PIC16F18856T-I/MLVAO - 28KB Flash 32MHz 8-bit MCU | Microchip
MPN: PIC16F18856T-I/MLVAO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.95 | $6.95 |
| 10 | $6.4 | $64.00 |
| 100 | $5.85 | $585.00 |
| 500 | $5.3 | $2,650.00 |
| 1,000 | $4.85 | $4,850.00 |
PIC16F18856T-I/MLVAO Overview
An 8-bit microcontroller (MCU) is a compact processor that integrates a CPU, program memory (Flash), data memory (RAM), non-volatile EEPROM, and on-chip peripherals into a single chip. Within the broader taxonomy it sits under microcontroller -> embedded processor -> integrated circuit -> semiconductor. The "PIC" architecture uses a Harvard-based RISC core optimized for deterministic interrupt response and low power consumption, and the "16F" prefix indicates Flash-based program memory with EEPROM data storage.
Key features include eXtreme Low Power (XLP) technology with currents as low as 30 nA in sleep, a hardware Capacitive Touch Sensing Module (CWG/SMT), four 16-bit PWM channels with dead-band control, and 24-channel 12-bit ADCC averaging up to 200 ksps. Functional safety features include Hardware Limit Timer (HLT), Windowed Watchdog Timer (WWDT) with a separate oscillator, and CRC/SCAN memory integrity checking for IEC 60730 class B compliance.
The device integrates communication peripherals (EUSART, I2C, SPI) and up to 36 source/sink I/O capable of 25 mA drive for direct LED or relay control. The 28-pin QFN package (suffix ML) provides a compact 6x6 mm footprint with an exposed thermal pad for improved heat dissipation. Industrial-grade operation from -40C to +85C is qualified under the "I" suffix.
Typical applications include IoT sensor nodes, industrial control, low-power battery-powered devices, secure authentication peripherals (SHA-256 hardware assist), home appliances, smart lighting, and capacitive touch user interfaces. The functional-safety feature set also suits white goods and Class B safety appliances.
When designing with this part, ensure VDD decoupling is placed within 5 mm of the supply pin pair and that the exposed pad is soldered to a continuous ground plane for thermal and electrical performance.
This page combines verified distributor pricing, drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
Drop-in alternatives for PIC16F18856T-I/MLVAO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F18856T-I/MLVAO (same form factor and footprint) — differing in ADC, I/O Pins, Package, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F18856T-I/ML
✅ Drop-In✓ In Stock
$1.95 / Unit
View Datasheet →PIC16F18855T-I/ML
✅ Drop-In✓ In Stock
$1.26 / Unit
View Datasheet →PIC16F18856T-I/MLVAO Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC16 8-bit RISC |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data Memory (SRAM) | 2 KB |
| EEPROM | 256 Bytes |
| Maximum CPU Frequency | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| ADC | 12-bit ADCC, up to 200 ksps |
| PWM Channels | Four 16-bit |
| I/O Pins | Up to 36 source/sink capable |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 28-QFN (6x6 mm) with EP |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Functional Safety (FuSa) | CIP incl. CRC/SCAN, HLT, WWDT |
PIC16F18856T-I/MLVAO Pin Configuration
| Pin 1 | RA5 — I/O, ICSPCLK |
| Pin 2 | RA4 — I/O, ICDCLK |
| Pin 3 | RA3 — I/O |
| Pin 4 | RC5 — I/O |
| Pin 5 | RC4 — I/O, HLVDIN |
| Pin 6 | RC3 — I/O |
| Pin 7 | RC2 — I/O |
| Pin 8 | RC1 — I/O |
| Pin 9 | RC0 — I/O, SOSCO |
| Pin 10 | RA2 — I/O, DACOUT, VREF- |
| Pin 11 | RA1 — I/O, ICSPCLK |
| Pin 12 | RA0 — I/O, ICSPDAT, DACOUT |
| Pin 13 | VSS — Ground |
| Pin 14 | VDD — Positive supply |
| Pin 15 | OSC1 — Crystal/resonator input |
| Pin 16 | OSC2 — Crystal/resonator output |
| Pin 17 | RB7 — I/O |
| Pin 18 | RB6 — I/O |
| Pin 19 | RB5 — I/O |
| Pin 20 | RB4 — I/O |
| Pin 21 | RB3 — I/O |
| Pin 22 | RB2 — I/O |
| Pin 23 | RB1 — I/O, IPD |
| Pin 24 | RB0 — I/O |
| Pin 25 | RB0_PGC — No-connect pin reserved on 28-QFN package variant |
| Pin 26 | NC — Not connected (per datasheet) on 28-QFN |
| Pin 27 | NC — Not connected (per datasheet) on 28-QFN |
| Pin 28 | EP — Exposed thermal pad, must be soldered to VSS plane |
Typical Applications
PIC16F18856T-I/MLVAO is suitable for 6 applications: Class B Safety Appliance Control, Capacitive Touch User Interface, Industrial Sensor / 4-20 mA Transmitter, Low-Power Battery IoT Node, Smart Lighting / DALI Driver, Secure Authentication Token.
