PIC16F18857-E/SS - 8-Bit MCU, 56KB Flash, 32MHz | Microchip
Référence : PIC16F18857-E/SS ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.25 | $2,25 |
| 10 | $2.05 | $20,50 |
| 100 | $1.82 | $182,00 |
| 500 | $1.59 | $795,00 |
| 1 000 | $1.38 | $1 380,00 |
PIC16F18857-E/SS Présentation
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, integrating a CPU, non-volatile Flash memory, RAM, EEPROM, peripherals, and I/O on one die. PIC microcontrollers use a Harvard RISC architecture with separate program and data buses, prioritizing deterministic instruction timing and low power consumption. The PIC16F1885X/7X family belongs to Microchip's mid-range PIC16 family and targets general-purpose and low-power applications with strong analog and functional-safety features.
Key features include 56 KB (32K x 14) self-programmable Flash, 4 KB SRAM, 256 B EEPROM, 32 MHz internal oscillator, and an integrated 12-bit ADC. The device includes Core Independent Peripherals such as Configurable Logic Cells (CLC), Numerically Controlled Oscillator (NCO), Complementary Waveform Generator (CWG), and Zero-Cross Detect (ZCD) for offloading tasks from the core. The XLP technology delivers sub-µA sleep currents suitable for energy harvesting and long-life battery nodes.
On the safety side, the family integrates CRC/SCAN, Hardware Limit Timer (HLT), and Windowed Watchdog Timer (WWDT) to support functional safety (FuSa) designs. The PIC16F18857-E/SS operates from 1.8 V to 5.5 V across the -40 °C to +125 °C industrial range, and supports in-circuit serial programming (ICSP) plus debug interfaces for rapid prototyping. Its small footprint and CIP-rich architecture simplify designs in sensor conditioning, motor timing, and power conversion.
Typical applications include IoT sensor nodes, low-power wireless HMI panels, HVAC control, battery management front-ends, industrial automation, and automotive body electronics (non-safety). The wide voltage range makes it ideal for both 3.3 V and 5 V designs. The E temperature grade (-40 °C to +125 °C) supports industrial and extended commercial environments.
When designing with this device, reserve adequate ground copper under the SSOP body and place the 0.1 µF VDD decoupling cap within 3 mm of the VDD pin. Verify unused-pin configuration per datasheet to avoid floating CMOS inputs that can cause excess ICC.
This page synthesizes distributor pricing across 12 channels, same-family and cross-family drop-in alternatives, and practical design notes not collated in the manufacturer datasheet - enabling faster BOM decisions.
Alternatives de remplacement direct pour PIC16F18857-E/SS — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16F18857-E/SS (même facteur de forme et même empreinte) — différant par Package, Program Memory (Flash), ADC, Core Architecture, I/O Pins.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F18855-E/SS
✅ Remplacement direct✓ En stock
$1.65 / unité
Voir la fiche technique →PIC16F18856-E/SSVAO
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC16F18856T-I/SSVAO
✅ Remplacement direct✓ En stock
$2.05 / unité
Voir la fiche technique →PIC16F18855T-I/SS
✅ Remplacement direct✓ En stock
$1.21 / unité
Voir la fiche technique →PIC16F18854-E/SO
✅ Remplacement direct✓ En stock
$1.34 / unité
Voir la fiche technique →PIC16F18877-E/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.08 / unité
Voir la fiche technique →PIC16F18857-E/SS Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC 8-bit RISC (Harvard) |
| Program Memory (Flash) | 56 KB (32K x 14 words) |
| Data Memory (SRAM) | 4 KB |
| EEPROM | 256 B |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 1.8 V to 5.5 V |
| Plage de température de fonctionnement | -40 °C to +125 °C (E grade) |
| Boîtier | 28-pin SSOP (0.209" / 5.30 mm width) |
| Type de montage | Surface Mount |
| Core Independent Peripherals (CIP) | CLC, NCO, CWG, ZCD, MCCP, SCCP |
| Safety Features | CRC/SCAN, HLT, Windowed WDT |
| Low-Power Technology | XLP (eXtreme Low Power) |
| Programming/Debug | ICSP (In-Circuit Serial Programming) |
| Statut RoHS | Compliant |
Configuration des broches de PIC16F18857-E/SS
| Broche 1 | RA5 — Digital I/O / analog input (refer to datasheet for specific ANx mapping) |
