/REACH compliant per NXP product policy, but specific P5040NXE7TMC declarations should be confirmed with the manufacturer datasheet. AEC-Q100 does not apply (this is an MPU, not an automotive-grade IC).
