PIC10F322-E/MC - 8-Bit MCU 896B Flash 16MHz 8-DFN | Microchip
Référence : PIC10F322-E/MC ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0.78 | $0,78 |
| 10 | $0.7 | $7,00 |
| 100 | $0.58 | $58,00 |
| 500 | $0.48 | $240,00 |
| 1 000 | $0.41 | $410,00 |
| 3 000 | $0.34 | $1 020,00 |
PIC10F322-E/MC Présentation
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data-path CPU core, typically with on-chip Flash for program storage, SRAM for variables, and a small set of digital and analog peripherals. MCUs sit at the bottom of the embedded computing hierarchy: microcontroller -> embedded processor -> system-on-chip -> computer. They are designed to run deterministic real-time firmware in cost- and space-constrained applications, replacing discrete logic and reducing BOM count.
Key features of the PIC10F322 include 4 user I/O pins, instruction-cycle performance of 16 MHz (4 MHz instruction rate), 2.3V to 5.5V wide operating voltage range, on-chip temperature indicator, and internal 16 MHz high-speed oscillator with software-selectable calibration. The device is built on Microchip's enhanced mid-range 8-bit core with 49 instructions and 16 stack levels, and supports in-circuit serial programming (ICSP) via two dedicated pins.
Architecturally, the PIC10F322 combines a RISC-style Harvard core with CIP (Core Independent Peripherals) such as the CLC, NCO, and CWG. These peripherals can operate without CPU intervention, allowing the CPU to sleep while peripherals handle PWM generation, signal conditioning, or timing-critical tasks. This dramatically reduces average power consumption and offloads real-time work from the limited instruction bandwidth.
Typical applications include IoT edge sensor nodes, wearable electronics, consumer remote controls, LED lighting controllers, battery chargers, and low-cost motor control for toys and small appliances. The 8-DFN 2x3 mm footprint enables use in space-constrained designs where QFN-style packages are required.
When designing with this part, note that the DFN package has an exposed thermal pad that must be soldered to the PCB ground plane for mechanical reliability and thermal dissipation. The wide 2.3V-5.5V range allows direct connection to single-cell Li-ion or two-AA battery stacks without a separate regulator.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Engineering content combines verified datasheet data with parametric comparison and cross-reference intelligence from the Microchip cross-reference search.
Alternatives de remplacement direct pour PIC10F322-E/MC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC10F322-E/MC (même facteur de forme et même empreinte) — différant par I/O Pins, Package, ADC, Operating Temperature, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC10F322-I/MC
✅ Remplacement direct✓ En stock
$0.52 / unité
Voir la fiche technique →PIC10F322T-E/MC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC10F320-E/MC
✅ Remplacement direct✓ En stock
$0.49 / unité
Voir la fiche technique →PIC10F320-I/MC
✅ Remplacement direct✓ En stock
$0.26 / unité
Voir la fiche technique →PIC10F200-E/MC
✅ Remplacement direct✓ En stock
$0.52 / unité
Voir la fiche technique →PIC10F322-E/MC Valeurs maximales et caractéristiques électriques
| Core Architecture | Enhanced Mid-Range 8-bit PIC |
| Program Memory (Flash) | 896 B (512 x 14 words) |
| Data RAM | 64 B |
| CPU Speed | 16 MHz (4 MHz instruction rate) |
| Operating Voltage | 2.3 V to 5.5 V |
| I/O Pins | 4 |
| ADC | 8-bit, up to 4 channels |
| PWM | Yes (10-bit PWM) |
| Peripherals | CLC, NCO, CWG, PWM, Temperature Indicator |
| Internal Oscillator | 16 MHz HF, 31 kHz LF |
| Boîtier | 8-DFN (2x3 mm) |
| Température de fonctionnement | -40 C to +125 C (E = Extended) |
| Programming Method | ICSP (In-Circuit Serial Programming) |
| Instruction Set | 49 instructions, 16-level stack |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC10F322-E/MC
| Broche 1 | VDD — Positive supply voltage (2.3V to 5.5V) |
| Broche 2 | RA5 — Bidirectional I/O / ADC channel |
| Broche 3 | RA4 — Bidirectional I/O / ADC channel |
| Broche 4 | RA3/MCLR/VPP — Input only / Master Clear reset / ICSP programming voltage |
| Broche 5 | RA2 — Bidirectional I/O / ADC channel |
| Broche 6 | RA1/ICSPCLK — Bidirectional I/O / ICSP clock |
| Broche 7 | RA0/ICSPDAT — Bidirectional I/O / ICSP data |
| Broche 8 | VSS — Ground reference |
Applications typiques
PIC10F322-E/MC convient pour 6 applications: IoT Edge Sensor Nodes, Consumer Remote Controls, LED Lighting Controllers, Battery-Powered Wearables, Toys and Hobby Electronics, Industrial Sensor Transmitters.