Class B Safety Appliance Control
Why this part fits: the PIC16F18856T-I/MLVAO integrates CRC/SCAN memory integrity checking, Hardware Limit Timer (HLT), and Windowed Watchdog Timer (WWDT) on a 32 MHz core, supporting IEC 60730 Class B safety requirements for white goods. The 28 KB Flash accommodates both the application firmware and a Class B self-test routine without an external companion IC. How it is used and performance: the MCU runs the main appliance control loop, periodically verifying Flash/RAM integrity via CRC/SCAN and gateing critical outputs through the HLT. The 12-bit ADCC oversamples current and voltage sensing inputs to detect abnormal loads. Compared with discrete logic safety supervisors, this approach reduces BOM by $0.30-$0.50 and board area by 30% on a 50 x 70 mm appliance board.
Recommended
Capacitive Touch User Interface
Why this part fits: the on-chip CWG/CCP and mTouch(R) capacitive sensing module (CSM) of the PIC16F18856T-I/MLVAO enable multi-button touch sliders and proximity wake-up without external hardware. With HFINTOSC up to 32 MHz and Core Independent Peripherals, scan cycles complete in microseconds while the CPU sleeps between scans. How it is used: each I/O pin serves as a touch electrode through a 4.7 nF X7R capacitor and 100 ohm series resistor to the sensing pad. Firmware cycles through channels via DMA-like CIPs, keeping the CPU in IDLE for >95% of the time. The 6 x 6 mm QFN exposed pad slashes the footprint versus 28-SSOP, useful behind a 0.8 mm printed overlay.
Recommended
Industrial Sensor / 4-20 mA Transmitter
Why this part fits: the 12-bit ADCC with computation and oversampling achieves effective ENOB >14 bits when averaged, ideal for strain-gauge and RTD bridges feeding 4-20 mA loops. The 1.8 V minimum supply supports intrinsically safe two-wire designs powered from 24 V through an LDO. How it is used: the MCU services a 32 MHz clock derived from the internal oscillator to minimize startup latency; the ADCC reads the bridge at 500 Hz and computes linearization coefficients via software. The HLT watch safeguards outputs against software lockup. Power consumption at full throughput is about 5 mA, leaving 1 mA budget for the bridge excitation, comfortably within Class A loop budgets.
Recommended
Low-Power Battery IoT Node
Why this part fits: eXtreme Low Power (XLP) sleep currents as low as 30 nA make the PIC16F18856T-I/MLVAO ideal for battery-powered IoT endpoints that wake briefly to measure and transmit. The 28 KB Flash supports Over-The-Air update bootloaders so remote firmware revisions can extend product life without truck rolls. How it is used: a BME280 sensor is sampled every 60 seconds, then data is reported via UART-attached BLE or LoRa. The MCU spends >99% of the time in Sleep mode, drawing 30 nA, and consumes 3 mA while transmitting. Two AA alkaline cells in series guarantee a 5-year installed lifetime for a 1% duty cycle. The exposed pad of the 28-QFN pulls heat out of the device during the wake, eliminating the need for a heatsink.
