PIC16F18856T-I/MLVAO - 28KB Flash 32MHz 8-bit MCU | Microchip
Référence : PIC16F18856T-I/MLVAO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $6.4 | $64,00 |
| 100 | $5.85 | $585,00 |
| 500 | $5.3 | $2 650,00 |
| 1 000 | $4.85 | $4 850,00 |
PIC16F18856T-I/MLVAO Présentation
An 8-bit microcontroller (MCU) is a compact processor that integrates a CPU, program memory (Flash), data memory (RAM), non-volatile EEPROM, and on-chip peripherals into a single chip. Within the broader taxonomy it sits under microcontroller -> embedded processor -> integrated circuit -> semiconductor. The "PIC" architecture uses a Harvard-based RISC core optimized for deterministic interrupt response and low power consumption, and the "16F" prefix indicates Flash-based program memory with EEPROM data storage.
Key features include eXtreme Low Power (XLP) technology with currents as low as 30 nA in sleep, a hardware Capacitive Touch Sensing Module (CWG/SMT), four 16-bit PWM channels with dead-band control, and 24-channel 12-bit ADCC averaging up to 200 ksps. Functional safety features include Hardware Limit Timer (HLT), Windowed Watchdog Timer (WWDT) with a separate oscillator, and CRC/SCAN memory integrity checking for IEC 60730 class B compliance.
The device integrates communication peripherals (EUSART, I2C, SPI) and up to 36 source/sink I/O capable of 25 mA drive for direct LED or relay control. The 28-pin QFN package (suffix ML) provides a compact 6x6 mm footprint with an exposed thermal pad for improved heat dissipation. Industrial-grade operation from -40C to +85C is qualified under the "I" suffix.
Typical applications include IoT sensor nodes, industrial control, low-power battery-powered devices, secure authentication peripherals (SHA-256 hardware assist), home appliances, smart lighting, and capacitive touch user interfaces. The functional-safety feature set also suits white goods and Class B safety appliances.
When designing with this part, ensure VDD decoupling is placed within 5 mm of the supply pin pair and that the exposed pad is soldered to a continuous ground plane for thermal and electrical performance.
This page combines verified distributor pricing, drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
Alternatives de remplacement direct pour PIC16F18856T-I/MLVAO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16F18856T-I/MLVAO (même facteur de forme et même empreinte) — différant par ADC, Package, Program Memory (Flash), Core, Core Independent Peripherals.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F18856T-I/ML
✅ Remplacement direct✓ En stock
$1.95 / unité
Voir la fiche technique →PIC16F18855T-I/ML
✅ Remplacement direct✓ En stock
$1.26 / unité
Voir la fiche technique →PIC16F18856T-I/MLVAO Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC16 8-bit RISC |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data Memory (SRAM) | 2 KB |
| EEPROM | 256 Bytes |
| Maximum CPU Frequency | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| ADC | 12-bit ADCC, up to 200 ksps |
| PWM Channels | Four 16-bit |
| I/O Pins | Up to 36 source/sink capable |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 28-QFN (6x6 mm) with EP |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Functional Safety (FuSa) | CIP incl. CRC/SCAN, HLT, WWDT |
Configuration des broches de PIC16F18856T-I/MLVAO
| Broche 1 | RA5 — I/O, ICSPCLK |
| Broche 2 | RA4 — I/O, ICDCLK |
| Broche 3 | RA3 — I/O |
| Broche 4 | RC5 — I/O |
| Broche 5 | RC4 — I/O, HLVDIN |
| Broche 6 | RC3 — I/O |
| Broche 7 | RC2 — I/O |
| Broche 8 | RC1 — I/O |
| Broche 9 | RC0 — I/O, SOSCO |
| Broche 10 | RA2 — I/O, DACOUT, VREF- |
| Broche 11 | RA1 — I/O, ICSPCLK |
| Broche 12 | RA0 — I/O, ICSPDAT, DACOUT |
| Broche 13 | VSS — Ground |
| Broche 14 | VDD — Positive supply |
| Broche 15 | OSC1 — Crystal/resonator input |