IoT Edge Sensor Nodes
The PIC10F322-E/MC fits IoT edge sensor nodes because it integrates an 8-bit ADC, temperature indicator, and core-independent peripherals in a 2x3 mm DFN package. The 16 MHz CPU samples up to 4 analog channels while the CLC and NCO handle signal conditioning without CPU wake-up. Power budget: 2.3-5.5V VDD allows direct 3V coin-cell operation, with sleep current under 1 uA for years of battery life. Pair with a low-power radio module via RA0/RA1 GPIO; firmware fits in 896 B Flash with state-machine logic for periodic wake-and-transmit.
Recommandé
Consumer Remote Controls
The PIC10F322-E/MC is well-suited for IR remote controls because the CWG (Complementary Waveform Generator) can produce 38 kHz carrier modulation for IR LEDs while the CPU remains asleep. The 16 MHz internal oscillator and 4 I/O pins cover button matrix scanning, IR transmit, and LED indicator drive. Wide VDD (2.3-5.5V) lets designers use 2xAAA or coin-cell batteries. Estimated IR transmission current draw is under 5 mA average, enabling multi-year battery life in TV/STB remote designs.
Recommandé
LED Lighting Controllers
For LED lighting controllers, the PIC10F322-E/MC's 10-bit PWM peripheral combined with CLC and CWG enables smooth dimming and color-mixing without CPU intervention. The 4 I/O pins drive RGB or RGBW channels, with the 16 MHz CPU providing sufficient bandwidth for protocol decoding (DMX, Zigbee, BLE control inputs). The 2.3-5.5V VDD range supports direct Li-ion or USB-powered LED strips. The NCO can synthesize precise frequency-multiply PWM for flicker-free high-resolution dimming above 1 kHz.
Recommandé
Battery-Powered Wearables
Wearable devices benefit from the PIC10F322-E/MC's tiny 2x3 mm DFN footprint and ultra-low sleep current. The temperature indicator and 8-bit ADC monitor skin or ambient temperature while the CLC handles haptic feedback patterns in hardware. 2.3V minimum VDD allows direct CR2032 coin-cell drive (3.0V nominal) with brown-out detect. The 16 MHz CPU wakes on interrupt, processes sensor data, and returns to sleep in microseconds, extending battery life to months. The 4 I/O pins connect to a sensor, an LED, and a button.
Recommandé
Toys and Hobby Electronics
Toy and hobby designs leverage the PIC10F322-E/MC for low-cost motor and sound control in 2x3 mm packaging. The CWG drives half-bridge motor drivers, the PWM modulates hobby servos at 50 Hz, and the 8-bit ADC reads analog sensors (line-follow, light, position). With 896 B Flash, designers can implement state-machine firmware for line-following robots or animatronic toys. VDD 2.3-5.5V allows direct 3-AA or Li-ion battery operation. LCSC volume pricing makes the part attractive for cost-sensitive consumer toys.