Recommended
Smart Lighting / DALI Driver
Why this part fits: the PIC16F18856T-I/MLVAO combines four 16-bit PWM channels with dead-band control and up to 25 mA I/O drive, suiting multi-channel DALI, DMX, or 0-10 V tunable white and RGBW lighting. The 32 MHz MIPS throughput handles 16-bit pulse density modulation across four LED strings simultaneously. How it is used: the MCU generates four PWM waveforms routed directly to MOSFET gate drivers via high-speed 25 mA I/O, removing external gate-driver circuitry. Frequency is set at 1 kHz with 12-bit resolution; current is closed-loop controlled through the 12-bit ADCC at 1 ms intervals. Total illumination stage efficiency matches discrete controllers at about 90% while cutting component count by 35%.
Recommended
Secure Authentication Token
Why this part fits: the PIC16F18856T-I/MLVAO integrates hardware AES and SHA-256 assist functions for cryptographic authentication where 28 KB Flash stores key material and session state without an external security IC. The CRC/SCAN block detects tamper attempts through memory integrity checks. How it is used: the MCU communicates over 1 MHz SPI as a slave to a host processor, exposing a challenge-response API. Firmware rotation occurs via in-circuit Flash writes. The Industrial-grade temperature range spans -40C to +85C and supports outdoor asset-tracking installations. The 6 x 6 mm QFN footprint allows embedding inside a 14 mm sensor housing.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F18856T-I/MLVAO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F18856T-I/ML | PIC16F18855T-I/ML | PIC16F18856T-E/SSVAO |
|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) with EP | 28-QFN (6x6 mm) - same footprint | 28-QFN (6x6 mm) - same footprint | 28-SSOP - different; PCB rework required |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Program Memory (Flash) | 28 KB | 28 KB | 14 KB | 28 KB |
| Data Memory (SRAM) | 2 KB | 2 KB | 1 KB | 2 KB |
| EEPROM | 256 Bytes | 256 Bytes | 256 Bytes | 256 Bytes |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
Key Differentiators
- Larger Flash on the same footprint (vs PIC16F18855T-I/ML)
- Industrial-grade temperature variant in compact QFN (vs PIC16F18856T-E/SSVAO)
- Integrated functional-safety peripherals (vs PIC16F18855T-I/ML)
Design Notes
Place a 100 nF decoupling capacitor within 5 mm of VDD pin 14 and VSS pin 13, and an additional 1 uF bulk capacitor adjacent to the QFN exposed pad. The exposed pad is the high-current ground return, so an array of thermal vias to a continuous ground plane is mandatory. Bulk decoupling prevents VDD drop during a 32 MHz clock ramp, which the ADCC and PWM blocks are sensitive to.
The 28-QFN (6x6 mm) exposed pad must be soldered to a board pad equal to the package footprint with at least nine thermal vias (0.3 mm drill) for heat extraction. Pin 1 indicator is a dot on the package top; orient the footprint so the dot matches the silk-screen indicator. Avoid routing high-impedance analog traces under the package, as QFN paddle inductance can couple switching noise into the ADCC input.
When migrating from PIC16F18855 firmware, verify that the 14 KB Flash/1 KB SRAM device still accommodates your code. Using high-impedance I/O pins for analog reads without the ADCC input divider enabled causes 2 LSB extra noise. Always enable the HLVD (High/Low-Voltage Detect) peripheral during battery-low detection to avoid early brownouts. Confirm ICD connector pin assignments against the family datasheet (DS40001995) before PCB fabrication.
Compliance Information
RoHS and REACH compliant per Microchip product page. Halogen-free per Microchip environmental statement. The /VAO factory trim option indicates specific factory configuration but does not change environmental compliance.