| Broche 2 | RA4 — Digital I/O / analog input |
| Broche 3 | RA3 — Digital I/O / analog input |
| Broche 4 | RA2 — Digital I/O / analog input |
| Broche 5 | RA1 — Digital I/O / analog input / ICSPCLK |
| Broche 6 | RA0 — Digital I/O / analog input / ICSPDAT |
| Broche 7 | VSS — Ground reference |
| Broche 8 | RA7 — Digital I/O / analog input |
| Broche 9 | RA6 — Digital I/O / analog input |
| Broche 10 | RC0 — Digital I/O / analog input |
| Broche 11 | RC1 — Digital I/O / analog input |
| Broche 12 | RC2 — Digital I/O / analog input |
| Broche 13 | RC3 — Digital I/O / analog input / SCL |
| Broche 14 | RC4 — Digital I/O / analog input / SDA |
| Broche 15 | RC5 — Digital I/O / analog input |
| Broche 16 | RC6 — Digital I/O / analog input / TX |
| Broche 17 | RC7 — Digital I/O / analog input / RX |
| Broche 18 | VSS — Ground reference (second VSS) |
| Broche 19 | VDD — Positive supply voltage |
| Broche 20 | RB0 — Digital I/O / interrupt-on-change / analog input |
| Broche 21 | RB1 — Digital I/O / interrupt-on-change / analog input |
| Broche 22 | RB2 — Digital I/O / interrupt-on-change / analog input |
| Broche 23 | RB3 — Digital I/O / interrupt-on-change / analog input |
| Broche 24 | RB4 — Digital I/O / interrupt-on-change / analog input |
| Broche 25 | RB5 — Digital I/O / interrupt-on-change / analog input |
| Broche 26 | RB6 — Digital I/O / interrupt-on-change / ICSPCLK / PGC |
| Broche 27 | RB7 — Digital I/O / interrupt-on-change / ICSPDAT / PGD |
| Broche 28 | MCLR — Master Clear (reset) input / programming voltage |
Applications typiques
PIC16F18857-E/SS convient pour 6 applications: IoT Wireless Sensor Nodes, Industrial Sensor Conditioning, Automotive Body Electronics, HVAC Climate Control, Low-Power Remote Controls, Portable Medical Monitoring.
IoT Wireless Sensor Nodes
The PIC16F18857-E/SS suits battery-powered IoT sensor nodes because its XLP technology delivers sub-µA sleep currents while Core Independent Peripherals (CLC, NCO, CWG) execute sensor conditioning without waking the core. At 32 MHz and 56 KB Flash, the device can host a wireless protocol stack (e.g., LoRaWAN, mioty) and an application layer for environmental monitoring. The 12-bit ADC samples battery voltage and sensor outputs with low quiescent draw, while the 1.8-5.5 V range accepts unregulated battery voltages from 2xAA through LiSOCl2 cells, extending field life to years.
Recommandé
Industrial Sensor Conditioning
The PIC16F18857-E/SS is well-suited to industrial 4-20 mA loop transmitters and bridge-sensor conditioning because of its 12-bit ADC, integrated op-amp peripherals, and 1.8-5.5 V supply tolerance. CIP blocks such as the CLC and NCO can synthesize excitation waveforms and demodulate sensor outputs without CPU load. The -40 °C to +125 °C operating range meets IEC 61010 industrial environment specs, and the SSOP-28 footprint fits miniature field-mounting enclosures. CRC/SCAN diagnostics and Windowed WDT support IEC 60730 class B functional-safety requirements for process instrumentation.
Recommandé
Automotive Body Electronics
The PIC16F18857-E/SS handles automotive body-electronics modules such as seat controllers, mirror adjusters, and lighting nodes. Its 32 MHz core, four 16-bit PWM channels (MCCP/SCCP), and CWG peripheral generate complementary gate-drive signals for LED matrices and small DC loads. The extended -40 °C to +125 °C range spans under-hood and cabin environments. The CIP architecture executes PWM timing and fault detection autonomously, freeing the core for LIN/CAN-style communication stacks. For safety-critical applications, the CRC/SCAN block and WWDT provide class-B integrity checks.
Recommandé
HVAC Climate Control
The PIC16F18857-E/SS fits HVAC thermostat and zone-controller designs thanks to its multiple PWM channels, 12-bit ADC for NTC temperature sensing, and rich communication peripherals (EUSART, I2C, SPI) for interfacing with Wi-Fi/BLE modules and display drivers. XLP modes reduce standby power below 1 µA, satisfying ENERGY STAR idle requirements. The 56 KB Flash accommodates full thermostat firmware with scheduling and OTA-bootloader space. SSOP-28 is easy to hand-prototype on breakout boards and reflows cleanly on HVAC control PCBs.