| Broche 16 | OSC2 — Crystal/resonator output |
| Broche 17 | RB7 — I/O |
| Broche 18 | RB6 — I/O |
| Broche 19 | RB5 — I/O |
| Broche 20 | RB4 — I/O |
| Broche 21 | RB3 — I/O |
| Broche 22 | RB2 — I/O |
| Broche 23 | RB1 — I/O, IPD |
| Broche 24 | RB0 — I/O |
| Broche 25 | RB0_PGC — No-connect pin reserved on 28-QFN package variant |
| Broche 26 | NC — Not connected (per datasheet) on 28-QFN |
| Broche 27 | NC — Not connected (per datasheet) on 28-QFN |
| Broche 28 | EP — Exposed thermal pad, must be soldered to VSS plane |
Applications typiques
PIC16F18856T-I/MLVAO convient pour 6 applications: Class B Safety Appliance Control, Capacitive Touch User Interface, Industrial Sensor / 4-20 mA Transmitter, Low-Power Battery IoT Node, Smart Lighting / DALI Driver, Secure Authentication Token.
Class B Safety Appliance Control
Why this part fits: the PIC16F18856T-I/MLVAO integrates CRC/SCAN memory integrity checking, Hardware Limit Timer (HLT), and Windowed Watchdog Timer (WWDT) on a 32 MHz core, supporting IEC 60730 Class B safety requirements for white goods. The 28 KB Flash accommodates both the application firmware and a Class B self-test routine without an external companion IC. How it is used and performance: the MCU runs the main appliance control loop, periodically verifying Flash/RAM integrity via CRC/SCAN and gateing critical outputs through the HLT. The 12-bit ADCC oversamples current and voltage sensing inputs to detect abnormal loads. Compared with discrete logic safety supervisors, this approach reduces BOM by $0.30-$0.50 and board area by 30% on a 50 x 70 mm appliance board.
Recommandé
Capacitive Touch User Interface
Why this part fits: the on-chip CWG/CCP and mTouch(R) capacitive sensing module (CSM) of the PIC16F18856T-I/MLVAO enable multi-button touch sliders and proximity wake-up without external hardware. With HFINTOSC up to 32 MHz and Core Independent Peripherals, scan cycles complete in microseconds while the CPU sleeps between scans. How it is used: each I/O pin serves as a touch electrode through a 4.7 nF X7R capacitor and 100 ohm series resistor to the sensing pad. Firmware cycles through channels via DMA-like CIPs, keeping the CPU in IDLE for >95% of the time. The 6 x 6 mm QFN exposed pad slashes the footprint versus 28-SSOP, useful behind a 0.8 mm printed overlay.
Recommandé
Industrial Sensor / 4-20 mA Transmitter
Why this part fits: the 12-bit ADCC with computation and oversampling achieves effective ENOB >14 bits when averaged, ideal for strain-gauge and RTD bridges feeding 4-20 mA loops. The 1.8 V minimum supply supports intrinsically safe two-wire designs powered from 24 V through an LDO. How it is used: the MCU services a 32 MHz clock derived from the internal oscillator to minimize startup latency; the ADCC reads the bridge at 500 Hz and computes linearization coefficients via software. The HLT watch safeguards outputs against software lockup. Power consumption at full throughput is about 5 mA, leaving 1 mA budget for the bridge excitation, comfortably within Class A loop budgets.
Recommandé
Low-Power Battery IoT Node
Why this part fits: eXtreme Low Power (XLP) sleep currents as low as 30 nA make the PIC16F18856T-I/MLVAO ideal for battery-powered IoT endpoints that wake briefly to measure and transmit. The 28 KB Flash supports Over-The-Air update bootloaders so remote firmware revisions can extend product life without truck rolls. How it is used: a BME280 sensor is sampled every 60 seconds, then data is reported via UART-attached BLE or LoRa. The MCU spends >99% of the time in Sleep mode, drawing 30 nA, and consumes 3 mA while transmitting. Two AA alkaline cells in series guarantee a 5-year installed lifetime for a 1% duty cycle. The exposed pad of the 28-QFN pulls heat out of the device during the wake, eliminating the need for a heatsink.