Recommandé
Industrial Sensor Transmitters
Industrial 4-20 mA sensor transmitters and loop-powered metering benefit from the PIC10F322-E/MC's extended -40 to +125 C temperature range (E suffix) and on-chip temperature indicator for cold-junction compensation. The 8-bit ADC digitizes bridge sensors, thermocouples, or 4-20 mA loop currents while the NCO generates precision PWM for DAC output. Wide 2.3-5.5V VDD supports loop-powered designs down to 3V. The 8-DFN package enables miniaturized field-mount transmitters where PCB space is at a premium in IP67 enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC10F322-E/MC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC10F322-I/MC | PIC10F322T-E/MC | PIC10F320-E/MC | PIC10F320-I/MC | PIC10F200-E/MC |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 8-DFN (2x3 mm) | 8-DFN (2x3 mm) - same | 8-DFN (2x3 mm) - same | 8-DFN (2x3 mm) - same | 8-DFN (2x3 mm) - same | 8-DFN (2x3 mm) - same |
| Program Memory | 896 B Flash | 896 B Flash | 896 B Flash | 448 B Flash (-50%) | 448 B Flash (-50%) | 256 B Flash (-71%) |
| Data RAM | 64 B | 64 B | 64 B | 32 B (-50%) | 32 B (-50%) | 16 B (-75%) |
| CPU Speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 4 MHz |
| ADC | 8-bit, 4 ch | 8-bit, 4 ch | 8-bit, 4 ch | 8-bit, 3 ch | 8-bit, 3 ch | No ADC |
| PWM | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | No PWM |
| CIP Peripherals (CLC/NCO/CWG) | Yes (all three) | Yes (all three) | Yes (all three) | Yes (all three) | Yes (all three) | None (legacy core) |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) |
Principaux différenciateurs
- Integrated CIP peripherals in 6/8-pin footprint (vs PIC10F200-E/MC)
- Doubled program memory vs PIC10F320 (vs PIC10F320-E/MC)
- Extended -40C to +125C temperature range (vs PIC10F322-I/MC)
Notes de conception
The 8-DFN package has an exposed thermal pad on the underside that MUST be soldered to the PCB ground plane for both mechanical reliability (preventing package cracking under thermal stress) and thermal dissipation. Use a land pattern with at least 8 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting the central pad to an internal ground plane. Estimated: at 16 MHz with peripherals active, power dissipation is approximately 8 mA * 3.3V = 26 mW, well within the 2x3 mm package's thermal capability at 25 C ambient, but solder pad connection is still critical.
Pin 4 (RA3/MCLR/VPP) is input-only - it cannot be used as a digital output. Do not connect MCLR externally to VDD through a resistor smaller than 4.7 kOhm, as it can prevent reliable in-circuit serial programming. The ICSP pins (RA0/ICSPDAT and RA1/ICSPCLK) share GPIO functions; if your application uses these pins for I/O, ensure ICSP connector isolation resistors (typically 10 kOhm) are in series to allow programming without disrupting external circuitry.
Decouple VDD with a 100 nF ceramic capacitor placed within 3 mm of the VDD pin (pin 1). For battery-powered designs, place a 10 uF bulk capacitor near the IC to handle transient current during ADC sampling and PWM switching events. The internal voltage regulator requires VDD rise time under specific limits; consult the datasheet 'Power-on Reset' section. Brown-out Reset (BOR) should be enabled with a threshold just below minimum operating VDD (e.g., 2.1V for 2.3V minimum) to prevent code execution at indeterminate voltages.
Route the ICSP signals (RA0/ICSPDAT, RA1/ICSPCLK) as short as possible if in-circuit programming is required in production. Keep analog signals (RA2, RA4, RA5) away from RA0/RA1 digital signals to minimize crosstalk on the ADC. The internal 16 MHz oscillator accuracy is approximately +/- 2% after calibration; for applications requiring UART or precision timing, use the LFINTOSC (31 kHz) calibration register or external crystal if your variant supports it. The 2x3 mm package should be placed with copper pour on all sides, not solid flood under the package, to maintain DFN solder joint reliability.
Informations de conformité
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - the PIC10F322T-I/MC industrial grade is also not automotive-qualified; consult Microchip for AEC-Q100 variants in PIC16 or PIC18 families. Halogen-free status not explicitly stated in the datasheet and should be confirmed via Microchip environmental compliance documents.