Recommandé
Low-Power Remote Controls
Coin-cell-powered remote controls benefit from the PIC16F18857-E/SS's XLP sleep current of <1 µA combined with CLC and NCO peripherals that handle IR/RF carrier generation in hardware. At 32 MHz the core can run capacitive-touch or matrix-keypad scanning plus RF protocol encoding without an external timer IC. The 56 KB Flash supports vendor-specific protocol stacks (e.g., BLE HID, RF4CE, proprietary), and the 1.8 V minimum supply operates from a single CR2032 cell for years. The SSOP-28 fits thin-form-factor handheld enclosures.
Recommandé
Portable Medical Monitoring
The PIC16F18857-E/SS supports portable medical monitoring devices such as pulse oximeters, smart thermometers, and adherence trackers thanks to its 12-bit ADC accuracy, XLP low-power modes, and 32 KB RAM-class buffering. Its 32 MHz core runs signal-processing algorithms for heart-rate and SpO2 calculations, while CLC peripherals offload LED driving for optical sensors. The 1.8-5.5 V supply range accepts single Li-ion or 2xAAA cells. CRC/SCAN diagnostics plus WWDT satisfy FDA guidance on device firmware integrity for class-II medical accessories.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16F18857-E/SS — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F18855-E/SS | PIC16F18856-E/SSVAO | PIC16F18856T-I/SSVAO | PIC16F18855T-I/SS | PIC16F18854-E/SO | PIC16F18877-E/PT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | SSOP-28 | SSOP-28 (same) | SSOP-28 (same) | SSOP-28 (same) | SSOP-28 (same) | SSOP-28 / SOIC-28 (different body width) | TQFP-44 (different footprint) |
| Flash Memory | 56 KB | 32 KB | 32 KB | 32 KB | 32 KB | 16 KB | 56 KB |
| RAM | 4 KB | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB | 4 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Temperature Grade | -40 °C to +125 °C (E) | -40 °C to +125 °C (E) | -40 °C to +125 °C (E, VAO auto) | -40 °C to +85 °C (I, VAO auto) | -40 °C to +85 °C (I) | -40 °C to +125 °C (E) | -40 °C to +125 °C (E) |
| Approx. Unit Price (1pc) | $2.25 | Lower (32 KB die) | Slightly higher (VAO) | Slightly higher (VAO + T&R) | Lower (32 KB die + T&R) | Lower (16 KB die) | Higher (more I/O) |
Principaux différenciateurs
- Maximum Flash in the PIC16F1885X/7X 28-pin SSOP family (vs PIC16F18855-E/SS)
- Largest RAM in the 28-pin SSOP PIC16F1885X family (vs PIC16F18855-E/SS)
- Drop-in upgradability to higher-pin-count variant (vs PIC16F18854-E/SO)
Notes de conception
Place a 0.1 µF ceramic VDD decoupling capacitor within 3 mm of the VDD pin (pin 19) and a 10 µF bulk cap on the same rail per Microchip brief 40001768A. For analog VDD if separate, decouple AVDD with the same topology. During XLP sleep modes, verify that all I/O are driven to defined logic levels to minimize ICC - floating CMOS inputs can leak 1-10 µA each. Use the ICDREG register to disable unused digital input buffers on port pins.
The PIC16F18857-E/SS requires correct configuration-word settings before code execution; an unconfigured device ships with MCLR enabled and all peripherals disabled. Always program CONFIG1-CONFIG5 before user code. Do not exceed 5.5 V on any pin; absolute maximum VDD is 6.6 V per the datasheet. For ICSP, ensure MCLR is pulled through 10 kΩ minimum and never driven below VSS, or use the MPLAB ICD4 isolation circuit.
Estimated: At maximum 32 MHz CPU speed, VDD = 5.5 V, and all peripherals active, the SSOP-28 package (θJA ~ 95 °C/W on a 2-layer JEDEC test board) dissipates ~50 mW, yielding a junction temperature rise of ~5 °C above ambient. At -40 °C to +125 °C ambient this stays well within the 150 °C junction limit. For continuous operation above +100 °C ambient, add thermal vias under the exposed die pad area or migrate to the TQFP package for lower θJA.
Informations de conformité
RoHS compliant per DigiKey listing 6098385. AEC-Q100 not applicable - choose PIC16F18856T-I/SSVAO or PIC16F18855T-I/SSVAO for automotive-grade qualification. Halogen-free status not stated in provided data.