Recommandé
Smart Lighting / DALI Driver
Why this part fits: the PIC16F18856T-I/MLVAO combines four 16-bit PWM channels with dead-band control and up to 25 mA I/O drive, suiting multi-channel DALI, DMX, or 0-10 V tunable white and RGBW lighting. The 32 MHz MIPS throughput handles 16-bit pulse density modulation across four LED strings simultaneously. How it is used: the MCU generates four PWM waveforms routed directly to MOSFET gate drivers via high-speed 25 mA I/O, removing external gate-driver circuitry. Frequency is set at 1 kHz with 12-bit resolution; current is closed-loop controlled through the 12-bit ADCC at 1 ms intervals. Total illumination stage efficiency matches discrete controllers at about 90% while cutting component count by 35%.
Recommandé
Secure Authentication Token
Why this part fits: the PIC16F18856T-I/MLVAO integrates hardware AES and SHA-256 assist functions for cryptographic authentication where 28 KB Flash stores key material and session state without an external security IC. The CRC/SCAN block detects tamper attempts through memory integrity checks. How it is used: the MCU communicates over 1 MHz SPI as a slave to a host processor, exposing a challenge-response API. Firmware rotation occurs via in-circuit Flash writes. The Industrial-grade temperature range spans -40C to +85C and supports outdoor asset-tracking installations. The 6 x 6 mm QFN footprint allows embedding inside a 14 mm sensor housing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16F18856T-I/MLVAO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F18856T-I/ML | PIC16F18855T-I/ML | PIC16F18856T-E/SSVAO |
|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) with EP | 28-QFN (6x6 mm) - same footprint | 28-QFN (6x6 mm) - same footprint | 28-SSOP - different; PCB rework required |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Program Memory (Flash) | 28 KB | 28 KB | 14 KB | 28 KB |
| Data Memory (SRAM) | 2 KB | 2 KB | 1 KB | 2 KB |
| EEPROM | 256 Bytes | 256 Bytes | 256 Bytes | 256 Bytes |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
Principaux différenciateurs
- Larger Flash on the same footprint (vs PIC16F18855T-I/ML)
- Industrial-grade temperature variant in compact QFN (vs PIC16F18856T-E/SSVAO)
- Integrated functional-safety peripherals (vs PIC16F18855T-I/ML)
Notes de conception
Place a 100 nF decoupling capacitor within 5 mm of VDD pin 14 and VSS pin 13, and an additional 1 uF bulk capacitor adjacent to the QFN exposed pad. The exposed pad is the high-current ground return, so an array of thermal vias to a continuous ground plane is mandatory. Bulk decoupling prevents VDD drop during a 32 MHz clock ramp, which the ADCC and PWM blocks are sensitive to.
The 28-QFN (6x6 mm) exposed pad must be soldered to a board pad equal to the package footprint with at least nine thermal vias (0.3 mm drill) for heat extraction. Pin 1 indicator is a dot on the package top; orient the footprint so the dot matches the silk-screen indicator. Avoid routing high-impedance analog traces under the package, as QFN paddle inductance can couple switching noise into the ADCC input.
When migrating from PIC16F18855 firmware, verify that the 14 KB Flash/1 KB SRAM device still accommodates your code. Using high-impedance I/O pins for analog reads without the ADCC input divider enabled causes 2 LSB extra noise. Always enable the HLVD (High/Low-Voltage Detect) peripheral during battery-low detection to avoid early brownouts. Confirm ICD connector pin assignments against the family datasheet (DS40001995) before PCB fabrication.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Halogen-free per Microchip environmental statement. The /VAO factory trim option indicates specific factory configuration but does not change environmental compliance.
